Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Size, Share, Opportunities, and Trends By Device Type (WLAN Infrastructure Devices, Consumer Devices, Wireless Cameras, Industrial IoT Devices, Connected Vehicles, Drones, Others), By Application (Residential/Consumers, Commercial, Industrial, Smart City, Transportation & Logistics, Government & Defense, Others), and By Geography – Forecasts From 2025 to 2030

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Size:

The Wi-Fi 7 and next-gen connectivity chipsets market is anticipated to expand at a high CAGR over the forecast period.

Improvement in wifi performance is anticipated with the future WiFi 7, which will be based on the 802.11be standard. Despite being in its initial stage, WiFi 7 promises even faster speeds, more capacity, and better energy efficiency than its predecessors. To further improve wireless communication, WiFi 7 chipsets are anticipated to include cutting-edge technologies including Multi-User Orthogonal Frequency Division Multiple Access (MU-OFDMA) and more effective modulation techniques. There are many major competitors fighting for market dominance in the fiercely competitive WiFi 7 chipset market. Prominent semiconductor firms that are actively involved in the development and manufacturing of WiFi chipsets include Qualcomm, Broadcom, Intel, MediaTek, and Marvell.

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Overview & Scope: 

The Wi-Fi 7 and next-gen connectivity chipsets market is segmented by:     

• Device Type: The first factor driving the use of WLAN infrastructure devices is the growing need for dependable and fast internet connectivity across a range of sectors and industries. These gadgets, which are the main source of WiFi signal distribution, include switches, routers, and access points. They also form the backbone of wireless networks. Additionally, the Internet of Things (IoT) and the proliferation of smart gadgets have greatly aided in WLAN infrastructure devices growth. The need for strong and effective wireless networks that can manage the increased data traffic is growing as more and more devices such as laptops, tablets, smartphones, and smart home appliances are connected. In addition to offering increased network capacity and coverage, WLAN infrastructure devices supply the framework required to enable numerous concurrent connections.   
• Application: Businesses in the commercial sector, such as offices, lodging facilities, retail establishments, and dining establishments, mainly depend on WiFi access to run their operations. Strong, high-performing wireless networks are necessary for these businesses to meet the needs of their staff, clients, and visitors. The commercial sector has high network traffic because multiple devices, including computers, tablets, smartphones, and Internet of Things devices, are used simultaneously. Through enhanced network capacity, faster data transfer rates, and lower latency, the deployment of WiFi 7 chipsets enables a better user experience in bandwidth-intensive applications. Commercial establishments are therefore eager to improve their wireless infrastructure to acquire a competitive advantage in the market and satisfy the increasing need for connection.  
• Region:  The market is segmented into five major geographic regions, namely North America, South America, Europe, the Middle East Africa, and Asia-Pacific. Asia-Pacific is anticipated to hold the largest share of the market, and it will be growing at the fastest CAGR.

Top Trends Shaping the Wi-Fi 7 and Next-Gen Connectivity Chipsets Market:

1. 5G and Edge Computing Convergence

• The integration of Wi-Fi 7 with 5G and fixed wireless access (FWA) is clearly on the rise, especially for private 5G/Wi-Fi networks, to provide seamless multi-network connectivity. Chipsets that handle both cellular and unlicensed spectrum are being developed to enable real-time analytics and edge computing solutions for sectors including energy, smart retail, and logistics. 

2. Improvements in Security and Efforts to Standardize

• The risk of cyberattacks rises with device density. Quantum-resistant encryption techniques and support for WPA3 and WPA4 are being added to Wi-Fi 7 chipsets. The IEEE and Wi-Fi Alliance are working to standardize chipset features, encourage interoperability, and complete specifications by 2025.

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Growth Drivers vs. Challenges:

Opportunities:

• Growing Need for Fast Internet Access: The market for WiFi 7 chipsets is significantly influenced by the growing need for fast connectivity. Businesses and individuals alike need faster and more dependable internet connections as bandwidth-intensive applications like virtual reality, online gaming, and video streaming proliferate. WiFi 7 chipsets satisfy the increasing demand for high-speed wireless access with faster data transfer rates, reduced latency, and more capacity.
• Developing IoT Environment: An important opportunity for the WiFi 7 chipset industry is the development of the Internet of Things (IoT) ecosystem. As IoT devices proliferate throughout industries, there is a rising need for reliable and effective wireless communication to accommodate these networked devices. Enhanced security features, increased network bandwidth, and improved power efficiency make WiFi 7 chipsets ideal for Internet of Things installations. These chipsets allow a variety of IoT devices, such as wearables, sensors, smart appliances, and industrial machinery, to connect seamlessly. As the IoT ecosystem grows, more powerful WiFi chipsets are adopted because they offer the infrastructure needed to handle the increasing number of connected devices and facilitate effective communication and data transmission within IoT networks.

Challenges:

• Spectrum Division and Interference: The market for WiFi 7 chipsets is challenged by issues with interference and spectrum allotment. WiFi networks may not always have enough spectrum available or allocated, which can result in crowded frequencies and more interference. This may influence wireless network dependability and performance, especially in places with a high population density or a high concentration of WiFi devices. To fully utilize WiFi 7 chipsets, the difficulty is in guaranteeing effective spectrum management and reducing interference. Network operators, technology providers, and regulatory agencies must work together to solve these issues and maximize spectrum use.  

