Thermally Conductive Filler Dispersants Market Size, Share, Opportunities, And Trends By Type (Metal-based Fillers, Carbon-based Fillers, Ceramic-based Fillers, Others), By Application (Screen Printing, Extrusion, Dispensing, Syringe Dispensing, Spray Coating, Others), By End-User (Electronics And Electrical, Aerospace And Defence, Automotive, Telecommunications, Energy, Consumer Goods, Healthcare And Medical Devices, Others), And By Geography - Forecasts From 2024 To 2029

  • Published : Feb 2024
  • Report Code : KSI061616593
  • Pages : 143

The thermally conductive filler dispersants market is projected to grow considerably during the forecast period

Filler dispersants that exhibit thermal conductivity are essential for augmenting the thermal conductivity of diverse materials, such as adhesives, electronic components, and polymers. To enhance the dispersion of thermally conductive fillers, like metal particles or ceramics, these dispersants are additives that are combined with the base material. They improve the material's overall thermal conductivity by facilitating heat transfer within the material by guaranteeing even distribution. This is especially crucial in sectors like electronics, automotive, aerospace, and energy, where effective heat dissipation keeps components from overheating and maximizes their performance and dependability.

Rising production of electric vehicles

The thermally conductive filler dispersants market will expand as a result of the increasing global production and use of EVs and the ensuing attention to maintaining ideal operating temperatures. 3,20,000 electric vehicles were sold in the United States as of the first quarter of 2023. The need for effective thermal management solutions is growing as a result of the automotive industry's ongoing shift to electrification. These solutions are crucial for improving heat dissipation in batteries and electronic components. Further propelling the industry's expansion is the growing need for different dispersants, which is a result of the increased emphasis on lightweight designs in the automobile industry.

Rising traction towards carbon-based fillers

The thermally conductive filler dispersants market is expected to see strong demand for the carbon-based fillers type segment. Because of their remarkable thermal conductivity, carbon-based fillers—such as graphene and carbon nanotubes—are becoming increasingly in demand as additives across a range of industries. The electronics and automotive industries' increasing emphasis on finding cutting-edge materials for effective thermal management will also fuel product demand for lightweight, high-performance automotive designs and improved heat dissipation in electronic components.

Growing demand for metal fillers

High thermal conductivity metal fillers, like aluminium, copper, and silver, are necessary for effective heat dissipation in a variety of industries. For applications where a certain level of thermal conductivity must be met, their controllable heat conducting efficiency is crucial. Furthermore, the metal particles included in these filler materials have a diameter of less than 20 μm, which is crucial for attaining optimal thermal conductivity and uniform dispersion in thermally conductive polymer composites.

Increasing use in the electronics industry

Thermally conductive filler dispersants are useful in a wide range of devices and applications within the electronics industry. When operating, these crucial parts of servers and PCs produce a lot of heat. Effective thermal management is necessary to preserve their longevity and performance. Filler dispersants that conduct heat well help transfer heat from the processor to the heatsink. The introduction of LEDs has completely changed the lighting industry. But LEDs also generate heat, which may shorten their lifespan and reduce their efficiency. By assisting in the dissipation of heat, thermally conductive materials enhance the overall longevity and performance of LED lights. Stable performance is facilitated by thermally conductive materials, even in tough automotive settings. For the conversion and distribution of energy, equipment such as power supplies and inverters are necessary.

Rising eco-friendly formulations

The market for thermally conductive filler dispersants is not an exception to the growing concern about sustainability. Businesses are concentrating more on creating environmentally friendly formulations with the least possible impact on the environment. Dispersants that are non-toxic and bio-based are becoming more popular as businesses look to lessen their carbon footprint. This development is consistent with larger initiatives to implement sustainable manufacturing practices. Furthermore, heat-producing electronic components are a prerequisite for renewable energy sources like wind and solar power. For these systems to operate efficiently and last a long time, effective heat management is necessary. Inverters, photovoltaic modules, and wind turbine generators all use thermally conductive filler dispersants to dissipate heat and enhance overall performance.

