Report Overview
The Global 5G Semiconductor market is forecast to grow at a CAGR of 13.9%, reaching USD 57.76 billion in 2031 from USD 30.12 billion in 2026.
Highlights:
- 1Powering mmWave networksChips are enabling ultra-fast speeds.
- 2Driving smartphone upgrades5G modems are boosting premium devices.
- 3Expanding base station deploymentsRF components are supporting infrastructure.
- 4Accelerating sub-6 GHz rolloutProcessors are covering wide areas.
- 5Leading APAC dominanceChina is fueling a chip production surge.
- 6Integrating AI capabilitiesSoCs are enhancing device intelligence.
- 7Pushing advanced nodes7nm+ tech is improving power efficiency.
5G Semiconductor Market Growth Drivers:
5G facilitates the development of the semiconductor industry
With the rapid growth of 5G and IoT devices in the market, the demand for high-quality semiconductor chips is also on the rise. The demanding requirements of 5G products, such as faster network speed, higher frequency bands, greater connections, lower network latency, and more reliable network performance, require advanced chip design and manufacturing technology. Many innovators long for the huge opportunities provided by 5G, and the semiconductor industry has to boost wafer and chip production to meet the technical requirements in the near future. The semiconductor industry is also showing growth driven by smartphones, promoting the entire industry chain to a higher level of development.
For instance:
In September 2023, there was a pact signed by Qualcomm Technologies, Inc. and Apple Inc. that would enable Snapdragon® 5G Modem-RF Systems to be used in smartphones manufactured during the years 2024-2026. This association shows Qualcomm's continuous lead in the field of 5G technology and products.
In July 2023, Intel released information about an important partnership with Ericsson aimed at using Intel’s advanced 18A process and manufacturing technology for Ericsson’s next-generation optimized 5G infrastructure coming soon. Together with this association, Intel will deliver custom-designed SoCs (system-on-chip) for Ericsson, targeting unique offerings that will define the future of 5G infrastructure.
MediaTek launched the Dimensity 1050 system-on-chip (SoC), its first foray into mmWave 5G chipsets, in May 2022. The chipset is expected to power the next generation of 5G smartphones that will feature seamless connectivity, high-quality displays, as well as gaming capabilities and exceptional power efficiency. By employing dual connectivity via both mmWave and sub-6GHz, Dimensity1050 is expected to enhance the smartphone experience by providing speeds and capacity required to sustain other applications even within densely populated areas.
Development in Advanced Chip and Packaging Technology.
In order to satisfy the need for semiconductors, advanced packaging takes center stage in emerging technology applications, which are quickly going mainstream, including 5G, autonomous vehicles, IoT technologies, and virtual/augmented reality. The new technology calls for more robust chips that are also highly efficient due to the high data transfer speeds, plus minimal latency. This innovation has driven the development of chips like 5G modems and RFICs alongside mmWave components. With regards to 5G communication (and even beyond), reducing transmission loss poses a major technical challenge; however, engineers address this issue through using advanced packaging technologies that enable placing the antenna close to the RF IC chip, thus significantly minimizing transmission loss. Currently, AiP is seen as the most viable solution for 5G mmWave technology.
A partnership named OIP 3DFabric was unveiled by TSMC in October 2022, intending to be a major player in the semiconductor and system innovation landscape. This is the sixth alliance under TSMC's OIP Alliances, which it has introduced earlier, and stands as a landmark initiative in the world of semiconductors. It aims at fostering collaboration with partners on 3D IC ecosystem innovation, along with readiness through a wide array of high-quality solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.
The expansion of smartphones is driving up the need for semiconductors in these gadgets. Growth in smart technologies among mobile phones is contributing significantly to this demand, as well as the rapid deployment of new advanced mobile communication standards like 5G.
Rising Adoption Of Smartphones
The rise of smartphone usage is increasing the need for semiconductors in these devices. The main factors contributing to this high demand are the high adoption of smart technologies in mobile phones and the fast transition to advanced mobile communications standards like 5G. The arrival of 5G technology and recent government approvals will create ample possibilities for smartphone users. The increase in mobile device shipments, with smartphones leading the way, is leading to an expansion of the semiconductor market, with the various semiconductor components that are incorporated in smartphones, like application processors, modems, wireless connectivity ICs, audio ICs, and MEMS sensors.
In line with the GSMA Mobile Economy Report 2023, the data based on regional Smartphone adoption in 2022 depicts steady growth across different parts. The most striking surge is seen in North America, which topped smartphone adoption rates in 2022 at a remarkable 84% of total mobile connections, closely followed by Greater China and Europe, both standing strong at 81%. CIS and Asia Pacific regions are on the brink of a major upsurge as they are expected to hit adoption rates of 80% and 74% respectively. These statistics highlight not only the strong global drift towards smartphone usage but also paint emerging markets in bold colors, showing sizable strokes of potentiality for further growth.
5G Semiconductor Market Developments:
May 2026: Qualcomm introduced the Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 mobile platforms, integrating advanced 5G connectivity, AI capabilities, improved power efficiency, and next-generation mobile semiconductor performance.