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Regional Analysis:

• Asia-Pacific: Asia-Pacific's position in this market can be attributed to several factors. First, the area has experienced fast industrialization and economic expansion, which has boosted the use of cutting-edge technologies in a variety of industries. High-speed and dependable wireless connectivity is becoming more and more necessary as Asia-Pacific companies and industries embrace digital transformation. With their increased capacity, lower latency, and better network performance, the WiFi 7 chipsets are ideal for the area's dynamic and technologically advanced environment. 

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Competitive Landscape:    

The market is moderately fragmented, with many key players including Qualcomm Technologies, Inc., Broadcom Inc, ON Semiconductor Connectivity Solutions, Inc., Intel Corporation, Celeno, and MediaTek Inc.

• Product Launch: In February 2024, MediaTek introduced the Wi-Fi 7 chipset and the Filogic 360 and 860. Filogic 860 is perfect for mesh nodes, retail, Internet of Things routers, enterprise access points, and service provider Ethernet gateways. It combines a new, cutting-edge network processor technology with a Wi-Fi 7 dual-band access point. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and two Bluetooth 5.4 radios into one chip. It is designed to give next-generation Wi-Fi 7 connectivity to a variety of consumer electronics, including edge devices, streaming devices, and many more.

Wi-Fi 7 and Next-Gen Connectivity Chipsets Market Segmentation:    

By Device Type

• WLAN Infrastructure Devices
• Consumer Devices
• Wireless Cameras
• Industrial IoT Devices
• Connected Vehicles
• Drones
• Others

By Application

• Residential/Consumers
• Commercial
• Industrial
• Smart City
• Transportation & Logistics
• Government & Defense
• Others

By Region

• North America
  • USA
  • Mexico
  • Others
• South America
  • Brazil
  • Argentina
  • Others
• Europe
  • United Kingdom
  • Germany
  • France
  • Spain
  • Others
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Others
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Others

1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK

5. WI-FI 7 AND NEXT-GEN CONNECTIVITY CHIPSETS MARKET BY DEVICE TYPE

5.1. Introduction

5.2. WLAN Infrastructure Devices

5.3. Consumer Devices

5.4. Wireless Cameras

5.5. Industrial IoT Devices

5.6. Connected Vehicles

5.7. Drones

5.8. Others

6. WI-FI 7 AND NEXT-GEN CONNECTIVITY CHIPSETS MARKET BY APPLICATION

6.1. Introduction

6.2. Residential/Consumers

6.3. Commercial

6.4. Industrial

6.5. Smart City

6.6. Transportation & Logistics

6.7. Government & Defense

6.8. Others

7. WI-FI 7 AND NEXT-GEN CONNECTIVITY CHIPSETS MARKET BY GEOGRAPHY  

7.1. Introduction

7.2. North America

7.2.1. By Chipset Type

7.2.2. By Application

7.2.3. By Country

7.2.3.1. USA

7.2.3.2. Canada

7.2.3.3. Mexico

7.3. South America

7.3.1. By Chipset Type

7.3.2. By Application

7.3.3. By Country

7.3.3.1. Brazil

7.3.3.2. Argentina

7.3.3.3. Others

7.4. Europe

7.4.1. By Chipset Type

7.4.2. By Application 

7.4.3. By Country

7.4.3.1. United Kingdom

7.4.3.2. Germany

7.4.3.3. France

7.4.3.4. Spain

7.4.3.5. Others

7.5. Middle East and Africa

7.5.1. By Chipset Type

7.5.2. By Application 

7.5.3. By Country

7.5.3.1. Saudi Arabia

7.5.3.2. UAE

7.5.3.3. Others

7.6. Asia Pacific

7.6.1. By Chipset Type

7.6.2. By Application 

7.6.3. By Country 

7.6.3.1. China

7.6.3.2. Japan

7.6.3.3. India 

7.6.3.4. South Korea

7.6.3.5. Taiwan

7.6.3.6. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

8.1. Major Players and Strategy Analysis

8.2. Market Share Analysis

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Competitive Dashboard

9. COMPANY PROFILES

9.1. Qualcomm Technologies, Inc.

9.2. Broadcom Inc

9.3. ON Semiconductor Connectivity Solutions, Inc.

9.4. Intel Corporation

9.5. Celeno

9.6. MediaTek Inc.

9.7. Texas Instruments Incorporated

9.8. Cypress Semiconductor Corporation

9.9. ST Microelectronics N.V.

9.10. NXP Semiconductors N.V.

10. APPENDIX

10.1. Currency 

10.2. Assumptions

10.3. Base and Forecast Years Timeline

10.4. Key benefits for the stakeholders

10.5. Research Methodology 

10.6. Abbreviations 

Qualcomm Technologies, Inc.

Broadcom Inc

ON Semiconductor Connectivity Solutions, Inc.

Intel Corporation

Celeno

MediaTek Inc.

Texas Instruments Incorporated

Cypress Semiconductor Corporation

ST Microelectronics N.V.

NXP Semiconductors N.V.