Computer On Modules Market Size, Share, Opportunities, And Trends By Type (ARM, X86, Power PC), By Form Factor (Mini Form Factor (84 X 55mm), Compact Form Factor (95 X 95mm), Basic Form Factor (125 X 95mm)), By End-Users (Automotive, Healthcare, Consumer Electronics, Defence, Others), And By Geography - Forecasts From 2024 To 2029

  • Published : Mar 2024
  • Report Code : KSI061616760
  • Pages : 140

The computer on modules market is anticipated to expand at a high CAGR over the forecast period.

Computer on Modules (CoMs), or System on Modules (SoMs), are small, tightly integrated computing platforms that serve as the central processing unit of embedded systems and IoT devices. They provide a standardized, modular approach to embedded computing, delivering a whole computer system on a single board.

Key aspects of the computer on modules market include modularity, compact form factor, standardized interfaces, and scalability. CoMs are modular computing modules that can be simply inserted into carrier boards or embedded systems, allowing developers to focus on application-specific functionality without complication.

CoMs are often available in compact form factors, making them ideal for space-constrained embedded applications. Despite their compact size, they have significant processing capabilities, including CPUs, GPUs, RAM, storage, and several communication choices.

CoMs frequently use standardized interfaces and connectors like as PCIe, USB, Ethernet, HDMI, and GPIO, which provide compatibility and interoperability with a broad range of peripheral devices and expansion modules.

CoMs provide scalability in terms of processing power, memory capacity, and networking. Developers can select from a wide range of CoMs with varying specifications to fulfil the performance needs of their unique applications.

Overall, Computer on Modules offers a versatile and cost-effective option for embedded computing, allowing developers to create creative and feature-rich embedded systems with shorter time-to-market and lower development complexity.

Market Drivers

  • Rising demand for embedded systems is contributing to the computer on modules market growth

The growing use of embedded systems in a variety of industries, including industrial automation, healthcare, automotive, and IoT, fuels demand for CoMs. These modules offer a small and effective way to power embedded devices and IoT applications.

Among various products available in the market, The EmETXe-i92U1 features a soldered 11th Generation Intel® Core™ CPU with twin channels, LVDS, Analogue RGB, and DDI interfaces. It can handle four separate screens and has a broad variety of voltage inputs and operating temperatures. ARBOR's Computer on Module offers a variety of form factors and is an active PICMG member, providing speedier project development and market opportunities.

Overall, the rising demand for embedded systems drives the adoption of CoMs as a preferred solution for powering diverse embedded applications, fueling the CoMs market growth. Top of Form

  • The growing IoT market is contributing to the computer-on-modules market growth

The expansion of IoT devices and applications increases demand for CoMs, which are the foundation of many IoT solutions. CoMs enable the creation of IoT gateways, edge computing devices, sensor nodes, and other connected devices that make up the IoT ecosystem.

Among various products, there is Toradex's Verdin NXP® i.MX 8M Plus, a contemporary system on a module that includes up to four Cortex-A53 1.8 GHz processors, a Cortex-M7 processor with speeds of up to 800 MHz, a Neural Processing Unit, an Image Signal Processor, and an NXP i.MX 8M Plus applications processor. It provides free support and maintenance for Embedded Linux, FreeRTOS, Android, and QNX.

Overall, the rising IoT market increases demand for adaptable, scalable, and connectivity-rich computing platforms such as CoMs, hence boosting market expansion and promoting IoT deployments across a wide range of industries and applications.

Market Restraints

  • The complexity of Integration hampers market growth

Integrating CoMs into custom-designed carrier boards or embedded systems can be difficult and necessitates knowledge of hardware design, schematic capture, layout, and manufacturing procedures. The learning curve involved with CoM integration may deter some developers from using these platforms, particularly those with little expertise in embedded system development.

Computer on modules market is segmented based on its different types of modules

The computer on modules market is segmented based on its different types of modules. ARM-based CoMs are popular in embedded computing because of their low power consumption, efficient performance, and ecosystem support, making them appropriate for a wide range of applications, including IoT devices, industrial automation, automotive systems, and consumer electronics.

x86-based CoMs, powered by Intel and AMD processors, offer increased processing power and interoperability with a wide range of software programs, including Windows and Linux. CoMs are widely utilized in high-performance computing applications such as industrial control systems, digital signs, medical devices, and edge computing platforms.

