The Hermetic packaging market is projected to grow at a CAGR of 5.44% to reach US$5.114 billion by 2025, from US$3.772 billion in 2019. Hermetic products protect against various environmental conditions such as atmospheric pressure, moisture, soil, or other natural hazards that would otherwise disrupt the electrical connections or damage delicate electronics within a hermetic product. The hermetic packaging market is expected to have significant market growth due to the adoption of hermetic packaging to protect highly sensitive electronic components. Increasing demand from the electronics, automobile, aerospace, and defense sectors is expected to drive the market growth. However stringent standards and rules with regard to hermetic packaging can be a restraint for market growth. By configuration, the multilayer ceramic packages segment is expected to have a significant growth rate as it offers greater hermeticity than other configurations for high-frequency applications. By type, the ceramic metal sealing segment is expected to have a considerable market share due to the growing demand for thermal shock resistance and low porosity type of hermetic packaging material. By application, the transistors segment is expected to have a significant market share as hermetically sealed transistors are used for designing telecommunication circuits and home appliances.

DRIVERS

• Use of hermetic packaging to protect highly sensitive electronic components.

• Increasing demand from the electronics, automobile, and aerospace industry

RESTRAINTS

• Stringent rules and standards

INDUSTRY UPDATES

• In June 2019, SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, entered into a purchase agreement to acquire the Australian microfluidic company MINIFAB Pty Ltd

• Micross Components Ltd. announced the opening of its newly relocated and expanded processing facility in Orion Park, Crewe in March 2019

SEGMENTATION

The hermetic packaging market has been analyzed through the following segments:

By configuration

• Multilayer ceramic packages

• Metal can packages

• Pressed ceramic packages

By type

• Ceramic metal sealing

• Glass metal sealing

• Passivation glass

• Transponder glass

• Reed glass

By application

• Transistors

• Lasers

• Photo diodes

• Airbag ignitors

• Others

By end-use industry

• Military and defense

• Aeronautics and space

• Automotive

• Energy and nuclear safety

• Others

By Geography

• North America

  • US

  • Canada

  • Mexico

• South America

  • Brazil

  • Argentina

  • Others

  • Germany

  • France

  • United Kingdom

  • Spain

  • Others

• Middle East and Africa

  • Saudi Arabia

  • Israel

  • Others

• Asia Pacific

  • China

  • Japan

  • South Korea

  • India

  • Others