Panel Level Packaging Market Size, Share, Opportunities, And Trends By Wafer Size (Up To 400mm, More Than 400mm), By End Users (Automotive, Electronics, Communications, Others), And By Geography - Forecasts From 2023 To 2028

Panel level packaging is a method of packing that includes the assembly of electrical components onto an enormous substrate or panel, which is then divided into more manageable pieces or individual packages. The panel is made up of a variety of substances including glass, ceramic or organic materials. Several methods such as flip-chip bonding, wire bonding, and surface mount technology are used to secure the electrical components to the panel. Embedded in the substrate, passive components like resistors and capacitors may also be present in the panel. The global semiconductor packaging industry's most promising field of market advancement is panel-level package technology. Some of the key influencing elements for the development of panel-level packaging market include flexible circuit designs and cost-effective packaging solutions.

Electronic devices and 5G technology will boost the panel level packaging market.

The panel level packaging market is anticipated to be crucial for future applications involving 5G, AI, ADAS, smart cities, and IoT-related goods. The panel-level packaging provides high-performing, energy-efficient, thin, and small form factor packages and it finds extensive uses in the consumer electronics industry to create ultra-thin portable devices such as smart mobile phones, laptops, and smart wearables. Consumer Technology Association (CTA) predicts that retail purchases of consumer electronics will increase by 4.3% which is up to $461 billion. Annual growth in consumer electronics sales has greatly increased demand for panel-level packaging. According to CTA, memory, logic, analog, and MPU-related semiconductor products account for more than 80% of the total sales in the semiconductor industry, and market leaders have a stronger motivation to concentrate on the panel-level packaging process for these specific products. The mainstream chips in antenna modules of 5G smartphones use panel-level packaging technology. By 2025, the Groupe Speciale Mobile Association (GSMA) predicts that one-third of the world's populace will be serviced by 5G networks which increases the demand for 5G smartphones. The Consumer Technology Association (CTA) estimates that 5G smartphone sales will generate USD 61.37 billion in income in 2022, an increase of 15% from USD 53.38 billion in 2021. This demonstrates that the panel-level packaging market has a great demand.

The automobile sector is expected to boost the panel level packaging market growth

The panel level packaging market uses of cutting-edge semiconductor packaging technologies to allow the miniaturization and integration of electronic components onto a single panel. The Institute of Electrical and Electronics Engineers (IEEE) claims that the automotive industry's demand for semiconductors has been consistent due to advancements in technologies like vehicle-to-everything communication, and advanced driver-assistance systems (ADAS). According to the International Organization of Motor Vehicle Manufacturers (OICA), around 68.21% of passenger cars were sold globally in 2021, with China and the US being the two biggest markets in this sector. According to The Society of Indian Automobile Manufacturers (SIAM), over the past few years, the Indian automobile industry has been expanding steadily and automobile sales increased by 35.97% in FY 2021–22 (April 2021–February 2022). This demonstrates that demand for panel level packaging market

During the forecast period, the Asia Pacific region is expected to hold a significant market share.

The Asia Pacific region is a major hub for semiconductor manufacturing and has been at the forefront of panel-level packaging technology development. The Semiconductor Industry Association (SIA) estimates that Asia-Pacific accounts for more than 50% of worldwide semiconductor revenue. A number of significant panel-level packaging market participants including TSMC, ASE technology holding, and Powertech technology are based in Taiwan and these companies are making significant investments in panel-level packaging technology in an effort to increase the functionality and value of their semiconductor goods. The Taiwanese government's Industrial Development Bureau (IDB) launched the "Semiconductor Moonshot Project" in 2020, which aims to develop advanced packaging technologies including panel-level packaging, and the project is expected to receive a total of TWD 50 billion (approximately USD 1.8 billion) in funding over five years. These factors all add to market growth in the Asia Pacific regions of semiconductors which boosts the panel level packaging market.

Key Developments

• November 2022: Samsung Electronics has created GDDR6W panel-level packaging with double the speed and capacity and it makes use of wafer-level packaging that spreads out with high speed, high bandwidth, and capacity.
• November 2021: Amkor Technology, Inc. made plans to develop panel-level packaging assembly and test solutions for semiconductor and electronic manufacturing businesses around the globe.

Panel Level Packaging Market Scope:

Segmentation:

• By Wafer Size
  • Up to 400mm
  • More than 400mm
• By End Users
  • Automotive
  • Electronics
  • Communications
  • Others
• By Geography
  • North America
    • USA
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Spain
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • UAE
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Other