5G Smartphone Packaging Market Size, Share, Opportunities, And Trends By Type (RF Front-End Module, Antenna In Package (AiP)), By Band (Sub-6 GHz, MmWave), And By Geography - Forecasts From 2023 To 2028

  • Published : Dec 2023
  • Report Code : KSI061616375
  • Pages : 140

The global 5G smartphone packaging market is expected to grow at a CAGR of 11.72% from US$1,445.980 million in 2022 to US$2,811.564 million by 2028.


  • Advancement in the radio frequency technology for the 5G Era

The advanced electronics packaging market has expanded significantly, driven by the demands of various sectors, particularly in radio frequency (RF) applications. The transition to 5G has necessitated larger silicon areas and increased power consumption in 5G smartphones to deliver enhanced wireless data rates compared to 4G. 5G-enabled chips are becoming larger and more feature-rich, creating competition for space within smartphones, particularly in relation to the limited battery space. As 5G and mmWave applications continue to grow, System-in-Package (SiP) solutions are becoming more intricate to maintain high-performance standards.

The rise of 5G mobile phones may lead to a fresh wave of smartphone replacements, propelling the industry chain towards a new phase of growth.

For instance:

  • In December 2022, DuPont introduced CYCLOTENE™ Dry-Film Photo-Imageable Dielectric Material, aimed at enhancing advanced semiconductor packaging for high-performance applications such as 5G and AI. This development builds upon DuPont's extensive experience in integrating CYCLOTENE™ products into various applications, including RF dielectrics and redistribution layer (RDL) interposers within panels and advanced substrate packaging.
  • In June 2021, TSMC introduced its latest advancements in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies. These innovations encompass N6RF, designed to elevate 5G smartphone and WiFi 6/6e performance for the next generation, and N5A, catering to the increasing need for higher computing power in advanced automotive applications. N5A is specifically tailored for demanding tasks like AI-enabled driver assistance systems and the digital transformation of vehicle interiors.

Antenna in package (AiP) technology driving 5G Expansion

The deployment of AiP and AoP technology is pivotal in providing fully integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and mobile devices. These mmWave antenna modules offer versatile capabilities across multiple spectrum bands while maintaining a compact form factor suitable for seamless integration into mobile devices. AiP/AoP technology enhances 5G signal integrity, addressing challenges through a phased antenna array design that minimizes the space needed to accommodate mmWave components within 5G devices.

In June 2022, TMY Technology Inc., a prominent mmWave solution provider and innovator, introduced its Antenna-in-Package (AiP) solutions tailored for 5G mobile and SATCOM applications. TMYTEK's AiP 5G mobile solution is geared for antenna design, validation, and production, focusing on 5G mmWave O-RAN RU across bands n257, n258, and n261. TMYTEK has established a comprehensive mmWave design, manufacturing, and testing ecosystem in collaboration with DuPont on a global scale, providing a one-stop-shop solution for these cutting-edge technologies.

In August 2021, Amkor took strides in advancing 5G RF module design, characterization, and packaging technology. The advent of 5G technology has led to an expansion in cellular frequency bands, demanding inventive packaging solutions for RF front-end modules in 5G-enabled devices, especially smartphones. Amkor's double-sided, molded ball grid array (DSMBGA) exemplifies a noteworthy solution. Leveraging its extensive experience in providing top-tier System-in-package (SiP) technology, Amkor is contributing to the evolution of 5G RF innovations.

Increasing Penetration of Smartphone Subscriptions

The rising use of smartphones and internet access, along with the ongoing trend, is driving the packaging market. Additionally, the consistent development of smartphone products leads to higher sales, a significant aspect of this market. New smartphones that provide better performance, biosensors, extended battery life, and increased AI capabilities, alongside the growing popularity of affordable smartphones in developing nations, will uplift the radio frequency and Antenna in Package (AiP) components sector. Consequently, the need for low-power ICs to extend battery life and shorten charging duration in smartphones is projected to boost the demand for 5G smartphone packaging.

According to the Ericsson Mobility Report 2023, data based on the country's Smartphone subscription subscriptions in 2021 and 2022 shows steady growth in various regions. Notable increases include North America, Western Europe, Latin America, the Middle East, and North Africa, reflecting a positive trend in smartphone adoption. China's substantial increase underscores its enduring dominance in the global smartphone market. These figures suggest a continued demand for mobile technology across diverse regions.

EMERGING OPPORTUNITIES IN THE 5G Smartphone Packaging Market

Disruptive 5G packaging technologies

Simplifying design complexities in high-frequency devices, antenna integration within the package is introduced for 5G smartphones and millimeter-wave (mmWave) applications. The advent of 5G mmWave technology has brought about innovative packaging approaches, such as fan-out WLP5 and glass substrate interposers, which compete with advanced organic substrate flip-chip packages incorporating new low-loss dielectrics. Various packaging solutions using flip-chip and fan-out technology are explored for integrating antenna elements with RF components for 5G mmWave communication. Consulting delves deep into disruptive advanced packaging and RF electronics technologies, highlighting the latest innovations and potential business opportunities in the 5G market.

  • In October 2021, Murata introduced a compact integrated antenna array module for mmWave 5G, tailored to meet the rigorous needs of smartphone, IoT, and local/private 5G sectors. Murata's module not only conserves space but also reduces costs. With its high-speed functionality and substantial capacity, this innovative design from Murata ensures reliable and secure communication pathways. It simplifies the process for smartphone manufacturers and wireless device developers to harness the advantages of mmWave 5G technology to their fullest extent.


