3D IC Packaging Market Size, Share, Opportunities, And Trends By Technology (3D TSV (through Silicon Via), 3D Wafer-level Packaging), By Application (Consumer Electronics, Automotives, IT And Communication, Others), And By Geography - Forecasts From 2023 To 2028

Market Overview:

A 3DIC is a three-dimensional integrated circuit (IC) created by vertically stacking various chips or wafers into a single box. Through-silicon vias (TSVs) or hybrid bonding are used to link the device inside the packaging. Allowing more processing in a small space while using less power is essential due to the high demand for data computation. For 2D designs, on the other hand, greater processing translates into a larger chip with more power. Vertical integration or 3D designs have become an effective remedy. A 3DIC design maintains or reduces area while increasing functional density at the same or lower power. The package size for electronic gadgets is reduced as a result. Using 3D packaging techniques, several IC can be contained in a single container. For the shortest connectivity and smallest package footprint, active chips are integrated through die stacking in 3D structures. Due to their advantages in obtaining exceptionally high package densities and good energy efficiency, 3D has gained pace as an attractive chipset integration platform in recent years.

Due to several emerging new technologies, the use of 3D-TSV has expanded.

The semiconductor market is expanding rapidly as the world navigates the data-centric era, with the growth being driven by devices used in applications for artificial intelligence (AI), machine learning (ML), 5G communications, high-performance computing (HPC), the Internet of Things (IoT), and automotive. Never before has there been such a high demand for cutting-edge wafer-level fabrication methods, complex packaging technologies, and all-encompassing product and testing solutions. As applications demand solutions that offer higher performance, greater functionality, and increased power while meeting strict cost limitations, the role of packaging has become increasingly important. Therefore, during the projection period, the 3D-TSV (Through Silicon Via) market will be driven by the rising need for high-performance computing applications. For instance, A subsidiary of ASE Technology Holding Co., Ltd., Advanced Semiconductor Engineering, Inc. unveiled VIPack in June 2022, an advanced packaging platform that enables vertically integrated package solutions. The newest generation of 3D heterogeneous integration architecture from ASE, known as VIPack, expands design guidelines and achieves extremely high densities and performance. Six fundamental packaging technology pillars make up ASE's VIPack, which is supported by a rich and integrated co-design environment that includes 3D IC capabilities based on Through Silicon Via (TSV).

By Application, consumer electronics will have significant growth in the forecasted period

It is also projected that growing electronics miniaturization will propel market expansion. The market for 3D IC packaging is anticipated to experience growth throughout the forecast period as a result of rising demand for advanced architecture in tablets, smartphones, and gaming devices as well as rising adoption of cutting-edge wafer-level packaging technologies in sensors and MEMS. For instance, in June 2021 XMC announced the launch of a new brand called 3DLinkTM for 3D IC technology, which includes two-wafer stacking technology that has begun mass production. Cu-Cu direct connectivity between two wafers processed using separate methods is made possible by 3D IC technology, leading to better interconnection densities and alignment accuracy. A direct link makes it possible to process data at high speeds and with high bandwidth. This technology offers cutting-edge design and processing methods for memory chip processing. Utilizing the benefits of 3D IC technology, consumer electronics can be made smaller, thinner, and more performant.

Key developments

• October 2022: At the 2022 Open Innovation Platform Ecosystem Forum, TSMC launched the Open Innovation Platform (OIP) 3DFabric Alliance. The new TSMC 3DFabric Alliance is the sixth OIP Alliance for TSMC and the first of its kind in the semiconductor industry. It joins forces with partners to speed up the development and readiness of the 3D IC ecosystem, offering a full range of world-class products and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging. With the aid of TSMC's 3DFabric technologies, a broad family of 3D silicon stacking and cutting-edge packaging technologies, users will be able to quickly integrate innovations at the silicon and system level and enable next-generation HPC and mobile applications.
• October 2021: To enable heterogeneous multi-chipset 3D-stacked design, Cadence Design Systems introduced a new integrated 3D design planning, implementation, and system analysis platform in October 2021. Its Cadence Integrity 3D-IC platform solves new issues brought on by designers building hyper-scale computing, consumer, 5G communications, mobile, and automotive applications using cutting-edge packaging techniques like 3D chip stacking.

The Asia Pacific region is estimated to have the fastest rate of growth.

Some of the largest semiconductor chip makers, including TSMC, are based in Asia Pacific. The company is vying for control of the important semiconductor market through partnerships with Japanese suppliers and the construction of Research & Development centres. For instance, TSMC's subsidiary, the TSMC Japan 3DIC R&D Center, constructed a clean room at the Tsukuba Center in June 2022. The Center conducts research into the upcoming versions of progressive packaging and three-dimensional silicon stacking technologies in its brand-new clean room facilities. In addition to the industry's traditional approach of lowering transistor size, these technologies present a new avenue for advancing semiconductor technology by enabling system-level advancements to boost computing performance and integrate more functionality. Additionally, the South Korean tech giant, Samsung Electronics unveiled eXtended-Cube, also known as "X-Cube," in August 2020. This novel 3D IC packaging method enables chip-stacking of SRAM dies on top of a base logic die through TSVs. In contrast to these existing technologies, Samsung's X-Cube directly joins a stacked chip on top of the primary logic die of a design rather than using intermediary interposers or silicon bridges.

3D IC Packaging Market Scope:

Segmentation:

• By technology
  • 3D TSV (through silicon via)
  • 3D wafer-level packaging
• By application
  • Consumer Electronics
  • Automotives
  • IT and Communication
  • Others
• By geography
  • North America
    • USA
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Spain
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • UAE
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Others