IBM's PowerPC architecture processors are utilized in CoMs, which balance performance and power economy. They are widely used in applications such as aerospace, defence, automobile infotainment, telecommunications, and industrial control systems for dependability and real-time processing.

North America is anticipated to hold a significant share of the computer modules market.

The rising need for automated solutions in the industrial sector to facilitate their advancement drives market prospects in the United States. Several organizations are implementing the Internet of Things and innovative technologies, which is driving up demand for systems on modules in the United States.

Growing investment in cutting-edge technology, the presence of significant manufacturers such as Kontron Group, WDL Systems, and ARBOUR Technology Corp, and government efforts are likely to support the US market. On the other hand, evolving customer preferences for artificial intelligence and robotics in the industrial industry drive market growth.

Overall, North America's leadership in technology, coupled with its diverse industrial landscape and supportive business environment, positions it as a key player in the global computer modules market.

Key Developments

  • November 2023 - Sophgo licensed SiFive's RISC-V high-performance processing cores, to create AI computer processors. The new Sophgo SG2380, a 2.5 GHz 16-core RISC-V processor, employs the P670 and X280 processors, merging Sophgo's AI/ML hardware design with RISC-V's distinctive instruction set architecture and micro-architecture design. The partnership intends to meet advanced computing demands.

April 2022- BrainChip Holdings Ltd, the world's first commercial producer of ultra-low power neuromorphic AI chips and IP, and SiFive, Inc., the pioneer and leader of RISC-V computing, merged their technologies to provide chip designers with optimized AI/ML computing at the edge.

Company Products

  • ICES 620-HCAD1-USB – The ICES 620 is a COM Express Type 6 Compact module featuring an Intel Atom® J1900 Quad-Core CPU and one DDR3L SO-DIMM memory connector with non-ECC compatibility for up to 8GB at 1066/1333MHz. It features an Intel® Gen7 graphic engine that supports twin CRT monitors with resolutions of up to 2048 x 1536 and a 2DPs connection with HDMI 1.4a/DP 1.2 setups
  • COM-R2KC6 – AAEON's COM-R2KC6 is the first computer-on-modules with AMD Ryzen™ Embedded R2000 Series Processors, providing cost-efficiency and performance. It delivers a variety of functions at a lesser cost without sacrificing quality. The board supports PCIe, PEG, and LPC expansion, as well as increased display capabilities, including integrated graphics for four simultaneous 4K monitors.

Market Segmentation

  • By Type
    • ARM
    • X86
    • Power PC
  • By Form Factor
    • Mini form factor (84 x 55mm)
    • Compact form factor (95 x 95mm)
    • Basic form factor (125 x 95mm)
  • By End-Users
    • Automotive
    • Healthcare
    • Consumer electronics
    • Defence
    • Others
  • By Geography
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • UK
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Indonesia
      • Taiwan
      • Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. COMPUTER ON MODULES MARKET BY TYPE