March 2026: MediaTek showcased next-generation 5G-Advanced customer premises equipment (CPE) and advanced wireless semiconductor technologies at MWC 2026, highlighting enhanced 5G connectivity, edge AI integration, and future 6G readiness.
March 2026: Qualcomm launched the Qualcomm X105 5G Modem-RF, the industry's first 3GPP Release 19-ready modem platform, delivering up to 14.8 Gbps download speeds, integrated satellite connectivity, and AI-enhanced 5G Advanced performance.
List of Top 5G Semiconductor Companies:
Several key players in the market, including Arctic Semiconductor, Qualcomm, Samsung, Huawei, and others, offer a wide range of product offerings, which encompass:
COMPANY NAME |
PRODUCT NAME |
DESCRIPTION |
Arctic Semiconductor | IceWings | Arctic Semiconductor has introduced a unique range of RF transceivers called IceWings. These transceivers support all 5G/4G bands from 600MHz to 7.2GHz, in addition to WiFi 6/6e/7 bands. IceWings is an advanced RF transceiver equipped with four built-in transmitters and receivers. |
Qualcomm | Snapdragon® 865 | The Snapdragon 865 is created to work alongside Qualcomm's 2nd generation 5G modem, the Snapdragon X55 5G modem (an external 7nm baseband chip crafted by TSMC), and an RF front-end interface chip (RFFE). This combination enables 5G NR, sub-6 GHz, and mmWave support. |
Samsung | Exynos 990 | The Exynos 990 processor, when used with the next-generation 5G technology, the Exynos Modem 5123, offers extremely high-speed mobile broadband right at your fingertips. This modem allows for lightning-fast download speeds of up to 7.35Gbps in mmWave and 5.1Gbps in the sub-6GHz setting, with support for up to 8x carrier aggregation. |
Huawei Technologies Co., Ltd. | Kirin 990 5G | The Kirin 990 5G is Huawei's inaugural flagship 5G System on a Chip (SoC). It employs the advanced 7nm+ EUV process, integrating the 5G modem directly into the SoC chip. This SoC also features the HUAWEI Da Vinci Architecture, which includes a dual-core NPU alongside a tiny-core NPU. |
5G Semiconductor Market Scope:
| Report Metric | Details |
|---|---|
| Total Market Size in 2026 | USD 30.12 billion |
| Total Market Size in 2031 | USD 57.76 billion |
| Forecast Unit | Billion |
| Growth Rate | 13.9% |
| Study Period | 2021 to 2031 |
| Historical Data | 2021 to 2024 |
| Base Year | 2025 |
| Forecast Period | 2026 – 2031 |
| Segmentation | Application, Component, Frequency, Geography |
| Geographical Segmentation | Americas, Europe, Middle East and Africa, Asia Pacific |
| Companies |
|
Market Segmentation
By Application
- Consumer Electronics
- Smartphones
- Premium
- Basic
- Others
- Infrastructure
- Others
By Component
- Baseband Processors
- RF
- Power Management
By Frequency
- Sub-6 GHz
- mmWave
By Geography
- Americas
- United States
- Others
- EMEA
- Germany
- UK
- Others
- APAC
- China
- Japan
- South Korea
- Others
Geographical Segmentation
Americas, Europe, Middle East and Africa, Asia Pacific
Table of Contents
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Market Segmentation
2. RESEARCH METHODOLOGY
2.1. Research Data
2.2. Assumptions
3. EXECUTIVE SUMMARY
3.1. Research Highlights
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Bandwidth Availability
4.4. Number of Users
5. GOVERNMENT REGULATIONS/POLICIES
6. 5G SEMICONDUCTOR MARKET, BY APPLICATION
6.1. Introduction
6.2. Consumer Electronics
6.2.1. Smartphones
6.2.1.1. Premium
6.2.1.2. Basic
6.2.2. Others
6.3. Infrastructure
6.4. Others
7. 5G SEMICONDUCTOR MARKET, BY COMPONENT
7.1. Introduction
7.2. Baseband Processors
7.3. RF
7.4. Power Management
8. 5G SEMICONDUCTOR MARKET, BY FREQUENCY
8.1. Introduction
8.2. Sub-6 GHz
8.3. mmWave
9. 5G SEMICONDUCTOR MARKET, BY GEOGRAPHY
9.1. Introduction
9.2. Americas
9.2.1. United States
9.2.2. Others
9.3. Europe, Middle East and Africa
9.3.1. Germany
9.3.2. UK
9.3.3. Others
9.4. Asia Pacific
9.4.1. China
9.4.2. Japan
9.4.3. South Korea
9.4.4. Others
10. RECENT DEVELOPMENT AND INVESTMENTS
11. COMPETITIVE ENVIRONMENT AND ANALYSIS
11.1. Major Players and Strategy Analysis
11.2. Vendor Competitiveness Matrix
12. COMPANY PROFILES
12.1. Arctic Semiconductor
12.2. Polymatech
12.3. Qualcomm
12.4. Advanced Micro Devices, Inc.
12.5. Samsung
12.6. Huawei Technologies Co., Ltd.
12.7. MediaTek Inc.
12.8. Intel Corporation
Navigate
Trusted by the world's leading organizations











