Electrostatic Discharge (ESD) Packaging Market Size, Share, Opportunities, And Trends By Product (Containers, Trays, Bags, Tapes, Others), By Application (Electronic components, Equipment, Hazardous Powder), By End User (Electronics, Automotive, Defense & Military, Others), And Geography - Forecasts From 2025 To 2030

The electrostatic discharge (ESD) packaging market is projected to grow at a CAGR of 4.59% between 2025 to 2030.

Electrostatic discharge packaging is a type of flexible packaging used for transportation and storage of electronics products. Electrostatic discharge packaging is used for products like integrated circuits which can break down if exposed to high voltage. The demand for ESD packaging is expected to grow owing to the rising utilisation of electronic products across the globe. The growing demand for electronic products such as smartphones, smart watches etc is anticipated to propel the market growth. Further, government regulations regarding packaging of electronics products for imports and exports is projected to positively influence the ESD packaging market during the forecast period. The ESD packaging market has been segmented on the basis of products, application, end-user and geography. In the basis segment bags is expected to hold a significant share. In the application segment the electronic components are anticipated to drive the market for ESD packaging owing to the rising import and export of electronics components coupled with strict regulations regarding packaging of the same. Geographically Asia-Pacific is projected to witness a substantial growth in the upcoming years on account of rising consumer demand for electronic products.

DRIVERS

Rising Electronics Industry

Government regulations regarding packaging of electronic components

RESTRAINTS

Cyclic nature of semiconductor industry

Some of the major players profiled in the Electrostatic discharge packaging market include DS Smith PLC, Desco Industries Inc., Pregis LLC, Achilles Corporation, NEFAB Group, Botron Company Inc., International Plastics Inc., Dou Yee Enterprises (S) Pte Ltd. Pure-Stat Engineered Technologies.

Segmentation

The Electrostatic discharge packagingmarket has been analyzed through the following segments:

By Product

Containers

Trays

Bags

Tapes

Others

By Application

Electronic components

Equipment

Hazardous Powder

By End User

Electronics

Automotive

Defense & Military

Others

By Geography

North America

USA

Canada

Mexico

South America

Brazil

Argentina

Others

Europe

Germany

France

United Kingdom

Spain

Others

Middle East and Africa

Saudi Arabia

Israel

Others

Asia Pacific

China

Japan

South Korea

India

Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Currency

1.5. Assumptions

1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Secondary Sources

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. Market Segmentation

4.2. Market Drivers

4.3. Market Restraints

4.4. Market Opportunities

4.5. Porter’s Five Force Analysis

4.5.1. Bargaining Power of Suppliers

4.5.2. Bargaining Power of Buyers

4.5.3. Threat of New Entrants

4.5.4. Threat of Substitutes

4.5.5. Competitive Rivalry in the Industry

4.6. Life Cycle Analysis - Regional Snapshot

4.7. Market Attractiveness

5. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY PRODUCT

5.1. Containers

5.2. Trays

5.3. Bags

5.4. Tapes

5.5. Others

6. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY APPLICATION

6.1. Electronic components

6.2. Equipment

6.3. Hazardous Powder

7. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY END USER

7.1. Electronics

7.2. Automotive

7.3. Defense & Military

7.4. Others

8. ELECTROSTATIC DISCHARGE PACKAGINGMARKET BY GEOGRAPHY

8.1. North America

8.1.1. USA

8.1.2. Canada

8.1.3. Mexico

8.2. South America

8.2.1. Brazil

8.2.2. Argentina

8.2.3. Others

8.3. Europe

8.3.1. Germany

8.3.2. France

8.3.3. United Kingdom

8.3.4. Spain

8.3.5. Others

8.4. Middle East and Africa

8.4.1. Saudi Arabia

8.4.2. Israel

8.4.3. Others

8.5. Asia Pacific

8.5.1. China

8.5.2. Japan

8.5.3. South Korea

8.5.4. India

8.5.5. Others

9. COMPETITIVE INTELLIGENCE

9.1. Company Benchmarking and Analysis

9.2. Recent Investment and Deals

9.3. Strategies of Key Players

10. COMPANY PROFILES

10.1. DS Smith PLC

10.2. Desco Industries Inc.

10.3. Pregis LLC

10.4. Achilles Corporation

10.5. NEFAB Group

10.6. Botron Company Inc.

10.7. International Plastics Inc.

10.8. Dou Yee Enterprises (S) Pte Ltd.

10.9. Pure-Stat Engineered Technologies

10.10. AUER Packaging GmbH

10.11. GWP Group Ltd.

10.12. Protective Packaging Corporation

10.13. Kiva Container

10.14. Teknis Limited

10.15. Elcom Ltd.

LIST OF FIGURES

LIST OF TABLES

 

DS Smith PLC

Desco Industries Inc.

Pregis LLC

Achilles Corporation

NEFAB Group

Botron Company Inc.

International Plastics Inc.

Dou Yee Enterprises (S) Pte Ltd.

Pure-Stat Engineered Technologies

AUER Packaging GmbH

GWP Group Ltd.

Protective Packaging Corporation

Kiva Container

Teknis Limited

Elcom Ltd.