Global Low Temperature Co Fired Ceramic Substrate Market Size, Share, Opportunities, And Trends By Type (RF System Level Package, Optoelectronic Package, Array Package, Others), By End-User Industry (Consumer Electronics, Automotive, Aerospace And Military, Telecommunication, Others), And By Geography - Forecasts From 2024 To 2029
- Published : Feb 2024
- Report Code : KSI061611368
- Pages : 114
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The global low temperature co-fired ceramic substrate market is expected to grow at a CAGR of 7.87%, reaching a market size of US$14.756 billion in 2029 from US$8.68 billion in 2022.
Low-temperature co-fired Ceramics (LTCC) are multilayer glass-ceramic substrates that are co-fired with low resistance metal conductors at a low firing temperature (less than 1000°C) such as silver or copper. Electronic components and substrates that are compact, light, and deliver high speed have become popular.
Market Drivers:
- Rising demand from various end-use sectors-
Telecommunications, medical, automotive, industrial, defense, and aerospace are among the end-use industries driving demand for co-fired ceramics. The robust benefits profile that co-fired ceramics have over conventional printed circuit boards in terms of improved thermal stability and the nature of their chemical inactivity is a fundamental factor for these sectors preference for LTCC and HTCC. Increased demand for high-end computing systems and nanotechnology would open up new industry prospects.
Various advantages-
The advantages of LTCC, such as low-loss dielectric materials, ease of integrating embedded passive components, and reliable multilayer capabilities have increased their demand. Ceramic material utilized in LTCC has a lower loss tangent than standard PCB material. These small devices may be made using LTCC at a low cost, which has boosted demand for radiofrequency modules, which are widely used in smartphones, personal computers, portable devices, and AR/VR applications.
- Technical Issue-
Shrinkage-related problems affecting LTCC Performance and the low thermal conductivity of LTCC are expected to stifle the expansion of the Low-Temperature Co-fired ceramics substrate market in the projected period.
Market Segmentation:
By type, the global Low-Temperature Co-Fired ceramic substrate market is segmented into RF System Level Package, Optoelectronic Packages, Array Packages, and others. By end-user industry, the global Low-Temperature Co-Fired ceramic substrate market is segmented into consumer electronics, automotive, aerospace and military, telecommunication, and others. Due to the incorporation of sensors in many elements of cars, such as engines and power transmissions, the automotive segment holds a significant share. The consumer electronics industry has been also employing LTCC technology due to miniaturization, causing smaller electronic circuit boards to overheat.
Geographical segments:
The Asia-Pacific market is expected to the significant growth in demand for electronic devices, combined with technological developments and improvements in electronics. The country has a large number of market participants at each stage of the supply chain and has been spending heavily on new inventions and research and development. During the projected period, North America is also expected to account for a significant portion of the global market. The expansion of the electronic and automotive industries and R&D investments in North America is a major driver of the low-temperature co-fired ceramic (LTCC) substrate industry.
Market Developments:
- March 2023- TMY Technology Inc. (TMYTEK) and Celanese collaborated to showcase an innovative Ultra-Low Size, Weight, and Power (SWaP) Electronically Steered Antenna (ESA) solution featuring Antenna-on-Chip (AoC) technology at Satellite 2023. TMYTEK, a leading provider of millimeter-wave solutions, joined forces with Celanese, a global chemical and specialty materials company, to unveil their latest advancement. The dual-polarization AoC technology was crafted using Micromax® GreenTape™ low-temperature co-fired ceramic (LTCC).
