3D Semiconductor Packaging Market Size, Share, Opportunities, COVID-19 Impact, And Trends By Technology (Through Silicon Vias, Fan Out Wafer Level Packaging, Wire Bonding, Others), By Industry Vertical (Electronics, Communication And Technology, Manufacturing, Automotive, Defense And Aerospace, Healthcare, Others), By Material (Bonding Wire, Lead Frame, Organic Substrate, Encapsulation Resin, Ceramic Package, Die Attach Material, Others), And By Geography - Forecasts From 2019 To 2024
- Published : May 2021
- Report Code : KSI061612602
- Pages : 124
The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.
Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
3D Semiconductor Packaging Market Scope:
|Market size value in 2018||US$2.688 billion|
|Market size value in 2024||US$6.044 billion|
|Growth Rate||CAGR of 14.46% from 2018 to 2024|
|Forecast Unit (Value)||USD Billion|
|Segments covered||Technology, Industry Vertical, Material, And Geography|
|Regions covered||North America, South America, Europe, Middle East and Africa, Asia Pacific|
|Companies covered||Samsung Electronics, Intel Corporation, Xilinx, Sony, Taiwan Semiconductor Manufacturing Company Ltd, Amkor Technology Inc, ASE Group, Microchip, Siliconware Precision Industries Co, GlobalFoundries Inc., Applied Materials, International Business Machines Corp., Tezzaron Semiconductors, STATS ChipPAC Ltd, Micralyne, Inc, Toshiba Corp., SK Hynix|
|Customization scope||Free report customization with purchase|
The 3D Semiconductor packaging market has been analyzed through the following segments:
Through Silicon Vias (TSV)
Fan Out Wafer Level Packaging
By Industry Vertical
Communication and Technology
Defense and Aerospace
Die Attach Material
Middle East and Africa
Frequently Asked Questions (FAQs)
Q1. What will be the 3D semiconductor packaging market size by 2024?
A1. The 3D semiconductor packaging market is expected to reach the market size of US$6.044 billion in 2024.
Q2. What is the size of 3D semiconductor packaging market?
A2. 3D Semiconductor Packaging market was valued at US$2.688 billion in 2018.
Q3. What are the growth prospects for 3D semiconductor packaging market?
A3. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% over the forecast period.
Q4. What factors are anticipated to drive the 3D semiconductor packaging market growth?
A4. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.
Q5. How is the 3D semiconductor packaging market segmented?
A5. The 3D semiconductor packaging market has been segmented by technology, industry vertical, material, and geography.
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. KEY FINDINGS
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. 3D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY
5.1. Through Silicon Vias (TSV)
5.2. Fan Out Wafer Level Packaging
5.3. Wire Bonding
6. 3D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL
6.2. Communication and Technology
6.5. Defense and Aerospace
7. 3D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL
7.1. Bonding Wire
7.2. Lead frame
7.3. Organic Substrate
7.4. Encapsulation Resin
7.5. Organic Substrate
7.6. Ceramic Package
7.7. Die Attach Material
8. 3D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY
8.1. North America
8.2. South America
8.3.1. United Kingdom
8.4. Middle East and Africa
8.4.3. Saudi Arabia
8.5. Asia Pacific
8.5.3. South Korea
9. COMPETITIVE INTELLIGENCE
9.1. Competitive Benchmarking and Analysis
9.2. Recent Investments and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Samsung Electronics
10.2. Intel Corporation
10.5. Taiwan Semiconductor Manufacturing Company
10.6. Amkor Technology Inc
10.7. ASE Group
10.9. Siliconware PrecisionIndustries Co.
10.10. GlobalFOundries Inc
10.11. Applied Materials
10.12. International Busines Machines Corp.
10.13. Tezzaron Semiconductors
10.14. STATS ChipPac Ltd
10.15. Micralyne, Inc
10.17. SK Hynix
LIST OF FIGURES
LIST OF TABLES
Taiwan Semiconductor Manufacturing Company Ltd
Amkor Technology Inc
Siliconware Precision Industries Co
International Business Machines Corp.
STATS ChipPAC Ltd
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