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Semiconductor Manufacturing Equipment Market Size, Share, Opportunities, and Trends Segmented By Equipment Type, Dimension, Fab Facility, and Geography – Forecast from 2025 to 2030

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Market Size
USD 210.401 billion
by 2031
CAGR
10.88%
2026-2031
Base Year
2025
Forecast Period
2026-2031
Projection
Report OverviewSegmentationTable of ContentsCustomize Report

Table of Contents

1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FRONT-END EQUIPMENT

5.1. Introduction

5.2. Water Surface Conditioning Equipment

5.3. Cleaning Process

5.4. Others

6. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY BACK-END EQUIPMENT

6.1. Introduction

6.2. Assembling and Packaging

6.3. Bonding Equipment

6.4. Dicing Equipment

6.5. Testing Equipment

6.6. Metrology Equipment

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT  MARKET BY DIMENSION

7.1. Introduction

7.2. 2D

7.3. 3D

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT  MARKET BY FAB FACILITY

8.1. Introduction

8.2. Automation

8.3. Chemical Control Equipment

8.4. Gas Control Equipment

8.5. Others

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY GEOGRAPHY

9.1. Introduction

9.2. Americas

9.2.1. United States

9.2.2. Others

9.3. Europe, the Middle East, and Africa

9.3.1. Germany

9.3.2. United Kingdom

9.3.3. Netherlands

9.3.4. Others

9.4. Asia Pacific

9.4.1. China

9.4.2. Japan

9.4.3. South Korea

9.4.4. India

9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

10.1. Major Players and Strategy Analysis

10.2. Market Share Analysis

10.3. Mergers, Acquisitions, Agreements, and Collaborations

10.4. Competitive Dashboard

11. COMPANY PROFILES

11.1. Tokyo Seimitsu Co., Ltd.

11.2. Kokusai Electric Corporation

11.3. Terra Universal

11.4. Modutek Corporation

11.5. Hitachi High-Technologies Corporation

11.6. LAM Research Corporation

11.7. Applied Materials, Inc.

11.8. ASML Holdings N.V

11.9. Tokyo Electron Limited

11.10. Teradyne, Inc.

12. APPENDIX

12.1. Currency 

12.2. Assumptions

12.3. Base and Forecast Years Timeline

12.4. Key benefits for the stakeholders

12.5. Research Methodology 

12.6. Abbreviations 

LIST OF FIGURES

LIST OF TABLES

REPORT DETAILS

Report ID:KSI061611948
Published:Nov 2025
Pages:112
Format:PDF, Excel, PPT, Dashboard
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