Chip Scale Package CSP LED Market Size, Share, Opportunities, And Trends By Power Range (Low To Medium, High), By End-Users (Residential, Commercial), By Application (Backlight Unit, Flashlight, Automotive, General Lighting, Others), And By Geography - Forecasts From 2024 To 2029

  • Published : Apr 2024
  • Report Code : KSI061616858
  • Pages : 148

The Chip Scale Package CSP LED market is anticipated to expand at a high CAGR over the forecast period.

A Chip Scale Package (CSP) LED is a light-emitting diode (LED) package that is lightweight, compact, and has a direct connection. It is the same size as an LED chip or slightly bigger, removing the requirement for standard packaging components such as lead frames and encapsulating materials.

Chip scale package LED is utilized in various industries like automotive, street lighting, horticulture, and entertainment. CSP LED is widely used in different sectors due to its numerous advantages like compact size, better lighting output, and less power consumption.

CSP LED helps in increasing performance by reducing the size of components in an LED or by replacing them with more efficient components as compared to traditional LED lighting systems. Chip scale packing not only reduces the size but also makes LED more dependable and reduces the amount of heat dissipated from a normal LED light.

Market Drivers

  • Enhanced thermal management of LED light is contributing to the growth of the Chip Scale Package CSP LED market-

Chip-scale packaging of LED lights has helped in reducing the amount of heat produced by an LED light during its operation. Due to chip scale packaging thermal management of an LED has improved a lot which further not only makes it energy efficient but also increases its lighting output. CSP helps in higher power densities and increased working hours thus, making it suitable for a wider range of applications.

Among various services available in the market one of the products is the LUXEON FlipChip Royal Blue is a chip scale package LED that can be attached by reflow without any additional packaging. Its package size is 0.5mm2 which provides improved flexibility and packing density. It can be packed closely and can be used at a high current density, due to which it requires fewer emitters to achieve a higher lumen output at higher lumen densities.

Enhanced thermal management not only improves the reliability and performance of the LED light but reduces the amount of heat emitted due to which the efficiency of the light has increased thus its increasing demand across various industries has contributed to the growth of the CSP LED market.

  • Increasing advancements in display technologies are contributing to the growth of the Chip Scale Package LED market-

The increase in demand for energy-efficient solutions has driven global innovations in LED lighting technology and increased expenditure on research and development of LED has also contributed to the growth of the chip scale package LED market.

Recent advancements such as improved efficiency, less power consumption, and longer lifespan have contributed to the growth of the market. Demand for micro-LEDs in advertisement signage is increasing due to increased brightness and higher pixel density.

Among the various products, one of the products is MelDIR" MIR8060B3 is an 80x60-pixel Thermal-diode infrared sensor. It can measure temperatures up to 200°C in comparison with conventional thermal sensors. It offers high-temperature resolution along with high pixel count that helps in a highly precise understanding movement of the objects.

Restraints-

  • Supply chain risks hamper the growth of the market

Manufacturers of chip scale package LEDs sell out their products with the help of many small vendors which contributes to a significant portion of sales of LED lighting any disruption like shortage of raw material, changes in government rules and regulations, natural calamity, and war-like scenarios in the supply of the products to the distributors not hamper the sales but also affects the growth of the market.

The Chip Scale Package (CSP) LED market is segmented based on different power ranges-

The Chip Scale Package (CSP) LED market is segmented based on different power ranges into low to medium power and high power. Low to medium-power CSP LEDs are LED lights that can operate at low power without affecting the functionality. These types of LED packages are designed to be high-performance at low cost. These LEDs are regarded as an alternative to traditional plastic leaded chip carrier (PLCC) LEDs that are intended to operate at low power. Low to medium-power CSP LEDs are generally used as indicator lights or as interior lighting in vehicles due to their low power consumption

High-power CSP LEDs are LEDs that offer high drive current capability. It is designed to overcome the limitations of LED packages that are developed on traditional platforms. It is available at low prices because it does not use the package carrier which is expensive or has high thermal resistance. High-power CSP LEDs are used in places where very powerful lighting is required such as stadiums, buildings, and for signaling purposes.

North America region is anticipated to hold a significant share of the Chip Scale Package (CSP) LED market.

