1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. GLOBAL SEMICONDUCTOR MARKET BY DEVICE TYPE
5.1. Memory
5.1.1. Type
5.1.1.1. DRAM
5.1.1.2. NAND
5.1.1.3. Others
5.1.2. End-User Industries
5.1.2.1. Communication
5.1.2.2. Consumer Electronics
5.1.2.3. Automotive
5.1.2.4. Manufacturing
5.1.3. Geography
5.1.3.1. North America
5.1.3.2. Europe
5.1.3.3. Asia Pacific
5.1.3.4. Rest of the World
5.2. Logic
5.2.1. Type
5.2.1.1. Special Purpose Logic
5.2.1.2. Display Drivers
5.2.1.3. General Purpose Logic
5.2.1.4. Application Specific Integrated Circuits (ASICs)
5.2.1.5. Programmable Logic Devices (PLDs)
5.2.2. End-User Industries
5.2.2.1. Communication
5.2.2.2. Consumer Electronics
5.2.2.3. Automotive
5.2.2.4. Manufacturing
5.2.3. Geography
5.2.3.1. North America
5.2.3.2. Europe
5.2.3.3. Asia Pacific
5.2.3.4. Rest of the World
5.3. Analog
5.3.1. Type
5.3.1.1. General Purpose
5.3.1.2. Application Specific
5.3.2. End-User Industries
5.3.2.1. Communication
5.3.2.2. Consumer Electronics
5.3.2.3. Automotive
5.3.2.4. Manufacturing
5.3.3. Geography
5.3.3.1. North America
5.3.3.2. Europe
5.3.3.3. Asia Pacific
5.3.3.4. Rest of the World
5.4. Microcomponents
5.4.1. Type
5.4.1.1. MPU
5.4.1.2. MCU
5.4.1.3. DSP
5.4.2. End-User Industries
5.4.2.1. Communication
5.4.2.2. Consumer Electronics
5.4.2.3. Automotive
5.4.2.4. Manufacturing
5.4.3. Geography
5.4.3.1. North America
5.4.3.2. Europe
5.4.3.3. Asia Pacific
5.4.3.4. Rest of the World
5.5. Optoelectronics
5.5.1. Type
5.5.1.1. Lamps
5.5.1.2. CMOS Image Sensors
5.5.1.3. CCD Image Sensors
5.5.1.4. Laser Storage Pick-ups
5.5.1.5. Displays
5.5.1.6. Couplers
5.5.1.7. Others
5.5.2. End-User Industries
5.5.2.1. Communication
5.5.2.2. Consumer Electronics
5.5.2.3. Automotive
5.5.2.4. Manufacturing
5.5.3. Geography
5.5.3.1. North America
5.5.3.2. Europe
5.5.3.3. Asia Pacific
5.5.3.4. Rest of the World
5.6. Discrete
5.6.1. Type
5.6.1.1. Thyristors
5.6.1.2. Rectifiers
5.6.1.3. Power Transistors
5.6.1.4. Small Signal Transistors
5.6.1.5. Diodes
5.6.1.6. Others
5.6.2. End-User Industries
5.6.2.1. Communication
5.6.2.2. Consumer Electronics
5.6.2.3. Automotive
5.6.2.4. Manufacturing
5.6.3. Geography
5.6.3.1. North America
5.6.3.2. Europe
5.6.3.3. Asia Pacific
5.6.3.4. Rest of the World
5.7. Sensors and Actuators
5.7.1. Type
5.7.1.1. Sensors
5.7.1.1.1. Pressure
5.7.1.1.2. Fingerprint
5.7.1.1.3. Magnetometer
5.7.1.1.4. Inertial
5.7.1.1.5. Others
5.7.1.2. Actuators
5.7.2. End-User Industries
5.7.2.1. Communication
5.7.2.2. Consumer Electronics
5.7.2.3. Automotive
5.7.2.4. Manufacturing
5.7.3. Geography
5.7.3.1. North America
5.7.3.2. Europe
5.7.3.3. Asia Pacific
5.7.3.4. Rest of the World
6. GLOBAL SEMICONDUCTOR MARKET BY INDUSTRY VERTICAL
6.1. Communication
6.1.1. By Type
6.2. Consumer Electronics
6.2.1. By Type
6.3. Automotive
6.3.1. By Type
6.4. Manufacturing
6.4.1. By Type
7. GLOBAL SEMICONDUCTOR MARKET BY GEOGRAPHY
7.1. Americas
7.1.1. US
7.2. Europe Middle East and Africa
7.2.1. Germany
7.2.2. Netherlands
7.2.3. Others
7.3. Asia-Pacific
7.3.1. China
7.3.2. Japan
7.3.3. South Korea
7.3.4. Taiwan
7.3.5. Others
8. COMPETITIVE INTELLIGENCE
8.1. Market Share of Key Players
8.2. Competitive Benchmarking and Analysis
8.3. Strategies of Key Players
8.4. Recent Investment and Deals
9. COMPANY PROFILES
9.1. Texas Instruments
9.1.1. Company Overview
9.1.2. Financials
9.1.3. Products and Services
9.1.4. Recent Developments
9.2. Analog Devices, Inc.
9.2.1. Company Overview
9.2.2. Financials
9.2.3. Products and Services
9.2.4. Recent Developments
9.3. Maxim Integrated
9.3.1. Company Overview
9.3.2. Financials
9.3.3. Products and Services
9.3.4. Recent Developments
9.4. Intel Corporation
9.4.1. Company Overview
9.4.2. Financials
9.4.3. Products and Services
9.4.4. Recent Developments
9.5. NXP Semiconductor
9.5.1. Company Overview
9.5.2. Financials
9.5.3. Products and Services
9.5.4. Recent Developments
9.6. Renesas Electronics
9.6.1. Company Overview
9.6.2. Financials
9.6.3. Products and Services
9.6.4. Recent Developments
9.7. Infineon Technologies
9.7.1. Company Overview
9.7.2. Financials
9.7.3. Products and Services
9.7.4. Recent Developments
9.8. Microchip Technology
9.8.1. Company Overview
9.8.2. Financials
9.8.3. Products and Services
9.8.4. Recent Developments
9.9. Samsung Group
9.9.1. Company Overview
9.9.2. Financials
9.9.3. Products and Services
9.9.4. Recent Developments
9.10. Toshiba Memory Corporation
9.10.1. Company Overview
9.10.2. Financials
9.10.3. Products and Services
9.10.4. Recent Developments
9.11. SK Hynix, Inc.
9.11.1. Company Overview
9.11.2. Financials
9.11.3. Products and Services
9.11.4. Recent Developments
9.12. Cirrus Logic, Inc.
9.12.1. Company Overview
9.12.2. Financials
9.12.3. Products and Services
9.12.4. Recent Developments
9.13. STMicroelectronics
9.13.1. Company Overview
9.13.2. Financials
9.13.3. Products and Services
9.13.4. Recent Developments
9.14. Himax Technologies
9.14.1. Company Overview
9.14.2. Financials
9.14.3. Products and Services
9.14.4. Recent Developments
9.15. Silicon Works
9.15.1. Company Overview
9.15.2. Financials
9.15.3. Products and Services
9.15.4. Recent Developments
9.16. Sitronix Technology Corporation
9.16.1. Company Overview
9.16.2. Financials
9.16.3. Products and Services
9.16.4. Recent Developments
9.17. Novatek Microelectronic Corporation
9.17.1. Company Overview
9.17.2. Financials
9.17.3. Products and Services
9.17.4. Recent Developments
9.18. GlobalFoundries, Inc.
9.18.1. Company Overview
9.18.2. Financials