Hermetic Packaging Market Size, Share, Opportunities, COVID-19 Impact, And Trends By Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), By Type (Ceramic Metal Sealing, Glass Metal Sealing, Passivation Glass, Transponder Glass, Reed Glass), By Application (Transistors, Lasers, Photo Diodes, Airbag Ignitors, Others), By End-Use Industry (Military And Defense, Aeronautics And Space, Automotive, Energy And Nuclear Safety, Others), And By Geography - Forecasts From 2020 To 2025

Published:  Apr 2021 Report Code: KSI061612330 Pages: 106

The Hermetic packaging market is projected to grow at a CAGR of 5.44% to reach US$5.114 billion by 2025, from US$3.772 billion in 2019. Hermetic products protect against various environmental conditions such as atmospheric pressure, moisture, soil, or other natural hazards that would otherwise disrupt the electrical connections or damage delicate electronics within a hermetic product. The hermetic packaging market is expected to have significant market growth due to the adoption of hermetic packaging to protect highly sensitive electronic components. Increasing demand from the electronics, automobile, aerospace, and defense sectors is expected to drive the market growth. However stringent standards and rules with regard to hermetic packaging can be a restraint for market growth. By configuration, the multilayer ceramic packages segment is expected to have a significant growth rate as it offers greater hermeticity than other configurations for high-frequency applications. By type, the ceramic metal sealing segment is expected to have a considerable market share due to the growing demand for thermal shock resistance and low porosity type of hermetic packaging material. By application, the transistors segment is expected to have a significant market share as hermetically sealed transistors are used for designing telecommunication circuits and home appliances.

DRIVERS

  • Use of hermetic packaging to protect highly sensitive electronic components.

  • Increasing demand from the electronics, automobile, and aerospace industry

RESTRAINTS

  • Stringent rules and standards

INDUSTRY UPDATES

  • In June 2019, SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, entered into a purchase agreement to acquire the Australian microfluidic company MINIFAB Pty Ltd

  • Micross Components Ltd. announced the opening of its newly relocated and expanded processing facility in Orion Park, Crewe in March 2019

Hermetic Packaging Market Scope:

Report Metric Details
 Market size value in 2019  US$3.772 billion
 Market size value in 2025  US$5.114 billion
 Growth Rate  CAGR of 5.44% from 2019 to 2025
 Base year  2019
 Forecast period  2020–2025
 Forecast Unit (Value)  USD Billion
 Segments covered  Configuration, Type, Application, End-Use Industry, And Geography
 Regions covered  North America, South America, Europe, Middle East and Africa, Asia Pacific
 Companies covered SCHOTT AG, AMETEK, Amkor Technology, Texas Instruments, Teledyne Microelectronics, Kyocera Corporation, Materion Corporation, Egide, Micross Components, Legacy Technologies 
 Customization scope  Free report customization with purchase

 

SEGMENTATION

The hermetic packaging market has been analyzed through the following segments:

By configuration

  • Multilayer ceramic packages

  • Metal can packages

  • Pressed ceramic packages

By type

  • Ceramic metal sealing

  • Glass metal sealing

  • Passivation glass

  • Transponder glass

  • Reed glass

By application

  • Transistors

  • Lasers

  • Photo diodes

  • Airbag ignitors

  • Others

By end-use industry

  • Military and defense

  • Aeronautics and space

  • Automotive

  • Energy and nuclear safety

  • Others

By Geography

  • North America

    • US

    • Canada

    • Mexico

  • South America

    • Brazil

    • Argentina

    • Others

    • Germany

    • France

    • United Kingdom

    • Spain

    • Others

  • Middle East and Africa

    • Saudi Arabia

    • Israel

    • Others

  • Asia Pacific

    • China

    • Japan

    • South Korea

    • India

    • Others


Frequently Asked Questions (FAQs)

Q1. What will be the hermetic packaging market size by 2025?
A1. The hermetic packaging market is projected to reach a market size of US$5.114 billion by 2025.

Q2. What are the growth prospects for the hermetic packaging market?
A2. The global hermetic packaging market is projected to grow at a CAGR of 5.44% over the forecast period.

Q3. What is the size of global hermetic packaging market?
A3. Hermetic Packaging market was valued at US$3.772 billion in 2019.

