Category

3D Semiconductor Packaging Market Size, Share, Opportunities And Trends By Technology (Through Silicon Vias, Fan Out Wafer Level Packaging, Wire Bonding, Others), By Industry Vertical (Electronics, Communication And Technology, Manufacturing, Automotive, Defense And Aerospace, Healthcare, Others), By Material (Bonding Wire, Lead Frame, Organic Substrate, Encapsulation Resin, Ceramic Package, Die Attach Material, Others) And By Geography - Forecasts From 2019 To 2024

116 pages
Published on : May 2019
Report Code : KSI061612602

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Description

The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.

DRIVERS

Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.

RESTRAINTS

Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns

RECENT DEVELOPMENTS

In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.

Segmentation

The 3D Semiconductor packaging market has been analyzed through the following segments:

By Technology

Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
Wire Bonding
Others

By Industry Vertical

Electronics
Communication and Technology
Manufacturing
Automotive
Defense and Aerospace
Healthcare
Others

By Material

Bonding Wire
Lead frame
Organic Substrate
Encapsulation Resin
Ceramic Package
Die Attach Material
Others

By Geography

North America
USA
Canada
Others

South America
Brazil
Argentina
Others

Europe
United Kingdom
Germany
France
Others

Middle East and Africa
Israel
UAE
Saudi Arabia
Others

Asia Pacific
China
Japan
South Korea
India
Others

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