Knowledge Sourcing Intelligence announces the publication of a new report on “3D NAND Flash Memory Market – Forecasts from 2020 to 2025” to their offering.
The growing demand for more data storage, with faster processing speed, fueled by the demand for high-end consumer electronics as well as activities like gaming, programming, among others, are anticipated to throttle the market at new heights.
According to the report, the 3D NAND Flash Memory is expected to grow at a CAGR of 11.08% during the forecast period.
What is a 3D NAND flash memory and how it functions?
It is a type of flash memory that offers a high capacity/volume ratio in a smaller physical space by assembling memory cells on top of each other. The efficiency is maximized by reducing the length between cells. It may be noted that 3D V-NAND by Samsung was the world’s first 3D NAND Flash Memory chip. The utilization of charge trap flash (CTF) technology by a vertical assemblage of cell layers facilitates the provisioning of memory up to 128 GB on a chip. Compared to 2D or planar NAND it provides great reliability and scalability with advanced write performance without comprising data integrity. This leads to the enhancement of stability and performance of consumer electronics like smartphones, notebooks among others. It is also an integral component of Solid-State Drives (SSDs) due to the capability of retaining data without the need for an uninterrupted power supply.
The growth of 3D NAND flash memory market is dependent on several factors as mentioned below
The main driving force to be reckoned with is that of the surge in demand of consumer electronics like notebooks, smartphones, and tablets as well as increasing cognizance of data as an opportunity to gain insights rather than its erstwhile consideration just being a log where one could only record information. Premium notebooks are being incorporated with this kind of memory. Additionally, the incessant demand for more data storage along with the increasing demand for high-performance computing necessitated by programming, gaming, and various crucial areas like that of an enterprise as well as national security is expected to drive the 3D NAND flash memory market. Another driver is that the manufacturing process of 3D NAND, which is comparatively less complicated than that of technologies required to manufacture FRAM, MRAM and RRAM while other technologies haven’t been well explored and remain less understood. Parallelly important is the growing inclination of consumers to enable a connected living and workspaces and accommodating the exploding data volumes necessitating the adoption of cloud computing which is required by for example autonomous vehicles as well.
Moreover, the growing recognition of industry 4.0 and digitization of traditional factories and transitioning factories are also leading to the growing demand for 3D NAND flash memory. While may organizations aspire to fully automatize their operations, on the other hand, many are employing machine learning and analytics to boost productivity and enhance efficiency. The importance of the demand was exemplified by Western Digital Corporation’s launch of a new portfolio of robust 64-layer 3D NAND products, in September 2019, which have been designed with the rationale to mee the storage needs of businesses. The range of products includes a line of eMMC devices, SD and micro-SD cards with the potential to be applied in drones, edge-computing hardware, gateways and robotics, industrial cameras, manufacturing systems, among others. iNAND IX EM132 EFD, one of the 64-layer eMMC variants cab bee used in environments for –25 C to +85 C, whereas the version pertaining to wide-temperature can be used from -40 C to +85 C. Another such expansion of product portfolio was announced in June 2020, when a leading manufacturer of industrial solid-state drive (SSD)and memory solutions, Virtium LLC unveiled the expansion of its StorFly range of SSDs that are of industry-grade. This enables businesses to increase storage capacity simultaneously to protect critical data in embeds systems in harsh environments and a variety of Industrial Internet of Things (IIoT) applications. This new line of the product comes with proprietary I-Temp support that ensures the ceaseless operations in extreme temperatures.
As a part of the report, the major players operating in the 3D NAND flash memory market which have been covered are ATP Electronics Inc., Intel Corporation, Micron Technology Inc., Samsung Corporation, Sk Hynix Inc., Toshiba Corporation, Western Digital Corporation, and Yangtze Memory Technologies Co., Ltd.
View a sample of the report or purchase the complete study at https://www.knowledge-sourcing.com/report/global-3d-nand-flash-memory-market
This report segmented the 3D NAND flash memory market on the basis following terms
- Single Level Cell (SLC)
- Multi-Level Cell (MLC)
- Triple Level Cell (TLC)
By End User Industry
- Consumer Electronics
- United Kingdom
Middle East and Africa
- Saudi Arabia
- South Korea
- North America