1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Market Segmentation
2. RESEARCH METHODOLOGY
2.1. Research Data
2.2. Assumptions
3. EXECUTIVE SUMMARY
3.1. Research Highlights
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Bandwidth Availability
4.4. Number of Users
5. GOVERNMENT REGULATIONS/POLICIES
6. 5G PACKAGING SUBSTRATE MARKET, BY MATERIAL
6.1. Introduction
6.2. LTCC
6.3. Low-loss laminates
6.4. Others
7. 5G PACKAGING SUBSTRATE MARKET, BY RF MODULE
7.1. Introduction
7.2. mmW Discrete Antenna
7.3. mmW AiP
7.4. mmW RFFEM
7.5. 5G Sub-6
8. 5G PACKAGING SUBSTRATE MARKET, BY BAND
8.1. Introduction
8.2. Sub-6 GHz
8.3. mmWave
9. 5G PACKAGING SUBSTRATE MARKET, BY GEOGRAPHY
9.1. Introduction
9.2. Americas
9.2.1. United States
9.2.2. Others
9.3. Europe, Middle East and Africa
9.3.1. Germany
9.3.2. UK
9.3.3. Others
9.4. Asia Pacific
9.4.1. China
9.4.2. Japan
9.4.3. South Korea
9.4.4. Others
10. RECENT DEVELOPMENT AND INVESTMENTS
11. COMPETITIVE ENVIRONMENT AND ANALYSIS
11.1. Major Players and Strategy Analysis
11.2. Vendor Competitiveness Matrix
12. COMPANY PROFILES
12.1. Shennan Circuits Company Limited
12.2. LG Innotek Co., Ltd
12.3. SHINKO ELECTRIC INDUSTRIES CO., LTD
12.4. Unimicron Technology
12.5. Samsung Electro-Mechanics
12.6. AT&S
12.7. Amkor Technology, Inc.