Q4. What factors are anticipated to drive the hermetic packaging market growth?
A4. Increasing demand from the electronics, automobile, aerospace, and defense sector is expected to drive the hermetic packaging market growth. 

Q5. How is the global hermetic packaging market segmented?
A5. The global hermetic packaging market has been segmented by configuration, type, application, end-use industry, and geography.

1. INTRODUCTION

1.1. MARKET OVERVIEW

1.2. MARKET DEFINITION

1.3. SCOPE OF THE STUDY

1.4. CURRENCY

1.5. ASSUMPTIONS

1.6. BASE, AND FORECAST YEARS TIMELINE

2. RESEARCH METHODOLOGY 

2.1. RESEARCH DESIGN

2.2. SECONDARY SOURCES

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. MARKET SEGMENTATION

4.2. MARKET DRIVERS

4.3. MARKET RESTRAINTS

4.4. MARKET OPPORTUNITIES

4.5. PORTER’S FIVE FORCE ANALYSIS

4.5.1. BARGAINING POWER OF SUPPLIERS

4.5.2. BARGAINING POWER OF BUYERS

4.5.3. THREAT OF NEW ENTRANTS

4.5.4. THREAT OF SUBSTITUTES

4.5.5. COMPETITIVE RIVALRY IN THE INDUSTRY

4.6. LIFE CYCLE ANALYSIS - REGIONAL SNAPSHOT

4.7. MARKET ATTRACTIVENESS

5. HERMETIC PACKAGING MARKET BY CONFIGURATION

5.1. MULTILAYER CERAMIC PACKAGES

5.2. METAL CAN PACKAGES

5.3. PRESSED CERAMIC PACKAGES

6. HERMETIC PACKAGING MARKET BY TYPE

6.1. CERAMIC METAL SEALING

6.2. GLASS METAL SEALING

6.3. PASSIVASION GLASS

6.4. TRANSPONDER GLASS

6.5. REED GLASS

7. HERMETIC PACKAGING MARKET BY APPLICATION

7.1. TRANSISTORS

7.2. LASERS

7.3. PHOTO DIODES

7.4. AIRBAG IGNITORS

7.5. OTHERS

8. HERMETIC PACKAGING MARKET BY END-USE INDUSTRY

8.1. MILITARY AND DEFENCE

8.2. AERONAUTICS AND SPACE

8.3. AUTOMOTIVE

8.4. ENERGY AND NUCLEAR SAFETY

8.5. OTHERS

9. HERMETIC PACKAGING MARKET BY GEOGRAPHY

9.1. NORTH AMERICA

9.1.1. USA

9.1.2. CANADA

9.1.3. MEXICO

9.2. SOUTH AMERICA

9.2.1. BRAZIL

9.2.2. ARGENTINA

9.2.3. OTHERS

9.3. EUROPE

9.3.1. GERMANY

9.3.2. FRANCE

9.3.3. UNITED KINGDOM

9.3.4. SPAIN

9.3.5. OTHERS

9.4. MIDDLE EAST AND AFRICA

9.4.1. SAUDI ARABIA

9.4.2. ISRAEL

9.4.3. OTHERS

9.5. ASIA PACIFIC

9.5.1. CHINA

9.5.2. JAPAN

9.5.3. SOUTH KOREA

9.5.4. INDIA

9.5.5. OTHERS

10. COMPETITIVE INTELLIGENCE

10.1. COMPANY BENCHMARKING AND ANALYSIS

10.2. RECENT INVESTMENT AND DEALS

10.3. STRATEGIES OF KEY PLAYERS

11. COMPANY PROFILES

11.1. SCHOTT AG

11.2. AMETEK

11.3. AMKOR TECHNOLOGY

11.4. TEXAS INSTRUMENTS

11.5. TELEDYNE MICROELECTRONICS

11.6. KYOCERA CORPORATION

11.7. MATERION CORPORATION

11.8. EGIDE

11.9. MICROSS COMPONENTS

11.10. LEGACY TECHNOLOGIES

LIST OF FIGURES

LIST OF TABLES

SCHOTT AG

AMETEK

Amkor Technology

Texas Instruments

Teledyne Microelectronics

Kyocera Corporation

Materion Corporation

Egide

Micross Components

Legacy Technologies 

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