Global 3D TSV Devices Market Size, Share, Opportunities, And Trends By Application (LED Packaging, Memory, Sensors, Others), By End User (Automotive, Consumer Electronics, Aerospace, Healthcare, Others), And By Geography - Forecasts From 2023 To 2028

The 3D TSV devices is projected to grow considerably during the forecast period

A TSV (Through Silicone Via) is an electrical connection that runs vertically through a silicon wafer or dies. TSVs are high-performance interconnected technology that can be utilised in place of flip chips and wire bonding to make 3D packages. 3D TSV devices have high density and shorter connections which makes them useful in next-generation miniature electronic devices.

Growing demand for the miniaturization of electronic devices and the adoption of cutting-edge chip designs with improved properties are some of the primary factors driving the growth of the global market during the analysis period. Significant technological progress along with continuous product innovations and rising R&D operations by key market players is also propelling the growth of the global market. The demand for 3D TSV devices will skyrocket with the development of the Internet of Things, wearable electronics, augmented reality, virtual reality, and high-performance PCs.

However, the demand for 3D TSV devices is being constrained by several factors, including latency, area, thermal issues and power overhead brought on by non-negligible TSV area and capacitance. However, growing demand for sensor technology from healthcare, military and automotive is providing multiple opportunities for key market players during the forecast period.

During the anticipation period, the rising demand for 3D TSV devices in LED packaging will support the growth of the global market during the projection period.

Based on application the market for 3D TSV devices is segmented into LED packaging, Memory, Sensor and Others. The led packaging segment is anticipated to hold a significant market share during the analysis period. Light-emitting diodes or LEDs are being used in various electronic devices and other goods, which has accelerated the development of gadgets with better power, greater density, and cheaper prices. Through-silicon via or TSV technology used in three-dimensional packaging enables dense vertical interconnects which reduces the length of the connection. Due to this, capacitances, inductances, and resistances are required, resulting in higher speeds and lower power consumption.

Growing demand for electronic devices such as computers with high bandwidth memory is also propelling the demand for 3D TSV devices as this technology features shorter data transmission resulting in faster speed, high memory and lower power consumption. These devices are important for new-age applications such as high-power computing and AI. Companies in this market are launching new and innovative technology to provide 3D packaging solutions which are spurring demand even further. For instance, In October 2019, the first 12-layer 3D-TSV technology was launched by Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology.

The new technology keeps the width of the existing 8-layer device while stacking 12 DRAM chips utilising more than 60,000 TSV holes. This 8-layer High Bandwidth Memory-2 product still has the same package thickness of 720 m, which represents a significant development in component design. Customers will be able to introduce high-capacity, next-generation products with improved performance without having to alter their system configuration designs.

Asia Pacific is anticipated to hold a significant amount of the global 3D TSV devices market share during the forecast period.

Asia Pacific region is anticipated to hold a significant market share in 3D TSV devices. This region will witness high growth during the forecast period owing to the well-established consumer electronics and semiconductor industry in countries such as South Korea, China and Japan. Consumer electronics have grown more rapidly as a result of the growing popularity of smartphones and the demand for new memory technologies, opening up a wide range of opportunities in this region. The introduction of 5G technology is anticipated to increase sales of 5G smartphones, which could expand the market in the telecommunications industry because silicon wafers are frequently used to manufacture smartphones.

The 3D TSV device market is anticipated to grow strongly due to rising sales of 3D TSV MEMS and sensors and growing technological advancements in consumer applications like smartphones, tablets, and wearables in the Asia Pacific region. The presence of key market players such as TSMC, Samsung Group, Toshiba Corporation and ASE group is also propelling the growth of the 3D TSV devices market in this region. Prime markets in the Asia Pacific region are India, China, Japan, South Korea, Taiwan, Thailand and Indonesia.

Market Key Developments

• In August 2020, Samsung Electronics launched eXtended-Cube, also known as "X-Cube," which is a revolutionary 3D IC packaging method that enables the chip-stacking of SRAM dies atop a base logic die using TSVs. Samsung’s X-Cube is considerably different to these current technologies in that it does away with intermediary interposers or silicon bridges, and directly joins a stacked chip on top of the core logic die of a design.
• In June 2022, to manage the power to chiplets in the 3D stacked system in package designs, Intel developed Fully Integrated Voltage Regulators (FIVR) with embedded inductors. The 3D-TSV-Stacked SIP utilises a self-trimmed, digitally controlled ON-Time Discontinuous Conduction Mode (DCM) architecture and is constructed in a 22nm CMOS with an active silicon interposer.

Global 3D TSV Devices Market Scope:

Segmentation:

• By Application
  • LED Packaging
  • Memory
  • Sensors
  • Others
• By End User
  • Automotive
  • Consumer Electronics
  • Aerospace
  • Healthcare
  • Others
• By Geography
  • North America
    • USA
    • Canada
    • Others
  • South America
    • Brazil
    • Others
  • Europe
    • Germany
    • UK
    • France
    • Others
  • Middle East and Africa
    • Israel
    • Others
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • India
    • Taiwan
    • Thailand
    • Indonesia
    • Others