Global ESD Packaging Market Size, Share, Opportunities, And Trends By End-Users (Consumer Electronics Industry, Aerospace And Defense Industry, Automotive Industry, Communication Network Infrastructure, Computer Peripherals, Healthcare Industry, Other), And By Geography - Forecasts From 20225 To 2030

  • Published : May 2025
  • Report Code : KSI061610754
  • Pages : 154
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ESD Packaging Market Size:

The ESD packaging market is expected to grow at a CAGR of 5.19% from US$2.82 billion in 2025 to US$3.63 billion in 2030.

Electrostatic discharge (ESD) materials are those plastic materials that decrease static electricity to protect electrostatic-sensitive devices. The electrostatic discharge materials should be packaged carefully as they can contain flammable liquids or gases. They can be packaged with foam and cushioning products such as anti-static foam, conductive foam, and antistatic bubble wrap. 

ESD Packaging Market Trends:

The prime factor behind the global growth of ESD packaging can be attributed to the miniaturization of electronic devices coupled with the growing demand for smartphones and smart devices. Factors like the rising trend of IoT (Internet of Things) and improving ICT infrastructure, coupled with penetration of the internet, drive the demand for smartphones and devices while augmenting the global ESD packaging market. In addition, the high adoption of technology in automobiles, coupled with high-speed innovation, is creating ample opportunities for the market players to grow over the projected period. However, strict regulations for specific materials continues to remain a major challenge. 

The prime factor behind the global growth of ESD packaging can be attributed to the miniaturization of electronic devices coupled with the growing demand for smartphones and smart devices. Factors like the rising trend of IoT (Internet of things) and improving ICT infrastructure coupled with penetration of the internet drive the demand for smartphones and devices while augmenting the global ESD packaging market. In addition to this, the high adoption of technology in automobiles coupled with high-speed innovation creates ample opportunities for the market to grow over the projected period. However, strict regulations for specific materials may restrain the growth prospects of the ESD packaging market on a global platform.

ESD Packaging Market Geographical Outlook:

  • The Asia Pacific has contributed significantly to the growth of the market over the years.

ESD Packaging Market Scope:

Report Metric Details
ESD Packaging Market Size in 2025 US$2.82 billion
ESD Packaging Market Size in 2030 US$3.63 billion
Growth Rate CAGR of 5.19%
Study Period 2020 to 2030
Historical Data 2020 to 2023
Base Year 2024
Forecast Period 2025 – 2030
Forecast Unit (Value) USD Billion
Segmentation
  • End-Users
  • Geography
Geographical Segmentation North America, South America, Europe, Middle East and Africa, Asia Pacific
List of Major Companies in ESD Packaging Market
  • TIP Corporation
  • Polyplus Packaging Ltd,
  • BASF SE
  • Miller Supply Inc.
  • Desco Industries
Customization Scope Free report customization with purchase

 

The ESD Packaging Market is analyzed into the following segments:

  • By End-users
    • Consumer Electronics Industry
    • Aerospace and Defense Industry
    • Automotive Industry
    • Communication Network Infrastructure
    • Computer Peripherals
    • Healthcare Industry
    • Other
  • By Geography
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • UK
      • Others
    • Middle East & Africa
      • Saudi Arabia
      • Israel
      • Others
    • Asia Pacific
      • China
      • India
      • Japan
      • South Korea
      • Taiwan
      • Thailand
      • Indonesia
      • Others

Frequently Asked Questions (FAQs)

The ESD packaging market is expected to reach a total market size of US$3.63 billion by 2030.

ESD Packaging Market is valued at US$2.82 billion in 2025.

The ESD packaging market is expected to grow at a CAGR of 5.19% during the forecast period.

The prime factor behind the global growth of ESD packaging can be attributed to the miniaturization of electronic devices coupled with the growing demand for smartphones and smart devices.

The North American region is anticipated to hold a significant share of the ESD packaging market.

1. Introduction
1.1. Market Definition
1.2. Market Segmentation

2. Research Methodology
2.1. Research Data
2.2. Assumptions

3. Executive Summary
3.1. Research Highlights

4. Market Dynamics
4.1. Market Drivers
4.2. Market Restraints
4.3. Porters Five Forces Analysis
4.3.1. Bargaining Power of End-Users
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. ESD Packaging Market Analysis, by End-users
5.1. Introduction
5.2. Consumer Electronics Industry
5.3. Aerospace And Defense Industry
5.4. Automotive Industry
5.5. Communication Network Infrastructure
5.6. Computer Peripherals
5.7. Healthcare Industry
5.8. Other

6. ESD Packaging Market Analysis, by Geography
6.1. Introduction
6.2. North America
6.2.1. USA
6.2.2. Canada
6.2.3. Mexico
6.3. South America
6.3.1. Brazil
6.3.2. Argentina
6.3.3. Others
6.4. Europe
6.4.1. Germany
6.4.2. France
6.4.3. UK
6.4.4. Others
6.5. Middle East and Africa
6.5.1. Saudi Arabia
6.5.2. UAE
6.5.3. Others
6.6. Asia Pacific
6.6.1. China
6.6.2. India
6.6.3. Japan
6.6.4. South Korea
6.6.5. Taiwan
6.6.6. Thailand
6.6.7. Indonesia
6.6.8. Others

7. Competitive Environment and Analysis
7.1. Major Players and Strategy Analysis
7.2. Emerging Players and Market Lucrativeness
7.3. Mergers, Acquisitions, Agreements, and Collaborations
7.4. Vendor Competitiveness Matrix

8. Company Profiles 
8.1. TIP Corporation
8.2. Polyplus Packaging Ltd,
8.3. BASF SE
8.4. Miller Supply Inc.
8.5. Desco Industries
8.6. DowDuPont
8.7. PPG Industries
8.8. AUER Packaging
8.9. Summit Container
8.10. Dou Yee Enterprises

TIP Corporation

Polyplus Packaging Ltd,

BASF SE

Miller Supply Inc.

Desco Industries

DowDuPont

PPG Industries

AUER Packaging

Summit Container

Dou Yee Enterprises