The global ESD packaging market was valued at US$2.971 billion in 2017 and is expected to grow at a CAGR of 7.25% to reach a market size of US$4.216 billion by the year 2022. Electrostatic discharge materials are those plastic materials which decreases static electricity in order to protect electrostatic sensitive devices. The electrostatic discharge materials should be packaged carefully as they can contain flammable liquids or gases. They can be packaged with foam and cushioning products such as anti static foam, conductive foam and antistatic bubble wrap. Safe tubing and sheeting roll stocks are also used for this purpose as a company can create bags with the help of safe poly tubing and roll stock materials can be used to create protective covers and wall partitions.
The prime factor behind the global growth of ESD packaging can be attributed to miniaturization of electronic devices coupled with growing demand for smart phones and smart devices. Factors like rising trend if IoT (Internet of things) and improving ICT infrastructure coupled with penetration of internet drive the demand for smart phones and devices while augmenting the global ESD packaging market. In addition to this, high adoption of technology in automobiles coupled with high speed innovation creates ample opportunities for the market to grow over the projected period. However, strict regulations for specific materials may restrain the growth prospects of ESD packaging market on a global platform.
Geographically, Asia Pacific region is expected to drive the global market of ESD packaging over the estimated years on account of presence of numerous electronic manufacturers in countries like South Korea, Taiwan, Japan and China. Moreover, the improving ICT infrastructure along with growing demand for smart phone and other electronic devices further contribute to the market growth.
Firstly, the report provides a brief introduction of the market and deals with detailed research methodology for calculating market size and forecasts, secondary data sources used and the primary inputs which were taken for data validation. This section also outlines various segmentations which have been covered as part of the report.
Next, the section provides comprehensive market dynamics through an overview section along with growth drivers, challenges, and opportunities which exist in the current market. This section of the report also provides supplier and industry outlook as a whole; key industry, global and regional regulations which are determining the market growth and a brief technological aspect of ESD Packaging. Complete industry analysis has also been covered by Porter’s five forces model as a part of this report section.
Thirdly, ESD Packaging Market has been segmented on the basis of end users and geography as follows:
By End Users
Consumer Electronics Industry
Aerospace and Defense Industry
Communication Network Infrastructure
Europe Middle East and Africa
Middle East and Africa
Finally, competitive intelligence section deals with major players in the market, their market shares, growth strategies, products, financials, and recent investments among others. Key industry players profiled as part of this section are TIP Corporation, Polyplus Packaging Ltd., BASF SE, Miller Supply Inc., Desco Industries, DowDuPont and PPG Industries.