5.1. Introduction

5.2. ARM

5.2.1. Market opportunities and trends

5.2.2. Growth prospects

5.2.3. Geographic lucrativeness 

5.3. X86

5.3.1. Market opportunities and trends

5.3.2. Growth prospects

5.3.3. Geographic lucrativeness 

5.4. Power PC

5.4.1. Market opportunities and trends

5.4.2. Growth prospects

5.4.3. Geographic lucrativeness 

6. COMPUTER ON MODULES MARKET BY FORM FACTOR

6.1. Introduction

6.2. Mini form factor (84 x 55mm)

6.2.1. Market opportunities and trends

6.2.2. Growth prospects

6.2.3. Geographic lucrativeness 

6.3. Compact form factor (95 x 95mm)

6.3.1. Market opportunities and trends

6.3.2. Growth prospects

6.3.3. Geographic lucrativeness 

6.4. Basic form factor (125 x 95mm)

6.4.1. Market opportunities and trends

6.4.2. Growth prospects

6.4.3. Geographic lucrativeness 

7. COMPUTER ON MODULES MARKET BY END-USER

7.1. Introduction

7.2. Automotive

7.2.1. Market opportunities and trends

7.2.2. Growth prospects

7.2.3. Geographic lucrativeness 

7.3. Healthcare

7.3.1. Market opportunities and trends

7.3.2. Growth prospects

7.3.3. Geographic lucrativeness 

7.4. Consumer electronics

7.4.1. Market opportunities and trends

7.4.2. Growth prospects

7.4.3. Geographic lucrativeness 

7.5. Defence

7.5.1. Market opportunities and trends

7.5.2. Growth prospects

7.5.3. Geographic lucrativeness 

7.6. Others

7.6.1. Market opportunities and trends

7.6.2. Growth prospects

7.6.3. Geographic lucrativeness 

8. COMPUTER ON MODULES MARKET BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. By Type

8.2.2. By Form Factor

8.2.3. By End-user

8.2.4. By Country

8.2.4.1. United States

8.2.4.1.1. Market Trends and Opportunities

8.2.4.1.2. Growth Prospects

8.2.4.2. Canada

8.2.4.2.1. Market Trends and Opportunities

8.2.4.2.2. Growth Prospects

8.2.4.3. Mexico

8.2.4.3.1. Market Trends and Opportunities

8.2.4.3.2. Growth Prospects

8.3. South America

8.3.1. By Type

8.3.2. By Form Factor

8.3.3. By End-user

8.3.4. By Country

8.3.4.1. Brazil

8.3.4.1.1. Market Trends and Opportunities

8.3.4.1.2. Growth Prospects

8.3.4.2. Argentina

8.3.4.2.1. Market Trends and Opportunities

8.3.4.2.2. Growth Prospects

8.3.4.3. Others

8.3.4.3.1. Market Trends and Opportunities

8.3.4.3.2. Growth Prospects

8.4. Europe

8.4.1. By Type

8.4.2. By Form Factor

8.4.3. By End-user

8.4.4. By Country

8.4.4.1. Germany

8.4.4.1.1. Market Trends and Opportunities

8.4.4.1.2. Growth Prospects

8.4.4.2. France

8.4.4.2.1. Market Trends and Opportunities

8.4.4.2.2. Growth Prospects

8.4.4.3. UK

8.4.4.3.1. Market Trends and Opportunities

8.4.4.3.2. Growth Prospects

8.4.4.4. Spain

8.4.4.4.1. Market Trends and Opportunities

8.4.4.4.2. Growth Prospects

8.4.4.5. Others

8.4.4.5.1. Market Trends and Opportunities

8.4.4.5.2. Growth Prospects

8.5. Middle East and Africa

8.5.1. By Type

8.5.2. By Form Factor

8.5.3. By End-user

8.5.4. By Country

8.5.4.1. Saudi Arabia

8.5.4.1.1. Market Trends and Opportunities

8.5.4.1.2. Growth Prospects

8.5.4.2. UAE

8.5.4.2.1. Market Trends and Opportunities

8.5.4.2.2. Growth Prospects

8.5.4.3. Israel

8.5.4.3.1. Market Trends and Opportunities

8.5.4.3.2. Growth Prospects  

8.5.4.4. Others

8.5.4.4.1. Market Trends and Opportunities

8.5.4.4.2. Growth Prospects

8.6. Asia Pacific

8.6.1. By Type

8.6.2. By Form Factor

8.6.3. By End-user

8.6.4. By Country

8.6.4.1. China

8.6.4.1.1. Market Trends and Opportunities

8.6.4.1.2. Growth Prospects

8.6.4.2. Japan

8.6.4.2.1. Market Trends and Opportunities

8.6.4.2.2. Growth Prospects

8.6.4.3. India

8.6.4.3.1. Market Trends and Opportunities

8.6.4.3.2. Growth Prospects

8.6.4.4. South Korea

8.6.4.4.1. Market Trends and Opportunities

8.6.4.4.2. Growth Prospects

8.6.4.5. Indonesia

8.6.4.5.1. Market Trends and Opportunities

8.6.4.5.2. Growth Prospects

8.6.4.6. Taiwan

8.6.4.6.1. Market Trends and Opportunities

8.6.4.6.2. Growth Prospects

8.6.4.7. Others

8.6.4.7.1. Market Trends and Opportunities

8.6.4.7.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisition, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. European Portwell Technology B.V.

10.2. Kontron Group

10.3. Toradex Systems (India) Pvt. Ltd.

10.4. WDL Systems

10.5. Distec GmbH

10.6. ADLINK Technology Inc.

10.7. congatec GmbH

10.8. AAEON Technology Inc.

10.9. NEXCOM International Co. Ltd.

10.10. ARBOR Technology Corp.


European Portwell Technology B.V.

Kontron Group

Toradex Systems (India) Pvt. Ltd.

WDL Systems

Distec GmbH

ADLINK Technology Inc.

congatec GmbH

AAEON Technology Inc.

NEXCOM International Co. Ltd.

ARBOR Technology Corp.