1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Market Segmentation
2. RESEARCH METHODOLOGY
2.1. Research Data
2.2. Assumptions
3. EXECUTIVE SUMMARY
3.1. Research Highlights
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Bandwidth Availability
4.4. Number of Users
5. GOVERNMENT REGULATIONS/POLICIES
6. 5G SMARTPHONE PACKAGING MARKET, BY TYPE
6.1. Introduction
6.2. RF Front-End Module
6.3. Antenna in Package (AiP)
7. 5G SMARTPHONE PACKAGING MARKET, BY BAND
7.1. Introduction
7.2. Sub-6 GHz
7.3. mmWave
8. 5G SMARTPHONE PACKAGING MARKET, BY GEOGRAPHY
8.1. Introduction
8.2. Americas
8.2.1. United States
8.2.2. Others
8.3. Europe, Middle East and Africa
8.3.1. Germany
8.3.2. UK
8.3.3. Others
8.4. Asia Pacific
8.4.1. China
8.4.2. Japan
8.4.3. South Korea
8.4.4. Others
9. RECENT DEVELOPMENT AND INVESTMENTS
10. COMPETITIVE ENVIRONMENT AND ANALYSIS
10.1. Major Players and Strategy Analysis
10.2. Vendor Competitiveness Matrix
11. COMPANY PROFILES
11.1. Taiwan Semiconductor Manufacturing Company Limited
11.2. Qualcomm
11.3. Murata Manufacturing Co., Ltd.
11.4. Skyworks Solutions, Inc.
11.5. Qorvo
11.6. TMY Technology, Inc.