The recent study on the special purpose logic market covers an in-depth analysis of the market based on vertical and geography. The report also covers the country level analysis within the regions as well. Additionally, the report covers the key trends in the market along with drivers and restraint during the forecast period 2019-2024. According to the report titled “Special Purpose Logic Market– Forecast from 2019 to 2024”, the market is estimated to grow at a CAGR of 3.25% during the forecast period. The report has segmented the special purpose logic market by industry vertical (communication, consumer electronics, automotive, manufacturing) and by geography such as Americas (United States, Canada, Brazil, others), Europe Middle East and Africa (Germany, France, United Kingdom, Italy, others), and Asia Pacific (China, Japan, India, Taiwan, others). The development of highly integrated chips is increasing on account of growing demand for highly miniaturized devices. In fact, in February 2019, Broadcom Inc., launched the BCM43752 chip, which is a highly integrated chip that has the ability to bring together the innovations in Wi-Fi 6 and Bluetooth 5 technology in order to offer the smartphone manufacturers a low cost and high connectivity solution. Furthermore, the development of electronic devices requiring high processing speed and power is further anticipated to augment the growth of the market during the forecast period.
The Asia Pacific region is estimated to hold a significant share in the market.
The anticipated commercialization of 5G during the course of the forecast period and the focus on providing high speed internet services is expected to increase the investment in the development of internet infrastructure globally, which in turn, is anticipated to boost the production of different communication components and devices, hence, driving the growth of the market.
Some of the major players discussed in the reports are Intel Corporation, STMicroelectronics, Broadcom Inc., and Marvell Semiconductor, Inc. among others.
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