The Hermetic packaging market is projected to grow at a CAGR of 5.44% to reach US$5.114 billion by 2025, from US$3.772 billion in 2019. Hermetic products protect against various environmental conditions such as atmospheric pressure, moisture, soil or other natural hazards that would otherwise disrupt the electrical connections or damage delicate electronics within a hermetic product. The hermetic packaging market is expected to have a significant market growth due to the adoption of hermetic packaging to protect highly sensitive electronic components. Increasing demand from the electronics, automobile, aerospace and defense sector is expected to drive the market growth. However stringent standards and rules with regard to hermetic packaging can be a restraint for market growth. By configuration, the multilayer ceramic packages segment is expected to have a significant growth rate as it offers greater hermeticity than other configuration for high-frequency applications. By type, the ceramic metal sealing segment is expected to have a considerable market share due to the growing demand for thermal shock resistant and low porosity type of hermetic packaging material. By application, the transistors segment is expected to have a significant market share as hermetically sealed transistors are used for designing telecommunication circuits and home appliances.
DRIVERS
Use of hermetic packaging to protect highly sensitive electronic components.
Increasing demand from electronics, automobile and aerospace industry
RESTRAINTS
Stringent rules and standards
INDUSTRY UPDATES
In June 2019, SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, entered into a purchase agreement to acquire the Australian microfluidic company MINIFAB Pty Ltd
Micross Components Ltd. announced the opening of its newly relocated and expanded processing facility in Orion Park, Crewe in March 2019
SEGMENTATION
The hermetic packaging market has been analyzed through the following segments:
By configuration
Multilayer ceramic packages
Metal can packages
Pressed ceramic packages
By type
Ceramic metal sealing
Glass metal sealing
Passivation glass
Transponder glass
Reed glass
By application
Transistors
Lasers
Photo diodes
Airbag ignitors
Others
By end-use industry
Military and defense
Aeronautics and space
Automotive
Energy and nuclear safety
Others
By Geography
North America
US
Canada
Mexico
South America
Brazil
Argentina
Others
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
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