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Global Molded Interconnect Devices Market Size, Share, Opportunities And Trends By Process (Laser Direct Structuring, 2-shot molding, Film Techniques), By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting, Others), By Industry Vertical (Telecommunication, Consumer Electronics, Automotive, Healthcare, Others) And By Geography - Forecasts From 2025 To 2030

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Report OverviewSegmentationTable of ContentsCustomize Report

Market Segmentation

By PROCESS

Laser Direct Structuring
2-shot molding
Film Techniques

By PRODUCT TYPE

Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting
Others

By APPLICATION

Telecommunication
Consumer Electronics
Automotive
Medical Devices
Others
Manufacturers
Others

By GEOGRAPHY

North America
United States
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Italy
Others
Middle East & Africa
Saudi Arabia
UAE
Others
Asia Pacific
Japan
China
India
South Korea
Taiwan
Others

REPORT DETAILS

Report ID:KSI061611939
Published:Dec 2025
Pages:145
Format:PDF, Excel, PPT, Dashboard
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