1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base and Forecast Years Timeline
1.8. Key benefits for the stakeholders
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Research Process
3. EXECUTIVE SUMMARY
3.1. Key Findings
3.2. Analyst View
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Porter’s Five Forces Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. The Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
5. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY TYPE
5.1. Introduction
5.2. Advanced IC Substrate
5.2.1. FC BGA
5.2.2. FC CSP
5.3. Substrate-like-PCB (SLP)
5.4. Embedded Die
6. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY PACKAGING TYPE
6.1. Introduction
6.2. System in Package (SiP)
6.3. Quad Flat Package (QFP)
6.4. Ball Grid Array (BG)
6.5. Chip Scale Packaging (CSP)
6.6. Others
7. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY APPLICATION
7.1. Introduction
7.2. Consumer Electronics
7.3. Automotive and Transportation
7.4. IT and Telecom
7.5. Others
8. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY GEOGRAPHY
8.1. Global Overview
8.2. Americas
8.2.1. US
8.3. Europe, Middle East, and Africa
8.3.1. Germany
8.3.2. Netherlands
8.3.3. Others
8.4. Asia-Pacific
8.4.1. China
8.4.2. Japan
8.4.3. Taiwan
8.4.4. South Korea
8.4.5. Others
9. COMPETITIVE ENVIRONMENT AND ANALYSIS
9.1. Major Players and Strategy Analysis
9.2. Market Share Analysis
9.3. Mergers, Acquisitions, Agreements, and Collaborations
9.4. Competitive Dashboard
10. COMPANY PROFILES
10.1. ASE Group
10.2. Fujitsu Limited
10.3. Ibiden Co. Ltd.
10.4. Kinsus Interconnect Technology Corp.
10.5. Korea Circuit Co. Ltd.
10.6. KYOCERA Corporation
10.7. LG Innotek Co. Ltd.
10.8. Nan Ya PCB Co. Ltd.
10.9. TTM Technologies Inc.
10.10. Unimicron Technology Corporation