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Probe Card Market - Strategic Insights and Forecasts (2025-2030)

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Table of Contents

1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK 

5. PROBE CARD MARKET BY TYPE

5.1. Introduction

5.2. Advanced Probe Card

5.3. Standard Probe Card

6. PROBE CARD MARKET BY TECHNOLOGY TYPE

6.1. Introduction

6.2. Vertical

6.3. MEMS

6.4. Cantilever 

6.5. Specialty 

6.6. Others

7. PROBE CARD MARKET BY WAFER SIZE

7.1. Introduction

7.2. Up to 5 Inches

7.3. 5 to 8 Inches

7.4. Greater than 8 Inches

8. PROBE CARD MARKET BY MATERIAL

8.1. Introduction

8.2. Silicon

8.3. Tungsten

8.4. Others

9. PROBE CARD MARKET BY APPLICATION

9.1. Introduction

9.2. DRAM 

9.3. Parametric 

9.4. Foundry & Logic

9.5. Others

10. PROBE CARD MARKET BY GEOGRAPHY

10.1. Introduction

10.2. North America

10.2.1. By Probe Type

10.2.2. By Technology Type

10.2.3. By Wafer Size

10.2.4. By Material

10.2.5. By Application

10.2.6. By Country

10.2.6.1. United States

10.2.6.2. Canada

10.2.6.3. Mexico

10.3. South America

10.3.1. By Probe Type

10.3.2. By Technology Type

10.3.3. By Wafer Size

10.3.4. By Material

10.3.5. By Application

10.3.6. By Country

10.3.6.1. Brazil 

10.3.6.2. Argentina

10.3.6.3. Others

10.4. Europe

10.4.1. By Probe Type

10.4.2. By Technology Type

10.4.3. By Wafer Size

10.4.4. By Material

10.4.5. By Application

10.4.6. By Country

10.4.6.1. United Kingdom

10.4.6.2. Germany

10.4.6.3. France

10.4.6.4. Italy

10.4.6.5. Spain

10.4.6.6. Others

10.5. Middle East & Africa

10.5.1. By Probe Type

10.5.2. By Technology Type

10.5.3. By Wafer Size

10.5.4. By Material

10.5.5. By Application

10.5.6. By Country

10.5.6.1. Saudi Arabia

10.5.6.2. UAE

10.5.6.3. Others

10.6. Asia Pacific

10.6.1. By Probe Type

10.6.2. By Technology Type

10.6.3. By Wafer Size

10.6.4. By Material

10.6.5. By Application

10.6.6. By Country

10.6.6.1. Japan

10.6.6.2. China

10.6.6.3. India

10.6.6.4. South Korea

10.6.6.5. Taiwan

10.6.6.6. Thailand

10.6.6.7. Indonesia

10.6.6.8. Others

11. COMPETITIVE ENVIRONMENT AND ANALYSIS

11.1. Major Players and Strategy Analysis

11.2. Market Share Analysis

11.3. Mergers, Acquisitions, Agreements, and Collaborations

11.4. Competitive Dashboard

12. COMPANY PROFILES

12.1. Japan Electronic Materials  Corporation

12.2. Micronics Japan Co., Ltd 

12.3. Korea Instruments Co., Ltd 

12.4. FormFactor 

12.5. Feinmetall 

12.6. Nidec SV Probe 

12.7. TSE Co., Ltd. 

12.8. Willtechnology 

12.9. Suzhou Silicon Test System Co., Ltd.

12.10. Technoprobe S.p . A.

12.11. MPI Corporation 

12.12. Wentworth Laboratories, Inc

13. APPENDIX

13.1. Currency 

13.2. Assumptions

13.3. Base and Forecast Years Timeline

13.4. Key benefits for the stakeholders

13.5. Research Methodology 

13.6. Abbreviations 

REPORT DETAILS

Report ID:KSI061616867
Published:May 2025
Pages:145
Format:PDF, Excel, PPT, Dashboard
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