Based on End-User, Energy is expected to grow at a high rate

Electrically conductive composites, or ECCs, are made when conductive fillers are mixed with dispersants and used in printed electronics. Through the development of surface engineering techniques, conductive fillers can now have customized surface functionalities and charges. For a variety of applications, the energy sector can achieve effective heat dissipation through the use of thermally conductive filler dispersants. Furthermore, common thermally conductive fillers for use in thermally conductive filler dispersants for energy applications include metal particles like copper, aluminium, and silver.

Europe is projected to grow at a high rate during the forecast period

Throughout the forecast period, the expanding medical device industry, the rise in TIM innovation and development, and the expanding medical device and electronics industries' production bases are anticipated to support market expansion. In Europe, the thermally conductive filler dispersant market is dominated by thermal insulation glue. Because they can spread a very thin bond line, they are employed. Therefore, a much lower thermal resistance can be achieved if the substrate's co-planarity permits. Because they are easier to use and are increasingly being used in computer applications, phase change materials are the fastest-growing subsegment in the European market. The market for thermally conductive filler dispersants is anticipated to be driven by all these factors in the area.

Market key launches

  • In October 2022, BYK made its debut, one specifically designed additive, BYK-MAX CT 4275, is suitable for use with a broad range of thermoplastics and polyamides. By facilitating the better dispersion and incorporation of the additive into the thermoplastic matrix, BYK-MAX CT 4275 improves the mechanical and thermal conductivity properties of thermal interface materials.
  • In April 2022, Shin-Etsu Co. Ltd. developed the thermal interface rubber silicone sheet series (TC-BGI Series) for use in electric vehicle components as high-voltage device technology advances. This silicone rubber sheet has a strong thermal interface that combines good heat dissipation and voltage resistance.


  • By Type
    • Metal-based fillers
    • Carbon-based fillers
    • Ceramic-based fillers
    • Others
  • By Application
    • Screen printing
    • Extrusion
    • Dispensing
    • Syringe dispensing
    • Spray coating
    • Others
  • By End-User
    • Electronics and Electrical
    • Aerospace and defence
    • Automotive
    • Telecommunications
    • Energy
    • Consumer goods
    • Healthcare and medical devices
    • Others
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • United Kingdom
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Indonesia
      • Taiwan
      • Others


1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline


2.1. Research Design

2.2. Research Data

2.3. Validation


3.1. Key Findings


4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Force Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis


5.1. Introduction

5.2. Metal-based fillers

5.3. Carbon-based fillers

5.4. Ceramic-based fillers

5.5. Others


6.1. Introduction

6.2. Screen printing

6.3. Extrusion

6.4. Dispensing

6.5. Syringe dispensing

6.6. Spray coating

6.7. Others


7.1. Introduction

7.2. Electronics and Electrical

7.3. Aerospace and defence

7.4. Automotive

7.5. Telecommunications

7.6. Energy

7.7. Consumer goods

7.8. Healthcare and medical devices

7.9. Others


8.1. Introduction 

8.2. North America

8.2.1. USA

8.2.2. Canada

8.2.3. Mexico

8.3. South America

8.3.1. Brazil

8.3.2. Argentina

8.3.3. Others

8.4. Europe

8.4.1. Germany

8.4.2. France

8.4.3. United Kingdom

8.4.4. Spain

8.4.5. Others

8.5. Middle East And Africa

8.5.1. Saudi Arabia

8.5.2. UAE

8.5.3. Israel

8.5.4. Others

8.6. Asia Pacific

8.6.1. China

8.6.2. Japan

8.6.3. India

8.6.4. South Korea

8.6.5. Indonesia

8.6.6. Taiwan

8.6.7. Others


9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisition, Agreements, and Collaborations

9.4. Vendor Competitiveness Matrix


10.1. 3M

10.2. Dow Inc.

10.3. Momentive Performance Materials Inc.

10.4. Shin-Etsu Chemical Co., Ltd.

10.5. Wacker Chemie AG

10.6. Evonik Industries AG

10.7. AI Technology, Inc.

10.8. Reade International Corp.

10.9. Panacol-Elosol GmbH


Dow Inc.

Momentive Performance Materials Inc.

Shin-Etsu Chemical Co., Ltd.

Wacker Chemie AG

Evonik Industries AG

AI Technology, Inc.

Reade International Corp.


Panacol-Elosol GmbH