Market Segmentation:
- By Type
- RF System Level Package
- Optoelectronic Package
- Array Package
- Others
- By End-User Industry
- Consumer Electronics
- Automotive
- Aerospace and Military
- Telecommunication
- Others
- By Geography
- North America
- USA
- Canada
- Mexico
- South America
- Brazil
- Argentina
- Others
- Europe
- UK
- Germany
- France
- Others
- Middle East and Africa
- Saudi Arabia
- Israel
- Others
- Asia Pacific
- China
- Japan
- India
- South Korea
- Taiwan
- Indonesia
- Others
- North America
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline
1.8. Key benefits to the stakeholder
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Research Process
3. EXECUTIVE SUMMARY
3.1. Key Findings
3.2. Analyst View
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Porter’s Five Forces Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
4.5. Analyst View
5. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY TYPE
5.1. Introduction
5.2. RF System Level Package
5.2.1. Market opportunities and trends
5.2.2. Growth prospects
5.2.3. Geographic lucrativeness
5.3. Optoelectronic Package
5.3.1. Market opportunities and trends
5.3.2. Growth prospects
5.3.3. Geographic lucrativeness
5.4. Array Package
5.4.1. Market opportunities and trends
5.4.2. Growth prospects
5.4.3. Geographic lucrativeness
5.5. Others
5.5.1. Market opportunities and trends
5.5.2. Growth prospects
5.5.3. Geographic lucrativeness
6. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY END-USER INDUSTRY
6.1. Introduction
6.2. Consumer Electronics
6.2.1. Market opportunities and trends
6.2.2. Growth prospects
6.2.3. Geographic lucrativeness
6.3. Automotive
6.3.1. Market opportunities and trends
6.3.2. Growth prospects
6.3.3. Geographic lucrativeness
6.4. Aerospace and Military
6.4.1. Market opportunities and trends
6.4.2. Growth prospects
6.4.3. Geographic lucrativeness
6.5. Telecommunication
6.5.1. Market opportunities and trends
6.5.2. Growth prospects
6.5.3. Geographic lucrativeness
6.6. Others
6.6.1. Market opportunities and trends
6.6.2. Growth prospects
6.6.3. Geographic lucrativeness
7. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY GEOGRAPHY
7.1. Introduction
7.2. North America
7.2.1. By Type
7.2.2. By End-user
7.2.3. By Country
7.2.3.1. United States
7.2.3.1.1. Market Trends and Opportunities
7.2.3.1.2. Growth Prospects
7.2.3.2. Canada
7.2.3.2.1. Market Trends and Opportunities
7.2.3.2.2. Growth Prospects
7.2.3.3. Mexico
7.2.3.3.1. Market Trends and Opportunities
7.2.3.3.2. Growth Prospects
7.3. South America
7.3.1. By Type
7.3.2. By End-user
7.3.3. By Country
7.3.3.1. Brazil
7.3.3.1.1. Market Trends and Opportunities
7.3.3.1.2. Growth Prospects
7.3.3.2. Argentina
7.3.3.2.1. Market Trends and Opportunities
7.3.3.2.2. Growth Prospects
7.3.3.3. Others
7.3.3.3.1. Market Trends and Opportunities
7.3.3.3.2. Growth Prospects
7.4. Europe
7.4.1. By Type
7.4.2. By End-user
7.4.3. By Country
7.4.3.1. Germany
7.4.3.1.1. Market Trends and Opportunities
7.4.3.1.2. Growth Prospects
7.4.3.2. France
7.4.3.2.1. Market Trends and Opportunities
7.4.3.2.2. Growth Prospects
7.4.3.3. United Kingdom
7.4.3.3.1. Market Trends and Opportunities
7.4.3.3.2. Growth Prospects
7.4.3.4. Others
7.4.3.4.1. Market Trends and Opportunities
7.4.3.4.2. Growth Prospects
7.5. Middle East and Africa
7.5.1. By Type
7.5.2. By End-user
7.5.3. By Country
7.5.3.1. Saudi Arabia
7.5.3.1.1. Market Trends and Opportunities
7.5.3.1.2. Growth Prospects
7.5.3.2. Israel
7.5.3.2.1. Market Trends and Opportunities
7.5.3.2.2. Growth Prospects
7.5.3.3. Others
7.5.3.3.1. Market Trends and Opportunities
7.5.3.3.2. Growth Prospects
7.6. Asia Pacific
7.6.1. By Type
7.6.2. By End-user
7.6.3. By Country
7.6.3.1. China
7.6.3.1.1. Market Trends and Opportunities
7.6.3.1.2. Growth Prospects
7.6.3.2. Japan
7.6.3.2.1. Market Trends and Opportunities
7.6.3.2.2. Growth Prospects
7.6.3.3. India
7.6.3.3.1. Market Trends and Opportunities
7.6.3.3.2. Growth Prospects
7.6.3.4. South Korea
7.6.3.4.1. Market Trends and Opportunities
7.6.3.4.2. Growth Prospects
7.6.3.5. Indonesia
7.6.3.5.1. Market Trends and Opportunities
7.6.3.5.2. Growth Prospects
7.6.3.6. Taiwan
7.6.3.6.1. Market Trends and Opportunities
7.6.3.6.2. Growth Prospects
7.6.3.7. Others
7.6.3.7.1. Market Trends and Opportunities
7.6.3.7.2. Growth Prospects
8. COMPETITIVE ENVIRONMENT AND ANALYSIS
8.1. Major Players and Strategy Analysis
8.2. Market Share Analysis
8.3. Mergers, Acquisition, Agreements, and Collaborations
8.4. Competitive Dashboard
9. COMPANY PROFILES
9.1. Kyocera Corporation
9.2. DowDuPont, Inc.
9.3. Koa Speer Electronics, Inc.
9.4. Murata Manufacturing Co., Ltd.
9.5. Selmic Oy
9.6. TDK Corporation
9.7. Yokowo Co., Ltd.
9.8. NGK SPARK PLUG CO., LTD.
9.9. Adamant Namiki
9.10. Apitech
Kyocera Corporation
DowDuPont, Inc.
Koa Speer Electronics, Inc.
Murata Manufacturing Co., Ltd.
Selmic Oy
TDK Corporation
NGK SPARK PLUG CO., LTD.
Adamant Namiki
Apitech
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