In September 2023, Cana Limited (iCana), a wireless telecommunications semiconductor component supplier, unveiled its mmWave Beamforming IC (ICAMB2629-A) for n257 and n261 bands at the European Microwave Week 2023 Booth #546C in Berlin, Germany. The introduction of this Beamforming IC represents a significant achievement for iCana, aiming to revolutionize the 5G mmWave infrastructure market by providing a high-performance and cost-effective solution

In September 2023, Anritsu collaborates with MPI™ and ATV Systems to present cutting-edge 6G Antenna in Package (AiP) measurements at the European Microwave Week 2023 in Berlin. This solution incorporates a VectorStar™ VNA equipped with patented NLTL technology-based millimeter-wave (mmWave) extenders, allowing for sweeping measurements from 70 kHz to 220 GHz.


Several key players in the market, including Taiwan Semiconductor Manufacturing Company Limited, Qualcomm, Skyworks Solution Inc. and others, offer a wide range of product offerings, which encompass:







Taiwan Semiconductor Manufacturing Company Limited


TSMC's cutting-edge N6RF technology, recognized as the most advanced RF CMOS solution, empowers our customers' products to achieve optimal 5G/Wi-Fi 6 & 6E performance while simultaneously enhancing battery life. This is achieved through its exceptional RF capabilities and the associated benefits of digital PPA (Power, Performance, and Area).


RF Front End (RFFE)

Qualcomm Technologies' advanced RF front-end solutions are instrumental in empowering high-performance 5G multiband multimode smartphones and smart devices. These RF front-end (RFFE) micro-acoustic filter products consist of high-performance embedded and discrete components, such as duplexers, diplexers, extractors, and acoustic filters, including Qualcomm® ultraBAW and Qualcomm® ultraSAW filter technology, as well as SAW and TC-SAW filters.

Skyworks Solutions, Inc.


The SKY58085-11 module is meticulously designed to meet the demanding requirements of 5G NR and LTE advanced, especially when wider bandwidth (100 MHz) and carrier aggregation are essential for achieving higher data rates. This module efficiently combines filtering, RF matching, and TRx switching internally, enhancing performance for prevalent Downlink (DL) CA band combinations, all within a compact and cost-effective solution. It also provides support for very wide bandwidth 5G NR operations, suports up to 60 MHz of bandwidth.


5G Public Cloud Market Scope:


Report Metric Details
Market Size Value in 2022 US$1,445.980 million
Market Size Value in 2028 US$2,811.564 million
Growth Rate CAGR of 11.72% from 2022 to 2028
Base Year 2022
Forecast Period 2023 – 2028
Forecast Unit (Value) USD Million
Segments Covered Type, Band, and Geography
Regions Covered North America, South America, Europe, Middle East and Africa, Asia Pacific
Companies Covered Taiwan Semiconductor Manufacturing Company Limited, Qualcomm, Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, TMY Technology, Inc
Customization Scope Free report customization with purchase



The global 5G smartphone packaging market has been analyzed through the following segments:

  • By Type
    • RF Front-End Module
    • Antenna in Package (AiP)
  • By Band
    • Sub-6 GHz
    • mmWave
  • By Geography
    • Americas
      • United States
      • Others
    • EMEA
      • Germany
      • UK
      • Others
    • APAC
      • China
      • Japan
      • South Korea
      • Others

Frequently Asked Questions (FAQs)

The global 5G smartphone packaging market is expected to reach a market size of US$2,811.564 million by 2028.
5G Smartphone Packaging Market was valued at US$1,445.980 million in 2022.
The 5G smartphone packaging market is expected to grow at a CAGR of 11.72% over the forecast period.
Asia Pacific is expected to dominate the 5G smartphone packaging market.
The rising use of smartphones and internet access, along with the ongoing trend, is driving the 5G smartphone packaging market.


1.1. Market Overview

1.2. Market Definition

1.3. Market Segmentation


2.1. Research Data

2.2. Assumptions


3.1. Research Highlights


4.1. Market Drivers

4.2. Market Restraints

4.3. Bandwidth Availability

4.4. Number of Users



6.1. Introduction

6.2. RF Front-End Module

6.3. Antenna in Package (AiP)


7.1. Introduction

7.2. Sub-6 GHz

7.3. mmWave


8.1. Introduction

8.2. Americas

8.2.1. United States

8.2.2. Others

8.3. Europe, Middle East and Africa

8.3.1. Germany

8.3.2. UK

8.3.3. Others

8.4. Asia Pacific

8.4.1. China

8.4.2. Japan

8.4.3. South Korea

8.4.4. Others



10.1. Major Players and Strategy Analysis

10.2. Vendor Competitiveness Matrix


11.1. Taiwan Semiconductor Manufacturing Company Limited

11.2. Qualcomm

11.3. Murata Manufacturing Co., Ltd.

11.4. Skyworks Solutions, Inc.

11.5. Qorvo

11.6. TMY Technology, Inc.

Taiwan Semiconductor Manufacturing Company Limited


Murata Manufacturing Co., Ltd.

Skyworks Solutions, Inc.


TMY Technology, Inc