Global Memory Packaging Market Size, Share, Opportunities, And Trends By Platform (Flip-Chip, Lead Frame, Wafer Level Chip Scale Packaging, Through Silicone Via, Wire Bond), By Application (NAND Flash, NOR Flash, DRAM, Others), By End User (Automotive, Consumer Electronics, Aerospace, Others), And By Geography - Forecasts From 2023 To 2028

  • Published : Apr 2023
  • Report Code : KSI061614911
  • Pages : 140

A memory package is a tiny circuit board with memory chips on it. Some examples of memory packages include SIMM, DIMMS, SO-DIMMs, and RIMMs. A variety of memory device packaging solutions are available depending on the product's density, performance, and cost, ranging from low-pin-count SOP packages to high-pin-count TSV packages. A variety of packaging techniques are used by memory devices, including wire-bond, flip-chip, through-silicon via or TSV and lead-frame. The global market for memory packaging is segmented into the platform, application, end-user industry and geographical region.

Growing demand for the miniaturization of electronic devices, high bandwidth memory chips and the adoption of cutting-edge chip designs with improved properties is one of the primary factors driving the growth of the global market during the analysis period. Moreover, high-performance computing applications from various end-user industries are also contributing to the memory packaging market’s expansion. Significant technological progress along with continuous product innovations and rising R&D operations by key market players is also propelling the growth of the global market. Due to the growth of the Internet of Things, wearable electronics, augmented reality, virtual reality, and high-performance PCs, the demand for memory packaging solutions is set to skyrocket.

Based on application the market for memory packaging is segmented into NAND Flash, NOR Flash, DRAM and Others. The DRAM segment is anticipated to hold a significant market share during the analysis period. The growing demand for high-memory smartphones and other mobile devices is expected to propel the demand for this segment as it is projected that each smartphone will have a DRAM memory capacity of about 6GB by 2022. According to a report published by Ericsson shows that there are approximately 6 billion smartphone subscriptions and is forecasted to reach 7.69 billion by 2026. Moroever, applications including deep learning, data centres, networking, augmented reality & virtual reality, and autonomous driving are driving the growth of this segment. Companies in this market are launching new and innovative technology to provide memory packaging solutions which are spurring demand even further. For instance, Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology, launched the first 12-layer 3D-TSV technology in October 2019. The new technology keeps the width of the existing 8-layer device while stacking 12 DRAM chips utilising more than 60,000 TSV holes. This 8-layer High Bandwidth Memory-2 product still has the same package thickness of 720 m, which represents a significant development in component design. Customers will be able to introduce high-capacity, next-generation products with improved performance without having to alter their system configuration designs.

During the anticipation period, the rising demand for memory packaging solutions in various end-user industries will support the growth of the global market during the projection period.

There is growth in the demand for memory and high-performance computing applications from various end-user industries such as automotive, aerospace, consumer electronics etc is driving the growth of the memory packaging market during the analysis period. The expanding trend of autonomous driving and in-vehicle infotainment may lead to a rise in the acceptability of DRAM memory in the automotive sector, which employs low-density memory. The demand for NOR flash memory packaging solutions is also growing due to its use in emerging markets including touch display ICs, AMOLED displays, and industrial IoT.

For the consumer electronics industry memory packaging will largely continue to be done on the wire-bond BGA architecture for mobile applications. For high-end smartphones, it will soon start to shift towards the multi-chip package like ePOP. To achieve high density in a single package, NAND is layered utilising wire bonding which results in a higher data transfer rate. The demand for Si-based sensor technology has increased recently for many different applications, including biometric sensors, CMOS image sensors, and MEMS sensors, including accelerometers. Sensor devices are being incorporated into portable devices like phones and PDAs in an increasing number of ways. Small size, low cost, and simplicity of integration are crucial in various applications for the effective integration of this sensor technology which is provided by memory packaging solutions.

Asia Pacific is anticipated to hold a significant amount of the global memory packaging market share during the forecast period.

