Global Molded Interconnect Devices Market Size, Share, Opportunities And Trends By Process (Laser Direct Structuring, 2-shot molding, Film Techniques), By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting, Others), By Industry Vertical (Telecommunication, Consumer Electronics, Automotive, Healthcare, Others) And By Geography - Forecasts From 2025 To 2030

Description

Molded Interconnect Devices Market Size:

The Molded Interconnect Devices Market is anticipated to increase from USD 1.541 billion in 2025 to USD 2.974 billion by 2030, registering a 14.06% CAGR.

  The trend towards miniaturization in the consumer electronics industry coupled with increasing adoption of the smartphone in the developing economies are the major factors driving the demand for molded interconnect devices. Simultaneously, growing focus by the automotive manufacturers to improve the experience and convenience to the individual is leading to rising in-vehicle electronic content, thus driving the revenue generation opportunity for the molded interconnect device manufacturers. Moreover, the ability of the moulded interconnect device technology to support the development of medical devices is further augmenting its demand. As such, the adoption of these devices in the automotive and healthcare sector poses a significant market potential. Rising research and development expenditure by major vendors towards the development of these devices will augment the demand for these devices over the forecast devices.   Molded Interconnect Devices Market Drivers:

• Flexibility of design
• Growing focus on miniaturization of devices.

Molded Interconnect Devices Market Restraints:

• Limited skilled labor.

  Major industry players profiled as part of the report are TE Connectivity, LPFK Laser and Electronics, Lanxess, and Multiple Dimensions AG among others.  

Segmentation

• By Process
  • Laser Direct Structuring
  • 2-shot molding
  • Film Techniques
• By Product Type
  • Antennae and Connectivity Modules
  • Sensors
  • Connectors and Switches
  • Lighting
  • Others
• By Application
  • Telecommunication
  • Consumer Electronics
  • Automotive
  • Medical Devices
  • Others
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Others
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Others
  • Asia Pacific
    • Japan
    • China
    • India
    • South Korea
    • Taiwan
    • Others

Table Of Contents

1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK 

5.  MOLDED INTERCONNECT DEVICES MARKET BY PROCESS

5.1. Introduction

5.2. Laser Direct Structuring

5.3. 2-shot molding

5.4. Film Techniques

6. MOLDED INTERCONNECT DEVICES MARKET BY PRODUCT TYPE

6.1. Introduction

6.2. Antennae and Connectivity Modules

6.3. Sensors

6.4. Connectors and Switches

6.5. Lighting

6.6. Others

7. MOLDED INTERCONNECT DEVICES MARKET BY APPLICATION

7.1. Introduction

7.2. Telecommunication

7.3. Consumer Electronics

7.4. Automotive

7.5. Medical Devices

7.6. Others

7.7. Manufacturers

7.8. Others

8.  MOLDED INTERCONNECT DEVICES MARKET BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. By Process

8.2.2. By Product Type

8.2.3. By Application

8.2.4. By Country

8.2.4.1. United States

8.2.4.2. Canada

8.2.4.3. Mexico

8.3. South America

8.3.1. By Process

8.3.2. By Product Type

8.3.3. By Application

8.3.4. By Country

8.3.4.1. Brazil 

8.3.4.2. Argentina

8.3.4.3. Others

8.4. Europe

8.4.1. By Process

8.4.2. By Product Type

8.4.3. By Application

8.4.4. By Country

8.4.4.1. United Kingdom

8.4.4.2. Germany

8.4.4.3. France

8.4.4.4. Italy

8.4.4.5. Others

8.5. Middle East & Africa

8.5.1. By Process

8.5.2. By Product Type

8.5.3. By Application

8.5.4. By Country

8.5.4.1. Saudi Arabia

8.5.4.2. UAE

8.5.4.3. Others

8.6. Asia Pacific

8.6.1. By Process

8.6.2. By Product Type

8.6.3. By Application

8.6.4. By Country

8.6.4.1. Japan

8.6.4.2. China

8.6.4.3. India

8.6.4.4. South Korea

8.6.4.5. Taiwan

8.6.4.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. TE Connectivity Ltd.

10.2. LPFK Laser and Electronics AG

10.3. Molex, LLC

10.4. MID Solutions GmbH

10.5. Lanxess AG

10.6. MacDermid, Inc.

10.7. RTP Company

10.8. Smart Plastic Products (S2P)

10.9. Harting Technology Group

10.10. Cicor Management AG

10.11. Amphenol Corporation

11. RESEARCH METHODOLOGY

LIST OF FIGURES

LIST OF TABLES

Companies Profiled

TE Connectivity Ltd.

LPFK Laser and Electronics AG

Molex, LLC

MID Solutions GmbH

Lanxess AG

MacDermid, Inc.

RTP Company

Smart Plastic Products (S2P)

Harting Technology Group

Cicor Management AG

Amphenol Corporation

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