Non-UV Dicing Tapes Market Size, Share, Opportunities, And Trends By Material Type (PET, PO, PVC, Others), By Thickness (Below 85 Micron, Above 150 Micron, 85-125 Micron, 126-150 Micron), By Coating (Double Sided, Single Sided), By Application (Package Dicing, Wafer Dicing, Others), And By Geography - Forecasts From 2023 To 2028

The non-UV dicing tapes market is estimated to grow at a CAGR of 6.51% during the forecast period.

Non-UV dicing tapes are adhesive materials used in semiconductor manufacturing to securely hold delicate silicon wafers during the dicing process. Unlike traditional UV-sensitive dicing tapes that require exposure to ultraviolet light for bonding, non-UV dicing tapes offer a more efficient and versatile solution. These tapes adhere to wafers without UV exposure, providing strong fixation and protection during dicing, where wafers are cut into individual integrated circuits or chips. Non-UV dicing tapes streamline the manufacturing process, reduce cycle times, and minimize the risk of UV-related issues, making them a preferred choice in semiconductor packaging and assembly.

Introduction:

The non-UV dicing tapes market is projected to grow at a significant level in the forecast period. The non-UV dicing tapes market pertains to the industry that produces and supplies specialized adhesive tapes utilized in semiconductor manufacturing processes. These tapes offer an alternative to UV-sensitive dicing tapes, ensuring secure wafer fixation during dicing without the need for ultraviolet light exposure. As the semiconductor industry evolves and demands more efficient and reliable solutions, the non-UV dicing tapes market experiences growth driven by benefits such as enhanced process efficiency, reduced UV-related challenges, and improved yield rates, thus contributing to advancements in semiconductor packaging and assembly techniques.

Drivers:

• Advanced Semiconductor Technologies: The continuous evolution of semiconductor technologies, including smaller chip sizes and more intricate designs, necessitates reliable wafer handling during dicing. Non-UV dicing tapes provide secure adhesion without UV exposure, catering to the demanding requirements of modern semiconductor manufacturing.
• Enhanced Yield and Quality: Non-UV dicing tapes contribute to improved yield rates by minimizing UV-related challenges such as tape degradation or wafer contamination. Their consistent bonding strength and protection during dicing result in higher-quality chips and reduced waste, driving their adoption.
• Process Efficiency: The elimination of UV exposure steps simplifies the dicing process, reducing cycle times and operational complexity. Non-UV dicing tapes streamline manufacturing processes, enhancing efficiency and allowing semiconductor facilities to produce more chips in less time.
• Reduced Cost and Complexity: The absence of UV exposure equipment, related maintenance, and associated processes reduces operational costs and complexity. Non-UV dicing tapes offer a cost-effective solution by minimizing the need for additional resources and specialized equipment.
• Compatibility with Fragile Materials: Semiconductor wafers incorporating advanced materials, such as gallium nitride (GaN) or silicon carbide (SiC), are sensitive to UV radiation. Non-UV dicing tapes are compatible with these fragile materials, making them a preferred choice for cutting-edge semiconductor applications.
• Miniaturization and Higher Throughput: As the demand for smaller and more powerful devices increases, manufacturers require dicing methods that support higher throughput. Non-UV dicing tapes enable precision cutting of smaller chips without compromising quality or efficiency.
• Sustainability and Environmental Concerns: Industries are increasingly focused on reducing their environmental footprint. Non-UV dicing tapes align with sustainability initiatives by eliminating UV exposure, reducing energy consumption, and lowering the use of UV-sensitive materials.
• Global Semiconductor Demand: The growing demand for semiconductor components across industries like electronics, automotive, and communication technologies drives the need for efficient and reliable dicing processes. Non-UV dicing tapes ensure consistent quality and performance, meeting the expanding requirements of these sectors.
• Material Innovation: Ongoing advancements in tape materials enhance their adhesive properties, temperature resistance, and mechanical strength. Non-UV dicing tapes benefit from material innovations, supporting cutting-edge semiconductor manufacturing techniques.
• Industry Standards and Regulations: As the semiconductor industry matures, standardized practices and regulations become essential. Non-UV dicing tapes, offering a reliable and consistent alternative, align with industry standards and contribute to the overall quality and uniformity of semiconductor production.

Products offered by key companies:

• Nitto Denko launched its EcoTape a non-UV dicing tape that is made from a water-based adhesive and is designed to be free of harmful chemicals, such as UV curable resins. EcoTape is used in a variety of applications, including semiconductor manufacturing, solar cell manufacturing, and LED manufacturing.
• Henkel launched its Technomelt a non-UV dicing tape that is made from a solvent-free adhesive and is designed to be lower in emissions than traditional UV curable tapes. Technomelt is used in a variety of applications, including semiconductor manufacturing, solar cell manufacturing, and LED manufacturing.
• Tesa launched its Tesa 4965 a non-UV dicing tape that is made from a acrylic adhesive and is designed to be solvent-free and recyclable. Tesa 4965 is used in a variety of applications, including semiconductor manufacturing, solar cell manufacturing, and LED manufacturing.

Expansion in the PET sector is being propelled within the non-UV dicing tape market:

The PET (Polyethylene Terephthalate) segment of the non-UV dicing tape market is witnessing significant growth. This surge is attributed to PET's exceptional mechanical properties, robust barrier performance, and versatility, making it ideal for demanding applications such as package dicing and wafer dicing in the semiconductor industry. With options for various thicknesses and both single and double-sided coatings, PET's durability, flexibility, and ease of use have driven its popularity. As the semiconductor industry continues to expand, the PET segment is primed to capitalize on its strengths, contributing to its rapid growth in the non-UV dicing tape market.

The Asia-Pacific region is poised to emerge as the top player in getting the most of the market shares for non-UV dicing tapes:

It's expected that the Asia-Pacific region will become a leader in the market for non-UV dicing tapes due to compelling factors. This region boasts a significant presence of semiconductor manufacturing hubs and technological advancements, creating a robust demand for efficient and reliable dicing solutions. As Asia-Pacific economies continue to drive innovations in electronics, including IoT and 5G technologies, the need for advanced semiconductor packaging grows. With a combination of established semiconductor infrastructure, emerging technologies, and increasing demand for electronic devices, the Asia-Pacific region is strategically positioned to lead in adopting non-UV dicing tapes, solidifying its dominance in the market.

Key developments:

• In Feb 2023, Tesa launched tesa 51344 that is a new paper tear tape for eco-friendly packaging. It sticks well to recycled materials, can be recycled with packaging, and is verified as recyclable by the Paper Technology Foundation. It's a step towards sustainable shipping solutions.
• In May 2022, Furukawa Electric plans to invest JPY 7.0 billion to expand semiconductor tape production for growing demand. A new Mie Works factory launching in April 2025 aims to ensure steady, high-quality tape supply. The initiative supports technology and sustainability goals, including solar power and energy efficiency.

Key Segment:

• By Material Type
  • PET
  • PO
  • PVC
  • Others
• By Thickness
  • Below 85 Micron
  • Above 150 Micron
  • 85-125 Micron
  • 126-150 Micron
• By Coating
  • Double Sided
  • Single Sided
• By Application
  • Package Dicing
  • Wafer Dicing
  • Others
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain    
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • UAE
    • Others
  • Asia Pacific
    • Japan
    • China
    • India
    • South Korea
    • Taiwan
    • Thailand
    • Indonesia
    • Others