Global Molded Interconnect Devices Market Size, Share, Opportunities And Trends By Process (Laser Direct Structuring, 2-shot molding, Film Techniques), By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting, Others), By Industry Vertical (Telecommunication, Consumer Electronics, Automotive, Healthcare, Others) And By Geography - Forecasts From 2025 To 2030

 

The trend towards miniaturization in the consumer electronics industry coupled with increasing adoption of the smartphone in the developing economies are the major factors driving the demand for molded interconnect devices. Simultaneously, growing focus by the automotive manufacturers to improve the experience and convenience to the individual is leading to rising in-vehicle electronic content, thus driving the revenue generation opportunity for the molded interconnect device manufacturers. Moreover, the ability of the moulded interconnect device technology to support the development of medical devices is further augmenting its demand. As such, the adoption of these devices in the automotive and healthcare sector poses a significant market potential. Rising research and development expenditure by major vendors towards the development of these devices will augment the demand for these devices over the forecast devices.

 

 

Major industry players profiled as part of the report are TE Connectivity, LPFK Laser and Electronics, Lanxess, and Multiple Dimensions AG among others.

 

 

 

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Currency

1.5. Assumptions

1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY 

2.1. Research Design

2.2. Secondary Sources

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. Market Segmentation

4.2. Market Drivers

4.3. Market Restraints

4.4. Market Opportunities

4.5. Porter’s Five Forces Analysis

4.5.1. Bargaining Power of Suppliers

4.5.2. Bargaining Power of Buyers

4.5.3. Threat of New Entrants

4.5.4. Threat of Substitutes

4.5.5. Competitive Rivalry in the Industry

4.6. Life Cycle Analysis - Regional Snapshot

4.7. Market Attractiveness

5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PROCESS

5.1. Laser Direct Structuring

5.2. 2-Shot Molding

5.3. Film Techniques

6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PRODUCT TYPE

6.1. Antennae and Connectivity Modules

6.2. Sensors

6.3. Connectors and Switches

6.4. Lighting

6.5. Others

7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY INDUSTRY VERTICLE

7.1. Telecommunication

7.2. Consumer Electronics

7.3. Automotive

7.4. Healthcare

7.5. Others

8. MOLDED INTERCONNECT DEVICE MARKET BY GEOGRAPHY

8.1. North America

8.1.1. USA

8.1.2. Canada

8.1.3. Mexico

8.2. South America

8.2.1. Brazil

8.2.2. Others

8.3. Europe

8.3.1. Germany

8.3.2. France

8.3.3. United Kingdom

8.3.4. Spain

8.3.5. Others

8.4. Middle East and Africa

8.4.1. Israel

8.4.2. Others

8.5. Asia Pacific

8.5.1. China

8.5.2. Japan

8.5.3. South Korea

8.5.4. Others

9. COMPETITIVE INTELLIGENCE

9.1. Competitive Benchmarking and Analysis

9.2.  Recent Investments and Deals

9.3. Strategies of Key Players

10. COMPANY PROFILES

10.1. TE Connectivity

10.2. LPFK Laser and Electronics

10.3. Molex, LLC

10.4. MID Solutions GmbH

10.5. Lanxess

10.6. Multiple Dimensions AG

10.7. MacDermid, Inc.

10.8. RTP Company

10.9. Smart Plastic Products (S2P)

LIST OF FIGURES

LIST OF TABLES

TE Connectivity

LPFK Laser and Electronics

Molex, LLC

MID Solutions GmbH

Lanxess

Multiple Dimensions AG

MacDermid, Inc.

RTP Company

Smart Plastic Products (S2P)