North America, particularly the United States, is a major center for technological innovation and research, with numerous leading LED manufacturers, research institutions, and universities headquartered there, including Intel, Texas Instruments, and Lumileds Holding B.V., which are driving advancements in CSP LED technology.

North America is encouraging energy-efficient lighting solutions through government efforts and subsidies, including CSP LEDs in commercial, residential, and industrial applications. The region's increased awareness of sustainability and environmental issues fuels demand for these solutions.

North America's competitiveness in the worldwide Chip Scale Package LED market is due to its strong manufacturing base, supply chain infrastructure, technological knowledge, regulatory environment, desire for energy-efficient lighting, and significant industry presence.

Key Developments

  • January 2024 - Avegant launched Spotlight™ display technology, the world's first adaptive LED lighting architecture for LCoS. It is designed to achieve illumination power savings of up to 90% while simultaneously improving contrast by over 10x. This technology is designed to be integrated with Avegant’s existing products with disturbing advantages like compact size, full-color high-resolution, and polarized output.
  • January 2024- Nichia, the world's one of the leading LED producers, launched a chip-scale LED (Part No. NFSWL11A-D6) that achieves horizontal light dispersion. It is a white LED light, which can be used with thin and light lighting fixtures that help to reduce the usage of resources for lighting fixture designs as well as the cost of building materials in which they are installed.

Company Products       

  • LUXEON UV FC – The LUXEON UV FC Line is the smallest along with high power density (W/cm2) ultraviolet with FlipChip Technology in a Chip Scale Package (CSP) LED. It enables tighter beam control and high packing density of LEDs on a chip-on-board solution and it also removes wire bonds that are previously used in the system.
  • Leaded Chip Carrier (LCC) – Leaded Chip Carrier is made up of ceramic it is a quad-row package similar to a QFN or QFP but without exposed pads. The J-wing leaded packages might be of plastic (PLCC) or ceramic (JLCC).

Chip Scale Package CSP LED Market Scope:

 

Report Metric Details
Growth Rate CAGR during the forecast period
Study Period 2019 to 2029
Historical Data 2019 to 2022
Base Year 2023
Forecast Period 2024 – 2029
Forecast Unit (Value) USD Billion
Segments Covered
  • Power Range
  • End-Users
  • Application
  • Geography
Companies Covered
Regions Covered North America, South America, Europe, Middle East and Africa, Asia Pacific
Customization Scope Free report customization with purchase

 

Market Segmentation

  • By Power Range
    • Low to Medium
    • High
  • By End-Users
    • Residential
    • Commercial
  • By Application
    • Backlight Unit
    • Flashlight
    • Automotive
    • General Lighting
    • Others
  • By Geography
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • UK
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Indonesia
      • Taiwan
      • Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. CHIP SCALE PACKAGE (CSP) LED MARKET BY POWER RANGE 

