Electrostatic discharge packaging is a type of flexible packaging used for transportation and storage of electronics products. Electrostatic discharge packaging is used for products like integrated circuits which can break down if exposed to high voltage. The demand for ESD packaging is expected to grow owing to the rising utilisation of electronic products across the globe. The growing demand for electronic products such as smartphones, smart watches etc is anticipated to propel the market growth. Further, government regulations regarding packaging of electronics products for imports and exports is projected to positively influence the ESD packaging market during the forecast period. The ESD packaging market has been segmented on the basis of products, application, end-user and geography. In the basis segment bags is expected to hold a significant share. In the application segment the electronic components are anticipated to drive the market for ESD packaging owing to the rising import and export of electronics components coupled with strict regulations regarding packaging of the same. Geographically Asia-Pacific is projected to witness a substantial growth in the upcoming years on account of rising consumer demand for electronic products.
Rising Electronics Industry
Government regulations regarding packaging of electronic components
Some of the major players profiled in the Electrostatic discharge packaging market include DS Smith PLC, Desco Industries Inc., Pregis LLC, Achilles Corporation, NEFAB Group, Botron Company Inc., International Plastics Inc., Dou Yee Enterprises (S) Pte Ltd. Pure-Stat Engineered Technologies.
The Electrostatic discharge packagingmarket has been analyzed through the following segments:
By End User
Defense & Military
Middle East and Africa