1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PROCESS
5.1. Laser Direct Structuring
5.2. 2-Shot Molding
5.3. Film Techniques
6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY PRODUCT TYPE
6.1. Antennae and Connectivity Modules
6.2. Sensors
6.3. Connectors and Switches
6.4. Lighting
6.5. Others
7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY INDUSTRY VERTICLE
7.1. Telecommunication
7.2. Consumer Electronics
7.3. Automotive
7.4. Healthcare
7.5. Others
8. MOLDED INTERCONNECT DEVICE MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.2. South America
8.2.1. Brazil
8.2.2. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Israel
8.4.2. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. Others
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. TE Connectivity
10.2. LPFK Laser and Electronics
10.3. Molex, LLC
10.4. MID Solutions GmbH
10.5. Lanxess
10.6. Multiple Dimensions AG
10.7. MacDermid, Inc.
10.8. RTP Company
10.9. Smart Plastic Products (S2P)
LIST OF FIGURES
LIST OF TABLES