Asia Pacific region is anticipated to hold a significant market share in memory packaging. This region will witness high growth during the forecast period owing to the well-established consumer electronics and semiconductor industry in countries such as South Korea, China and Japan. Consumer electronics have grown more rapidly as a result of the growing popularity of smartphones and the demand for new memory technologies, opening up a wide range of opportunities in this region. The introduction of 5G technology is anticipated to increase sales of 5G smartphones, which could expand the market in the telecommunications industry because silicon wafers are frequently used to manufacture smartphones. The memory packaging market is anticipated to grow strongly due to rising sales of MEMS and sensors and growing technological advancements in consumer applications like smartphones, tablets, and wearables in the Asia Pacific region. Rising government investment to expand the semiconductor industry in countries such as India and China is also driving the growth of the market in this region. The presence of key market players such as TSMC, Samsung Group, Toshiba Corporation and ASE group is also propelling the growth of the memory packaging market in this region. Prime markets in the Asia Pacific region are India, China, Japan, South Korea, Taiwan, Thailand and Indonesia.

Market Key Developments

  • In September 2022, Solidigm, an SK Hynix NAND flash subsidiary invested more than $100 million to build a semiconductor R&D facility will be built in Rancho Cordovs, Sacramento, California. In the first quarter of 2023, it will relocate into a new R&D campus that will be constructed on a 230,000 square-foot (or 21,367 square metres) property.
  • In June 2022, Indian semiconductor company Sahasra announced to invest Rs750 crore to build a memory chip production facility in Rajasthan. The facility is expected to be operational by the end of 2022.


  • By Platform
    • Flip-Chip
    • Lead Frame
    • Wafer Level Chip Scale Packaging
    • Through Silicone Via
    • Wire Bond
  • By Application
    • NAND Flash
    • NOR Flash
    • DRAM
    • Others
  • By End User
    • Automotive
    • Consumer Electronics
    • Aerospace
    • Others
  • By Geography
    • North America
      • USA
      • Canada
      • Others
    • South America
      • Brazil
      • Others
    • Europe
      • Germany
      • UK
      • France
      • Others
    • Middle East and Africa
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • South Korea
      • India
      • Taiwan
      • Thailand
      • Indonesia
      • Others


1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumption

1.7. Base and Forecast Years Timeline


2.1. Research Data

2.2. Assumptions


3.1. Research Highlights


4.1. Market Drivers

4.2. Market Restraints

4.3. Market Opportunities

4.4. Porter’s Five Force Analysis

4.4.1. Bargaining Power of Suppliers

4.4.2. Bargaining Power of Buyers

4.4.3. Threat of New Entrants

4.4.4. Threat of Substitutes

4.4.5. Competitive Rivalry in the Industry

4.5. Industry Value Chain Analysis


5.1. Introduction

5.2. Flip-Chip

5.3. Lead-Frame

5.4. Wafer-Level Chip-Scale Packaging

5.5. Through-silicon Via

5.6. Wire-Bond


6.1. Introduction

6.2. NAND Flash

6.3. NOR Flash

6.4. DRAM

6.5. Others 


7.1. Introduction

7.2. Automotive

7.3. Consumer electronics 

7.4. Aerospace 

7.5. Others 


8.1. Introduction

8.2. North America 

8.2.1. USA

8.2.2. Canada

8.2.3. Mexico

8.3. South America 

8.3.1. Brazil

8.3.2. Argentina

8.3.3. Others

8.4. Europe 

8.4.1. UK

8.4.2. Germany

8.4.3. France

8.4.4. Italy

8.4.5. Spain 

8.4.6. Others

8.5. Middle East and Africa 

8.5.1. Saudi Arabia

8.5.2. UAE

8.5.3. Others

8.6. Asia Pacific 

8.6.1. China

8.6.2. Japan

8.6.3. India

8.6.4. South Korea

8.6.5. Taiwan 

8.6.6. Others


9.1. Major Players and Strategy Analysis

9.2. Emerging Players and Market Lucrativeness

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Vendor Competitiveness Matrix


10.1. Tianshui Huatian Technology Co Ltd

10.2. ASE Group

10.3. Amkor Technology Inc 

10.4. Powertech Technology Inc 

10.5. King Yuan Electronics Corp Ltd

10.6. ChipMOS Technologies Inc

10.7. TongFu Microelectronics Co

10.8. Signetics Corporation

10.9. OSE Corp

10.10. Biwin 

Tianshui Huatian Technology Co Ltd,

ASE Group,

Amkor Technology Inc,

Powertech Technology Inc,

King Yuan Electronics Corp Ltd,

ChipMOS Technologies Inc,

TongFu Microelectronics Co,

Signetics Corporation,

OSE Corp


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