Embedded Die Packaging Market Size, Share, Opportunities, And Trends By Platform (IC Package Substrate, Rigid Board, Flexible Board), By Application (Medical, Consumer Electronics, Military, Industrial), And By Geography - Forecasts From 2023 To 2028

Embedded die packaging technique is required as a result of technological advancements. Technologies for embedding satisfy several requirements, such as chip size, electrical performance, and connection. In addition, because embedded components can be stacked in multiple layers with embedded components, miniaturisation enables more flexible design and significant board layouts. Moreover, it provides quick turnaround for customised designs, great robustness, and improved package dependability.

The rising demand for consumer electronics and 5G network technologies is a primary driver of the expansion of the worldwide embedded die packaging industry. In order to provide a better user interface and improved overall performance, many consumer electronic gadgets, including smartphones, laptops, tablets, and portable gaming consoles, integrate a number of embedded processors. These chips are mostly utilised in DC-DC converters, power electronic circuitry, and camera circuits in smartphones, wearables, and other consumer electronic goods. Moreover, integrated devices utilised in smart video surveillance systems of autos provide quick reaction times due to the integration of 5G into their design. In microelectronic devices, circuit miniaturisation is also urgently needed.

The spike in demand for consumer electronics and 5G network technologies, together with the upcoming requirement for circuit downsizing in microelectronic devices, are the primary drivers of the growth of the worldwide embedded die packaging technology market. The method's benefits over other IC packaging techniques, including its capacity to employ 70% less chip space than SiP technology, are further factors pushing its growth. Nevertheless, the forecast for the worldwide market for embedded die packaging technology is hampered by the high initial cost. On the other hand, it is projected that throughout the projection period, the growth in trends connected to Internet of Things (IoT) solutions would present profitable prospects for embedded technology and the embedded die packaging technology business.

An increase in the use of 5g networks and consumer electronics consumption.

One of the products that is utilised the most around the globe is consumer electronics. The household sector's increased adoption of a wider variety of consumer electronics has resulted in significant growth for the consumer electronics industry. Manufacturers are making large investments in the integration of various digital technologies into consumer electronics products, and they are increasingly emphasising providing customers with top-notch experiences. In addition, new goods with cutting-edge features are being released as a result of rising R&D and innovation spending by top market players.

Demand for Die in Flexible Board to hold a sizable market share.

With its commercialization, Stretchable Electronics (SC) has taken on a variety of shapes and forms. Standard printed circuit boards, primarily flexible boards, are used in the technology, and liquid injection moulding processes utilise elastomer-embedded stretchy electronic circuits to produce a durable and dependable product. For instance, in military usage, uniforms and armours can have embedded, flexible, lightweight impact sensors that could store and provide better information of the injury sustained during combat.

Asia Pacific is projected to be the prominent market shareholder in the global embedded die packaging market and is anticipated to continue throughout the forecast period.

Due to the presence of major players, the Asia-Pacific region accounts for a sizeable portion of the worldwide market for embedded die packaging technology. Throughout the forecast period, this region is also anticipated to develop at the fastest rate. Furthermore, China is expected to hold a dominant position in market forecast as a result of the increased investment made by top companies and government organisations in the development of next-generation semiconductor solutions based on embedded die packaging technology to enhance electrical thermal performance, reliability, and mechanical stability. This is anticipated to fuel the expansion of embedded die packaging technology in this region.

Market Key Developments

• In October 2022, Design, characterisation, and packaging technologies for 5G RF modules were introduced by Amkor Technology, Inc. The introduction of 5G has resulted in a significant increase in cellular frequency bands, necessitating creative packaging ideas for RF front-end modules for smartphones and other 5G-capable devices.
• In March 2022, in order to enable the commercial availability of Future Access, the 28GHz 5G mm Wave module with the highest level of integration in the market, for both the mobile and fixed wireless infrastructure industries, Fujikura, Ltd. has announced a partnership with GlobalFoundries (GF).

Segmentation:

• By Platform
• IC package substrate
• Rigid Board
• Flexible Board
• By Application
• Medical
• Consumer Electronics
• Military
• Industrial
• By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• UK
• Germany
• France
• Italy
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Others