Industrial Electronic Packaging Market Size, Share, Opportunities, And Trends By Product (Testing And Measuring Equipment, Process Control Equipment, Industrial Controls, Power Electronics, Industrial Automation Equipment, Others), By Material (Plastic, Paper, Paperboard), By Packaging Type (Rigid, Flexible), By End-Users (Consumer Electronics, Aerospace And Defense, Automotive, Telecommunication, Others), And By Geography - Forecasts From 2023 To 2028

  • Published : Nov 2023
  • Report Code : KSI061615626
  • Pages : 149

The industrial electronic packaging market is estimated to grow at a CAGR of 6.20% during the forecast period.

Industrial electronic packaging involves designing and manufacturing packaging solutions for industrial goods, ensuring their protection and transportation. The process includes assessing needs, designing, prototyping, manufacturing, ensuring quality, and distribution. The market is driven by several growth factors, including the increasing adoption of automation and smart manufacturing technologies, and the rise in demand for electronics in automotive, aerospace, and energy. Also, the need for durable and reliable packaging to protect sensitive electronic components in harsh operating environments is further augmenting the market growth.

Market Drivers:

  • Increasing Adoption of Automation and Smart Manufacturing.

The growing trend of automation and smart manufacturing in industrial sectors drives the demand for industrial electronics. This, in turn, boosts the need for specialized packaging solutions to protect and transport electronic components used in automated systems and smart devices.

  • Rising Demand for Industrial Electronics.

Industries such as automotive, aerospace, energy, and manufacturing are increasingly relying on electronic components for improved efficiency and functionality. This surge in demand for industrial electronics leads to a higher requirement for packaging solutions that can safeguard these sensitive components during transportation and operation.

  • Need for Durable and Reliable Packaging.

Industrial environments often involve harsh operating conditions, including temperature variations, moisture, and exposure to dust or chemicals. The industrial electronics packaging market addresses this need by providing packaging solutions that offer durability, protection, and reliability, ensuring the safe and secure functioning of electronic components in challenging industrial settings.

  • Technological Advancements:

Continuous advancements in industrial electronics, such as smaller and more powerful components, create a need for packaging solutions that accommodate miniaturization without compromising functionality or protection. The development of innovative packaging materials, designs, and manufacturing processes keeps pace with technological advancements, driving growth in the market.

  • Positive growth in the rigid packaging segment:

The rigid packaging format is showing massive growth in the industrial electronic packaging market. This is due to the increasing demand for high-performance electronic devices that require rugged and protective packaging. Rigid packaging formats offer several advantages over other packaging formats, including strength, protection, and heat dissipation. As the demand for high-performance electronic devices continues to grow, the demand for rigid packaging is also expected to grow.

Asia Pacific region is expected to hold a significant share:

The Asia-Pacific region is projected to have a significant share of the industrial electronic packaging market in the anticipated period. This dominance is attributed to factors such as the growing demand for electronic devices, the expansion of the manufacturing sector, and government support. Countries like China, India, Japan, South Korea, and Taiwan are expected to experience substantial growth in this market as the increasing demand for consumer electronics, industrial electronics, and automotive electronics in the countries are key drivers for this growth.

Key developments:

  • In June 2022, PCB Technologies introduced iNPACK, a subsidiary providing advanced SiP solutions for various industries. iNPACK focuses on enhancing signal integrity, reducing inductance effects, and offering diverse packaging options.

Industrial Electronic Packaging Market Scope:

 

Report Metric Details
Growth Rate CAGR of 6.20% from 2021 to 2028
Base Year 2021
Forecast Period 2023 – 2028
Forecast Unit (Value) USD Billion
Segments Covered Product, Material, Packaging Type, End-Users, and Geography
Regions Covered North America, South America, Europe, Middle East and Africa, Asia Pacific
Companies Covered DS Smith, International Paper, Sonoco Products Company, Sealed Air, Smurfit Kappa, UFP Technologies, Inc., Stora Enso, Universal Protective Packaging, Inc., Parksons Packaging Ltd., Macfarlane Group PLC
Customization Scope Free report customization with purchase

 

Segmentation:

