Three-Dimensional Integrated Circuit Market Size, Share, Opportunities, And Trends By Technology (Monolithic, Wafer On Wafer, Die On Wafer, Die On Die), By Application (MEMS, Storage Devices, Sensors, Others), And By Geography - Forecasts From 2019 To 2024

Published: Mar 2020 | Report Code:  KSI061610416 | Pages:  114

The three dimensional integrated circuit market was valued at US$4.909 billion in 2017 and is expected to reach US$15.104 billion in 2023 growing at a CAGR of 20.60% during the forecast period. Growing demand for consumer electronics worldwide is the key driver of global 3D integrated circuit market as these ICs are used to minimize the size and reduce the cost of electronic products. An increasing number of smartphone users is augmenting the demand for 3D integrated circuits for high-functionality of smartphones along with other features such as high battery backup, HD display, multi-tasking abilities, and fast processing speed. By application, storage devices and sensors are projected to hold significant market share due to declining prices of sensors along with the improvement in designs. Furthermore, the emergence of newer applications such as graphics processor unit, cell broadband engine, hybrid memory, and low-density parity check decoder will provide a potential market for 3D integrated circuits in the forthcoming years. Geographically, Asia Pacific will witness significant market growth owing to escalating demand for various consumer electronic products such as smartphones, tablets, and laptops, coupled with booming automotive industry. However, the growth of global 3D integrated circuit market will be restrained by high costs and thermal and testing issues during the forecast period. 

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the pressure sensors value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.

Major industry players profiled as part of the report are Invensas, Amkor Technology, Xilinx, Inc., Tezzaron Semiconductor, Aveni, and Stats ChipPAC Pte. Ltd. among others.


The three-dimensional integrated circuit market has been analyzed through following segments:

By Technology


Wafer on Wafer

Die on Wafer

Die on Die

By Application


Storage Devices



By Geography

North America





South America







United Kingdom



Middle East and Africa



South Africa


Asia Pacific




South Korea