Global Power Electronics Market Size, Share, Opportunities, And Trends By Material (Gallium Nitride, Silicon, Silicon Carbide, Others), By Device Type (Power Discrete, Power Module, Power IC), By End-User Industry (Communication and Technology, Consumer Electronics, Energy and Power, Automotive, Aerospace and Defense, Others) And By Geography - Forecasts From 2025 To 2030

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations

3.7. Strategic Recommendations

4. Technological Outlook

5. Global Power Electronics MARKET BY material

5.1. Introduction

5.2. Gallium Nitride (GaN)

5.3. Silicon (Si)

5.4. Silicon Carbide (SiC)

5.5. Others

6. Global Power Electronics MARKET BY device type

6.1. Introduction

6.2. Power Discrete

6.3. Power Module

6.4. Power IC

7. Global Power Electronics MARKET BY end-user industry

7.1. Introduction

7.2. Communication and Technology

7.3. Consumer Electronics

7.4. Energy and Power

7.5. Automotive

7.6. Aerospace and Defense

7.7. Others

8. Global Power Electronics MARKET BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. By Material

8.2.2. By Device Type

8.2.3. By End-User Industry

8.2.4. By Country

8.2.4.1. USA

8.2.4.2. Canada

8.2.4.3. Mexico

8.3. South America

8.3.1. By Material

8.3.2. By Device Type

8.3.3. By End-User Industry

8.3.4. By Country

8.3.4.1. Brazil

8.3.4.2. Argentina

8.3.4.3. Others

8.4. Europe

8.4.1. By Material

8.4.2. By Device Type

8.4.3. By End-User Industry

8.4.4. By Country

8.4.4.1. Germany

8.4.4.2. France

8.4.4.3. United Kingdom

8.4.4.4. Spain

8.4.4.5. Others

8.5. Middle East and Africa

8.5.1. By Material

8.5.2. By Device Type

8.5.3. By End-User Industry

8.5.4. By Country

8.5.4.1. Israel

8.5.4.2. Saudi Arabia

8.5.4.3. Others

8.6. Asia Pacific

8.6.1. By Material

8.6.2. By Device Type

8.6.3. By End-User Industry

8.6.4. By Country

8.6.4.1. China

8.6.4.2. Japan

8.6.4.3. South Korea

8.6.4.4. India

8.6.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. ABB

10.2. Texas Instruments

10.3. NXP Semiconductors

10.4. Infineon Technologies AG

10.5. Vishay Intertechnology, Inc

10.6. Semiconductor Component Industries LLC

10.7. Mitsubishi Electric Corporation

10.8. Toshiba International Corporation

10.9. Fuji Electric Corporation

10.10. STMicroelectronics

10.11. Semikron

10.12. ROHM Semiconductor

11. APPENDIX

11.1. Currency

11.2. Assumptions

11.3. Base and Forecast Years Timeline

11.4. Key benefits for the stakeholders

11.5. Research Methodology

11.6. Abbreviations

LIST OF FIGURES

LIST OF TABLES