The 3D semiconductor packaging market is projected to grow at a CAGR of 12.68% between 2025 to 2030.
The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.
DRIVERS
Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.
RESTRAINTS
Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns
RECENT DEVELOPMENTS
In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.
Segmentation
The 3D Semiconductor packaging market has been analyzed through the following segments: