Category

3D Semiconductor Packaging Market - Forecasts From 2019 To 2024

116 pages
Published on : May 2019
Report Code : KSI061612602

Description

The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.
 
DRIVERS
 
Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
 
RESTRAINTS
 
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
 
RECENT DEVELOPMENTS
 
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
 
Segmentation
 
The 3D Semiconductor packaging market has been analyzed through the following segments:
 
By Technology
 
Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
Wire Bonding
Others
 
By Industry Vertical
 
Electronics
Communication and Technology
Manufacturing
Automotive
Defense and Aerospace
Healthcare
Others
 
By Material
 
Bonding Wire
Lead frame
Organic Substrate
Encapsulation Resin
Ceramic Package
Die Attach Material
Others
 
By Geography
 
North America
USA
Canada
Others
 
South America
Brazil
Argentina
Others
 
Europe
United Kingdom
Germany
France
Others
 
Middle East and Africa
Israel
UAE
Saudi Arabia
Others
 
Asia Pacific
China
Japan
South Korea
India
Others

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