High-Density Packaging Market Size, Share, Opportunities, And Trends By Type (MCM (Multi-Chip Module), MCP (Multi-Chip Packaging), SIP (System-in-Package), 3D-TSV (Through-Silicon Via)), By Application (Automotive, Aerospace, Electronics, Telecommunications, Others), And By Geography - Forecasts From 2023 To 2028

  • Published : Apr 2023
  • Report Code : KSI061614982
  • Pages : 118

Complex IC chips are organised by Advanced Packaging using a range of high-density packaging techniques such as MCM, MCP, SIP, and others. Consumer electronics devices, IT & Telecom, automotive, medical devices, and other gadgets are where the principal applications are found.

Consumer electronics may be found in a variety of high-density packaging formats, including MCM, MCP, SIP, and 3D-TSV. The market for high-density packaging has attracted the most interest from the financial community. The market needs for high-density packing is enormous due to the shift in customer preferences for the newest technology and the ongoing innovation by key companies for electronic gadgets. High-density packing will rise as a result of the Internet of Things (IoT), as most populations are moving more towards linked gadgets. This industry will benefit from a rise in demand for consumer wearable products, cell phones, and home appliances. More power dissipation, quicker speeds, and more pins are continually required by the electronics sector, combined with smaller footprints and lower profiles. Tablets, smartphones, and the newly developing Internet of Things devices are becoming smaller, lighter, and more portable thanks to the shrinking and integration of high-density semiconductor packaging.

Amkor, for example, provides more than 3000 different packaging options, including those for high-density packaging uses including automotive, stacked die, MEMS, TSV, and 3D packaging. The market will be driven throughout the projected period by favourable government policies in emerging nations. High startup costs, however, could limit the market.

Increased Use in the Consumer Electronics Sector to Accelerate Market Growth

In addition to compact steps and low profiles, the electronic industry constantly aims to distribute high power, quick speeds, and high pin counts. Devices like tablets, smartphones, and upcoming IoT gadgets are now smaller, lighter, and more portable because of the shrinking and integration of high-performance semiconductor implants. Even though demand has reduced because IC costs have declined, consumer electronics items will continue to drive up demand, according to statistics on the global semiconductor trade. For instance, sales of smartphones have increased consistently in the U.S. It is important to promote the highest packaging market in other regions because this trend is probably going to continue.

Enhanced System Performances and Superior Packaging Optimization

To enhance the design of next-generation chips, the packaging sector offers sophisticated IC containers. The integrated circuit industry has historically employed conventional chip measurements and novel device fabrication. Moreover, a data centre, consumer electronics, a network, and several chip packages found on all phones all contribute to the development of sophisticated packages by enhancing system performance. Because pre-packaging enables the integration of diverse processing materials and memories to be put together using extremely high-level communication, it supports the use of AI, machine learning, and in-depth learning. Several industry trends, including those in the automotive, healthcare, aerospace, and military industries, as well as the industrial sector, which currently employs innovative packaging that will drive market expansion in the future, benefit from enhanced operational skills and direct performance.

Asia Pacific is projected to be the prominent market shareholder in the high-density packaging market globally and is anticipated to continue throughout the forecast period.

A prominent revenue-generating region throughout the projected period, Asia-Pacific is anticipated to develop at a healthy rate largely due to the expanding population and customer-side demand. The need for high-density packing in the industry is being fueled by well-known high-density packaging businesses that are present in the area. Moreover, China has the world's biggest population and fastest-growing economy, and the country's semiconductor association reports that IC imports are rising. Additionally, to realise its objective of dominating the world in all key IC industrial supply chain sectors, the Chinese government has implemented a multifaceted strategy to assist the growth of the local IC industry. It is projected that this expansion of the region's semiconductor IC sector would increase demand for high-density packaging.

Market Key Developments

  • In January 2023, To fulfil the rising demand for premium chip testing and packaging services, Siliconware Precision Industries Co (SPIL) opened a new plant in the Erlin Township in Changhua County.
  • In January 2022, Samsung Electronics Co. of South Korea announced a brand-new chip packaging innovation called H-Cube that stacks high-performance processors in significantly smaller sizes.
  • In November 2021, Amkor Technologies, Inc., a top provider of semiconductor packaging and test services (NASDAQ: AMKR), today declared its intention to construct a cutting-edge smart factory in Bac Ninh, Vietnam.



  • By Type
    • MCM (multi-chip module)
    • MCP (multi-chip packaging)
    • SIP (system-in-package)
    • 3D-TSV (through-silicon via)
  • By Application
    • Automotive
    • Aerospace
    • Electronics
    • Telecommunications
    • Others
  • By Geography


    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Taiwan
      • Others


1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline


2.1. Research Data

2.2. Assumptions


3.1. Research Highlights


4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Force Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis


5.1. Introduction

5.2. MCM (multi-chip module)

5.3. MCP (multi-chip packaging)

5.4. SIP (system-in-package)

5.5. 3D-TSV (through-silicon via)


6.1. Introduction

6.2. Automotive

6.3. Aerospace

6.4. Electronics

6.5. Telecommunications

6.6. Others


7.1. Introduction

7.2. North America

7.2.1. USA

7.2.2. Canada

7.2.3. Mexico

7.3. South America

7.3.1. Brazil

7.3.2. Argentina

7.3.3. Others

7.4. Europe

7.4.1. UK

7.4.2. Germany

7.4.3. France

7.4.4. Italy

7.4.5. Spain

7.4.6. Others

7.5. Middle East and Africa

7.5.1. Saudi Arabia

7.5.2. UAE

7.5.3. Others

7.6. Asia Pacific

7.6.1. China

7.6.2. Japan

7.6.3. India

7.6.4. South Korea

7.6.5. Taiwan

7.6.6. Others


8.1. Major Players and Strategy Analysis

8.2. Emerging Players and Market Lucrativeness

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Vendor Competitiveness Matrix


9.1. Fujitsu Ltd

9.2. Amkor Technology

9.3. Siliconware Precision Industries

9.4. Samsung Group

9.5. Micron Technology

9.6. STMicroelectronics

9.7. Siemens

9.8. Biwin

9.9. JCET Group Co Ltd


9.10. Kyocera Corporation

Fujitsu Ltd

Amkor Technology

Siliconware Precision Industries

Samsung Group

Micron Technology




JCET Group Co Ltd

Kyocera Corporation

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