Electrostatic Discharge (ESD) Packaging Market Size, Share, Opportunities And Trends By Product (Containers, Trays, Bags, Tapes, Others), By Application (Electronic Components, Equipment, Hazardous Powder), By End User (Electronics, Automotive, Defense & Military, Others), And Geography - Forecasts From 2019 To 2024
- Published : Mar 2020
- Report Code : KSI061612680
- Pages : 108
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Electrostatic discharge packaging is a type of flexible packaging used for transportation and storage of electronics products. Electrostatic discharge packaging is used for products like integrated circuits which can break down if exposed to high voltage. The demand for ESD packaging is expected to grow owing to the rising utilisation of electronic products across the globe. The growing demand for electronic products such as smartphones, smart watches etc is anticipated to propel the market growth. Further, government regulations regarding packaging of electronics products for imports and exports is projected to positively influence the ESD packaging market during the forecast period. The ESD packaging market has been segmented on the basis of products, application, end-user and geography. In the basis segment bags is expected to hold a significant share. In the application segment the electronic components are anticipated to drive the market for ESD packaging owing to the rising import and export of electronics components coupled with strict regulations regarding packaging of the same. Geographically Asia-Pacific is projected to witness a substantial growth in the upcoming years on account of rising consumer demand for electronic products.
DRIVERS
Rising Electronics Industry
Government regulations regarding packaging of electronic components
RESTRAINTS
Cyclic nature of semiconductor industry
Some of the major players profiled in the Electrostatic discharge packaging market include DS Smith PLC, Desco Industries Inc., Pregis LLC, Achilles Corporation, NEFAB Group, Botron Company Inc., International Plastics Inc., Dou Yee Enterprises (S) Pte Ltd. Pure-Stat Engineered Technologies.
Segmentation
The Electrostatic discharge packagingmarket has been analyzed through the following segments:
Containers
Trays
Bags
Tapes
Others
By Application
Electronic components
Equipment
Hazardous Powder
By End User
Electronics
Automotive
Defense & Military
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY PRODUCT
5.1. Containers
5.2. Trays
5.3. Bags
5.4. Tapes
5.5. Others
6. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY APPLICATION
6.1. Electronic components
6.2. Equipment
6.3. Hazardous Powder
7. ELECTROSTATIC DISCHARGE PACKAGING MARKET BY END USER
7.1. Electronics
7.2. Automotive
7.3. Defense & Military
7.4. Others
8. ELECTROSTATIC DISCHARGE PACKAGINGMARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Saudi Arabia
8.4.2. Israel
8.4.3. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Company Benchmarking and Analysis
9.2. Recent Investment and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. DS Smith PLC
10.2. Desco Industries Inc.
10.3. Pregis LLC
10.4. Achilles Corporation
10.5. NEFAB Group
10.6. Botron Company Inc.
10.7. International Plastics Inc.
10.8. Dou Yee Enterprises (S) Pte Ltd.
10.9. Pure-Stat Engineered Technologies
10.10. AUER Packaging GmbH
10.11. GWP Group Ltd.
10.12. Protective Packaging Corporation
10.13. Kiva Container
10.14. Teknis Limited
10.15. Elcom Ltd.
LIST OF FIGURES
LIST OF TABLES
DS Smith PLC
Desco Industries Inc.
Pregis LLC
Achilles Corporation
NEFAB Group
Botron Company Inc.
International Plastics Inc.
Dou Yee Enterprises (S) Pte Ltd.
Pure-Stat Engineered Technologies
AUER Packaging GmbH
GWP Group Ltd.
Protective Packaging Corporation
Kiva Container
Teknis Limited
Elcom Ltd.
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