The Hermetic packaging market is projected to grow at a CAGR of 5.44% to reach US$5.114 billion by 2025, from US$3.772 billion in 2019. Hermetic products protect against various environmental conditions such as atmospheric pressure, moisture, soil, or other natural hazards that would otherwise disrupt the electrical connections or damage delicate electronics within a hermetic product. The hermetic packaging market is expected to have significant market growth due to the adoption of hermetic packaging to protect highly sensitive electronic components. Increasing demand from the electronics, automobile, aerospace, and defense sectors is expected to drive the market growth. However stringent standards and rules with regard to hermetic packaging can be a restraint for market growth. By configuration, the multilayer ceramic packages segment is expected to have a significant growth rate as it offers greater hermeticity than other configurations for high-frequency applications. By type, the ceramic metal sealing segment is expected to have a considerable market share due to the growing demand for thermal shock resistance and low porosity type of hermetic packaging material. By application, the transistors segment is expected to have a significant market share as hermetically sealed transistors are used for designing telecommunication circuits and home appliances.
DRIVERS
Use of hermetic packaging to protect highly sensitive electronic components.
Increasing demand from the electronics, automobile, and aerospace industry
RESTRAINTS
Stringent rules and standards
INDUSTRY UPDATES
In June 2019, SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, entered into a purchase agreement to acquire the Australian microfluidic company MINIFAB Pty Ltd
Micross Components Ltd. announced the opening of its newly relocated and expanded processing facility in Orion Park, Crewe in March 2019
Report Metric | Details |
Market size value in 2019 | US$3.772 billion |
Market size value in 2025 | US$5.114 billion |
Growth Rate | CAGR of 5.44% from 2019 to 2025 |
Base year | 2019 |
Forecast period | 2020–2025 |
Forecast Unit (Value) | USD Billion |
Segments covered | Configuration, Type, Application, End-Use Industry, And Geography |
Regions covered | North America, South America, Europe, Middle East and Africa, Asia Pacific |
Companies covered | SCHOTT AG, AMETEK, Amkor Technology, Texas Instruments, Teledyne Microelectronics, Kyocera Corporation, Materion Corporation, Egide, Micross Components, Legacy Technologies |
Customization scope | Free report customization with purchase |
SEGMENTATION
The hermetic packaging market has been analyzed through the following segments:
By configuration
Multilayer ceramic packages
Metal can packages
Pressed ceramic packages
By type
Ceramic metal sealing
Glass metal sealing
Passivation glass
Transponder glass
Reed glass
By application
Transistors
Lasers
Photo diodes
Airbag ignitors
Others
By end-use industry
Military and defense
Aeronautics and space
Automotive
Energy and nuclear safety
Others
By Geography
North America
US
Canada
Mexico
South America
Brazil
Argentina
Others
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
Frequently Asked Questions (FAQs)
Q1. What will be the hermetic packaging market size by 2025?
A1. The hermetic packaging market is projected to reach a market size of US$5.114 billion by 2025.
Q2. What are the growth prospects for the hermetic packaging market?
A2. The global hermetic packaging market is projected to grow at a CAGR of 5.44% over the forecast period.
Q3. What is the size of global hermetic packaging market?
A3. Hermetic Packaging market was valued at US$3.772 billion in 2019.
Q4. What factors are anticipated to drive the hermetic packaging market growth?
A4. Increasing demand from the electronics, automobile, aerospace, and defense sector is expected to drive the hermetic packaging market growth.
Q5. How is the global hermetic packaging market segmented?
A5. The global hermetic packaging market has been segmented by configuration, type, application, end-use industry, and geography.
1. INTRODUCTION
1.1. MARKET OVERVIEW
1.2. MARKET DEFINITION
1.3. SCOPE OF THE STUDY
1.4. CURRENCY
1.5. ASSUMPTIONS
1.6. BASE, AND FORECAST YEARS TIMELINE
2. RESEARCH METHODOLOGY
2.1. RESEARCH DESIGN
2.2. SECONDARY SOURCES
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. MARKET SEGMENTATION
4.2. MARKET DRIVERS
4.3. MARKET RESTRAINTS
4.4. MARKET OPPORTUNITIES
4.5. PORTER’S FIVE FORCE ANALYSIS
4.5.1. BARGAINING POWER OF SUPPLIERS
4.5.2. BARGAINING POWER OF BUYERS
4.5.3. THREAT OF NEW ENTRANTS
4.5.4. THREAT OF SUBSTITUTES
4.5.5. COMPETITIVE RIVALRY IN THE INDUSTRY
4.6. LIFE CYCLE ANALYSIS - REGIONAL SNAPSHOT
4.7. MARKET ATTRACTIVENESS
5. HERMETIC PACKAGING MARKET BY CONFIGURATION
5.1. MULTILAYER CERAMIC PACKAGES
5.2. METAL CAN PACKAGES
5.3. PRESSED CERAMIC PACKAGES
6. HERMETIC PACKAGING MARKET BY TYPE
6.1. CERAMIC METAL SEALING
6.2. GLASS METAL SEALING
6.3. PASSIVASION GLASS
6.4. TRANSPONDER GLASS
6.5. REED GLASS
7. HERMETIC PACKAGING MARKET BY APPLICATION
7.1. TRANSISTORS
7.2. LASERS
7.3. PHOTO DIODES
7.4. AIRBAG IGNITORS
7.5. OTHERS
8. HERMETIC PACKAGING MARKET BY END-USE INDUSTRY
8.1. MILITARY AND DEFENCE
8.2. AERONAUTICS AND SPACE
8.3. AUTOMOTIVE
8.4. ENERGY AND NUCLEAR SAFETY
8.5. OTHERS
9. HERMETIC PACKAGING MARKET BY GEOGRAPHY
9.1. NORTH AMERICA
9.1.1. USA
9.1.2. CANADA
9.1.3. MEXICO
9.2. SOUTH AMERICA
9.2.1. BRAZIL
9.2.2. ARGENTINA
9.2.3. OTHERS
9.3. EUROPE
9.3.1. GERMANY
9.3.2. FRANCE
9.3.3. UNITED KINGDOM
9.3.4. SPAIN
9.3.5. OTHERS
9.4. MIDDLE EAST AND AFRICA
9.4.1. SAUDI ARABIA
9.4.2. ISRAEL
9.4.3. OTHERS
9.5. ASIA PACIFIC
9.5.1. CHINA
9.5.2. JAPAN
9.5.3. SOUTH KOREA
9.5.4. INDIA
9.5.5. OTHERS
10. COMPETITIVE INTELLIGENCE
10.1. COMPANY BENCHMARKING AND ANALYSIS
10.2. RECENT INVESTMENT AND DEALS
10.3. STRATEGIES OF KEY PLAYERS
11. COMPANY PROFILES
11.1. SCHOTT AG
11.2. AMETEK
11.3. AMKOR TECHNOLOGY
11.4. TEXAS INSTRUMENTS
11.5. TELEDYNE MICROELECTRONICS
11.6. KYOCERA CORPORATION
11.7. MATERION CORPORATION
11.8. EGIDE
11.9. MICROSS COMPONENTS
11.10. LEGACY TECHNOLOGIES
LIST OF FIGURES
LIST OF TABLES
SCHOTT AG
AMETEK
Amkor Technology
Texas Instruments
Teledyne Microelectronics
Kyocera Corporation
Materion Corporation
Egide
Micross Components
Legacy Technologies
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