  • By Product
    • Testing and Measuring Equipment
    • Process Control Equipment
    • Industrial Controls
    • Power Electronics
    • Industrial Automation Equipment
    • Others
  • By Material
    • Plastic
    • Paper
    • Paperboard
  • By Packaging Type
    • Rigid
    • Flexible
  • By End-Users
    • Consumer electronics
    • Aerospace and Defense
    • Automotive
    • Telecommunication
    • Others
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • United Kingdom
      • Germany
      • France
      • Italy
      • Spain    
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Others
    • Asia Pacific
      • Japan
      • China
      • India
      • South Korea
      • Taiwan
      • Thailand
      • Indonesia
      • Others

Frequently Asked Questions (FAQs)

The global industrial electronic packaging market is estimated to grow at a CAGR of 6.20% during the forecast period.
Prominent key market players in the industrial electronic packaging market include DS Smith, International Paper, Sonoco Products Company, Sealed Air, and Smurfit Kappa, among others.
The industrial electronic packaging market has been segmented by product, material, packaging type, end-users, and geography.
The industrial electronic packaging market is driven by several growth factors, including the increasing adoption of automation and smart manufacturing technologies.
The Asia-Pacific region is projected to have significant growth in the industrial electronic packaging market.

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Market Opportunities

4.4. Porter’s Five Force Analysis

4.4.1. Bargaining Power of Suppliers

4.4.2. Bargaining Power of Buyers

4.4.3. Threat of New Entrants

4.4.4. Threat of Substitutes

4.4.5. Competitive Rivalry in the Industry

4.5. Industry Value Chain Analysis

5. INDUSTRIAL ELECTRONICS PACKAGING MARKET BY PRODUCT

5.1. Introduction

5.2. Testing and Measuring Equipment

5.3. Process Control Equipment

5.4. Industrial Controls

5.5. Power Electronics

5.6. Industrial Automation Equipment

5.7. Others

6. INDUSTRIAL ELECTRONICS PACKAGING MARKET BY MATERIAL

6.1. Introduction

6.2. Plastic

6.3. Paper

6.4. Paperboard

7. INDUSTRIAL ELECTRONICS PACKAGING MARKET BY PACKAGING TYPE

7.1. Introduction

7.2. Rigid

7.3. Flexible

8. INDUSTRIAL ELECTRONICS PACKAGING MARKET BY END-USER

8.1. Introduction

8.2. Consumer Electronics

8.3. Aerospace & Defense

8.4. Automotive

8.5. Telecommunication

8.6. Others

9. INDUSTRIAL ELECTRONICS PACKAGING MARKET BY GEOGRAPHY

9.1. Introduction

9.2. North America

9.2.1. United States

9.2.2. Canada

9.2.3. Mexico

9.3. South America

9.3.1.  Brazil

9.3.2. Argentina

9.3.3. Others

9.4. Europe

9.4.1. United Kingdom

9.4.2. Germany

9.4.3. France

9.4.4. Italy

9.4.5. Spain

9.4.6. Others

9.5. Middle East and Africa

9.5.1. Saudi Arabia

9.5.2. UAE

9.5.3. Others

9.6. Asia Pacific

9.6.1. Japan

9.6.2. China

9.6.3. India

9.6.4. South Korea

9.6.5. Taiwan

9.6.6. Thailand

9.6.7. Indonesia

9.6.8. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

10.1. Major Players and Strategy Analysis

10.2. Market Share Analysis

10.3. Mergers, Acquisitions, Agreements, and Collaborations

11. COMPANY PROFILES

11.1. DS Smith

11.2. International Paper

11.3. Sonoco Products Company

11.4. Sealed Air

11.5. Smurfit Kappa

11.6. UFP Technologies, Inc.

11.7. Stora Enso

11.8. Universal Protective Packaging, Inc.

11.9. Parksons Packaging Ltd.

11.10. Macfarlane Group PLC


DS Smith

International Paper

Sonoco Products Company

Sealed Air

Smurfit Kappa

UFP Technologies Inc.

Stora Enso

Universal Protective Packaging Inc.

Parksons Packaging Ltd.

Macfarlane Group PLC