5.1. Introduction

5.2. Low to Medium

5.2.1. Market opportunities and trends

5.2.2. Growth prospects

5.2.3. Geographic lucrativeness 

5.3. High

5.3.1. Market opportunities and trends

5.3.2. Growth prospects

5.3.3. Geographic lucrativeness 

6. CHIP SCALE PACKAGE (CSP) LED MARKET BY END-USER

6.1. Introduction

6.2. Residential

6.2.1. Market opportunities and trends

6.2.2. Growth prospects

6.2.3. Geographic lucrativeness 

6.3. Commercial

6.3.1. Market opportunities and trends

6.3.2. Growth prospects

6.3.3. Geographic lucrativeness 

7. CHIP SCALE PACKAGE (CSP) LED MARKET BY APPLICATION

7.1. Introduction

7.2. Backlight Unit

7.2.1. Market opportunities and trends

7.2.2. Growth prospects

7.2.3. Geographic lucrativeness 

7.3. Flashlight

7.3.1. Market opportunities and trends

7.3.2. Growth prospects

7.3.3. Geographic lucrativeness 

7.4. Automotive

7.4.1. Market opportunities and trends

7.4.2. Growth prospects

7.4.3. Geographic lucrativeness 

7.5. General Lighting

7.5.1. Market opportunities and trends

7.5.2. Growth prospects

7.5.3. Geographic lucrativeness 

7.6. Others

7.6.1. Market opportunities and trends

7.6.2. Growth prospects

7.6.3. Geographic lucrativeness 

8. CHIP SCALE PACKAGE (CSP) LED MARKET BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. By Power Range 

8.2.2. By End-user

8.2.3. By Application

8.2.4. By Country

8.2.4.1. United States

8.2.4.1.1. Market Trends and Opportunities

8.2.4.1.2. Growth Prospects

8.2.4.2. Canada

8.2.4.2.1. Market Trends and Opportunities

8.2.4.2.2. Growth Prospects

8.2.4.3. Mexico

8.2.4.3.1. Market Trends and Opportunities

8.2.4.3.2. Growth Prospects

8.3. South America

8.3.1. By Power Range 

8.3.2. By End-user

8.3.3. By Application

8.3.4. By Country

8.3.4.1. Brazil

8.3.4.1.1. Market Trends and Opportunities

8.3.4.1.2. Growth Prospects

8.3.4.2. Argentina

8.3.4.2.1. Market Trends and Opportunities

8.3.4.2.2. Growth Prospects

8.3.4.3. Others

8.3.4.3.1. Market Trends and Opportunities

8.3.4.3.2. Growth Prospects

8.4. Europe

8.4.1. By Power Range 

8.4.2. By End-user

8.4.3. By Application

8.4.4. By Country

8.4.4.1. Germany

8.4.4.1.1. Market Trends and Opportunities

8.4.4.1.2. Growth Prospects

8.4.4.2. France

8.4.4.2.1. Market Trends and Opportunities

8.4.4.2.2. Growth Prospects

8.4.4.3. United Kingdom

8.4.4.3.1. Market Trends and Opportunities

8.4.4.3.2. Growth Prospects

8.4.4.4. Spain

8.4.4.4.1. Market Trends and Opportunities

8.4.4.4.2. Growth Prospects

8.4.4.5. Others

8.4.4.5.1. Market Trends and Opportunities

8.4.4.5.2. Growth Prospects

8.5. Middle East and Africa

8.5.1. By Power Range 

8.5.2. By End-user

8.5.3. By Application

8.5.4. By Country

8.5.4.1. Saudi Arabia

8.5.4.1.1. Market Trends and Opportunities

8.5.4.1.2. Growth Prospects

8.5.4.2. UAE

8.5.4.2.1. Market Trends and Opportunities

8.5.4.2.2. Growth Prospects

8.5.4.3. Israel

8.5.4.3.1. Market Trends and Opportunities

8.5.4.3.2. Growth Prospects  

8.5.4.4. Others

8.5.4.4.1. Market Trends and Opportunities

8.5.4.4.2. Growth Prospects

8.6. Asia Pacific

8.6.1. By Power Range 

8.6.2. By End-user

8.6.3. By Application

8.6.4. By Country

8.6.4.1. China

8.6.4.1.1. Market Trends and Opportunities

8.6.4.1.2. Growth Prospects

8.6.4.2. Japan

8.6.4.2.1. Market Trends and Opportunities

8.6.4.2.2. Growth Prospects

8.6.4.3. India

8.6.4.3.1. Market Trends and Opportunities

8.6.4.3.2. Growth Prospects

8.6.4.4. South Korea

8.6.4.4.1. Market Trends and Opportunities

8.6.4.4.2. Growth Prospects

8.6.4.5. Indonesia

8.6.4.5.1. Market Trends and Opportunities

8.6.4.5.2. Growth Prospects

8.6.4.6. Taiwan

8.6.4.6.1. Market Trends and Opportunities

8.6.4.6.2. Growth Prospects

8.6.4.7. Others

8.6.4.7.1. Market Trends and Opportunities

8.6.4.7.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisition, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. Lumileds Holding B.V.

10.2. Samsung

10.3. Lumitrips

10.4. LG

10.5. Nichia Corporation

10.6. Seoul Semiconductor Co., Ltd.

10.7. Intel

10.8. Texas Instruments

10.9. Tongfu Microelectronics

10.10. Mitsubishi Electric


Lumileds Holding B.V.

Samsung

Lumitrips

LG

Nichia Corporation

Seoul Semiconductor Co., Ltd.

Intel

Texas Instruments

Tongfu Microelectronics

Mitsubishi Electric