Global ESD Packaging Market Size, Share, Opportunities, COVID 19 Impact, And Trends By End-Users (Consumer Electronics Industry, Aerospace And Defense Industry, Automotive Industry, Communication Network Infrastructure, Computer Peripherals, Healthcare Industry, Other), And By Geography - Forecasts From 20221 To 2026

Published:  Jul 2021 Report Code: KSI061610754 Pages: 114

The global ESD packaging market is evaluated at US$3.417 billion for the year 2019 and is projected to grow at a CAGR of 7.41% to reach a market size of US$5.635 billion by the year 2026.

Market definition.

Electrostatic discharge materials are those plastic materials that decrease static electricity to protect electrostatic sensitive devices. The electrostatic discharge materials should be packaged carefully as they can contain flammable liquids or gases. They can be packaged with foam and cushioning products such as anti-static foam, conductive foam, and antistatic bubble wrap. Safe tubing and sheeting roll stocks are also used for this purpose as a company can create bags with the help of safe poly tubing and roll stock materials can be used to create protective covers and wall partitions.

Market outlook.

The prime factor behind the global growth of ESD packaging can be attributed to the miniaturization of electronic devices coupled with the growing demand for smartphones and smart devices. Factors like the rising trend of IoT (Internet of things) and improving ICT infrastructure coupled with penetration of the internet drive the demand for smartphones and devices while augmenting the global ESD packaging market. In addition to this, the high adoption of technology in automobiles coupled with high-speed innovation creates ample opportunities for the market to grow over the projected period. However, strict regulations for specific materials may restrain the growth prospects of the ESD packaging market on a global platform.

The Asia Pacific has contributed significantly to the growth of the market over the years.

COVID-19 Impact on the ESD Packaging Market

The market witnessed a slight decline during the year 2020 owing to the COVID-19 pandemic which decreased the sales of consumer electronics significantly in the initial period. Moreover, the logistics of the products got difficult during the year as the governments imposed strict lockdowns across several countries. The operations are expected to resume beginning from the year 2021 and the market for ESD packaging is anticipated to recover and regain the lost market in the coming years. Moreover, the rise in the e-commerce sector due to the pandemic has resulted in the rise in the demand for ESD packaging.

The growing demand for smart devices is expected to drive the market during the forecast period.

Global ESD Packaging Market Scope:

Report Metric Details
 Market size value in 2019  US$3.417 billion
 Market size value in 2026  US$5.635 billion
 Growth Rate  CAGR of 7.41% from 2019 to 2026
 Base year  2019
 Forecast period  2021–2026
 Forecast Unit (Value)  USD Billion
 Segments covered  End-Users, And Geography
 Regions covered  North America, South America, Europe, Middle East and Africa, Asia Pacific
 Companies covered  TIP Corporation, Polyplus Packaging Ltd, BASF SE, Miller Supply Inc., Desco   Industries, DowDuPont, PPG Industries, AUER Packaging, Summit Container, Dou   Yee  Enterprises
 Customization scope  Free report customization with purchase
   

 

Segmentation

  • By End-users
    • Consumer Electronics Industry
    • Aerospace and Defense Industry
    • Automotive Industry
    • Communication Network Infrastructure
    • Computer Peripherals
    • Healthcare Industry
    • Other
  • By Geography
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • UK
      • Others
    • Middle East & Africa
      • Saudi Arabia
      • Israel
      • Others
    • Asia Pacific
      • China
      • India
      • Japan
      • South Korea
      • Taiwan
      • Thailand
      • Indonesia
      • Others

Frequently Asked Questions (FAQs)

Q1. What will be the ESD packaging market size by 2026?
A1. The global ESD packaging market is projected to reach a market size of US$5.635 billion in 2026.


Q2. What is the size of global ESD packaging market?
A2. ESD Packaging Market was valued at US$3.417 billion in 2019.


Q3. What are the growth prospects for the ESD packaging market?
A3. The ESD packaging market is projected to grow at a CAGR of 7.41% over the forecast period.


Q4. Which region holds the maximum market share of the ESD packaging market?
A4. The Asia Pacific has contributed significantly to the growth of the ESD packaging market over the years.


Q5. What factors are anticipated to drive the ESD packaging market growth?
A5. The prime factor behind the global growth of ESD packaging can be attributed to the miniaturization of electronic devices coupled with the growing demand for smartphones and smart devices.

1. Introduction
1.1. Market Definition
1.2. Market Segmentation

2. Research Methodology
2.1. Research Data
2.2. Assumptions

3. Executive Summary
3.1. Research Highlights

4. Market Dynamics
4.1. Market Drivers
4.2. Market Restraints
4.3. Porters Five Forces Analysis
4.3.1. Bargaining Power of End-Users
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. ESD Packaging Market Analysis, by End-users
5.1. Introduction
5.2. Consumer Electronics Industry
5.3. Aerospace And Defense Industry
5.4. Automotive Industry
5.5. Communication Network Infrastructure
5.6. Computer Peripherals
5.7. Healthcare Industry
5.8. Other

6. ESD Packaging Market Analysis, by Geography
6.1. Introduction
6.2. North America
6.2.1. USA
6.2.2. Canada
6.2.3. Mexico
6.3. South America
6.3.1. Brazil
6.3.2. Argentina
6.3.3. Others
6.4. Europe
6.4.1. Germany
6.4.2. France
6.4.3. UK
6.4.4. Others
6.5. Middle East and Africa
6.5.1. Saudi Arabia
6.5.2. UAE
6.5.3. Others
6.6. Asia Pacific
6.6.1. China
6.6.2. India
6.6.3. Japan
6.6.4. South Korea
6.6.5. Taiwan
6.6.6. Thailand
6.6.7. Indonesia
6.6.8. Others

7. Competitive Environment and Analysis
7.1. Major Players and Strategy Analysis
7.2. Emerging Players and Market Lucrativeness
7.3. Mergers, Acquisitions, Agreements, and Collaborations
7.4. Vendor Competitiveness Matrix

8. Company Profiles 
8.1. TIP Corporation
8.2. Polyplus Packaging Ltd,
8.3. BASF SE
8.4. Miller Supply Inc.
8.5. Desco Industries
8.6. DowDuPont
8.7. PPG Industries
8.8. AUER Packaging
8.9. Summit Container
8.10. Dou Yee Enterprises

TIP Corporation

Polyplus Packaging Ltd,

BASF SE

Miller Supply Inc.

Desco Industries

DowDuPont

PPG Industries

AUER Packaging

Summit Container

Dou Yee Enterprises

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