Global Molded Interconnect Devices Market Size, Share, Opportunities And Trends By Process (Laser Direct Structuring, 2-shot Molding, Film Techniques), By Product Type (Antennae And Connectivity Modules, Sensors, Connectors And Switches, Lighting, Others), By Industry Vertical (Telecommunication, Consumer Electronics, Automotive, Healthcare, Others) And By Geography - Forecasts From 2019 To 2024
- Published : Mar 2020
- Report Code : KSI061611939
- Pages : 114
Offered with this report
Market Data and Estimates in Excel
2 Months of Post Sale Analyst Support
Requirement Specific Customization
The global molded interconnect device market is projected to grow at a CAGR of 9.91% to reach US$865.764 million by 2024, from US$491.107 million in 2018. The trend towards miniaturization in the consumer electronics industry coupled with increasing adoption of the smartphone in the developing economies are the major factors driving the demand for molded interconnect devices. Simultaneously, growing focus by the automotive manufacturers to improve the experience and convenience to the individual is leading to rising in-vehicle electronic content, thus driving the revenue generation opportunity for the molded interconnect device manufacturers. Moreover, the ability of the moulded interconnect device technology to support the development of medical devices is further augmenting its demand. As such, the adoption of these devices in the automotive and healthcare sector poses a significant market potential. Rising research and development expenditure by major vendors towards the development of these devices will augment the demand for these devices over the forecast devices.
DRIVERS
Flexibility of design
Growing focus on miniaturization of devices.
RESTRAINTS
Limited skilled labor.
Major industry players profiled as part of the report are TE Connectivity, LPFK Laser and Electronics, Lanxess, and Multiple Dimensions AG among others.
Segmentation
The global molded interconnect device market has been analyzed through the following segments:
BY PROCESS
Laser Direct Structuring
2-shot molding
Film Techniques
By PRODUCT TYPE
Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting
Others
BY INDUSTRY VERTICAL
Telecommunication
Consumer Electronics
Automotive
Healthcare
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Israel
Others
Asia Pacific
China
Japan
South Korea
Others
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PROCESS
5.1. Laser Direct Structuring
5.2. 2-Shot Molding
5.3. Film Techniques
6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PRODUCT TYPE
6.1. Antennae and Connectivity Modules
6.2. Sensors
6.3. Connectors and Switches
6.4. Lighting
6.5. Others
7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY INDUSTRY VERTICLE
7.1. Telecommunication
7.2. Consumer Electronics
7.3. Automotive
7.4. Healthcare
7.5. Others
8. MOLDED INTERCONNECT DEVICE MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.2. South America
8.2.1. Brazil
8.2.2. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Israel
8.4.2. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. Others
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. TE Connectivity
10.2. LPFK Laser and Electronics
10.3. Molex, LLC
10.4. MID Solutions GmbH
10.5. Lanxess
10.6. Multiple Dimensions AG
10.7. MacDermid, Inc.
10.8. RTP Company
10.9. Smart Plastic Products (S2P)
LIST OF FIGURES
LIST OF TABLES
TE Connectivity
LPFK Laser and Electronics
Molex, LLC
MID Solutions GmbH
Lanxess
Multiple Dimensions AG
MacDermid, Inc.
RTP Company
Smart Plastic Products (S2P)
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