Semiconductor Packaging and Assembly Equipment Market Size, Share, Opportunities, And Trends By Type (Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die Bonding Equipment), By Application (Consumer Electronics, Healthcare Devices, Automotive Application, Enterprise Storage, Industrial Application), And By Geography – Forecasts From 2025 To 2030

Semiconductor Packaging and Assembly Equipment Market Size:

The global semiconductor packaging and assembly equipment market is projected to grow at a CAGR of 4.60% during the forecast period, reaching US$5,217.123 million in 2025 and increasing to US$6,532.643 million by 2030.

The increasing application of semiconductor-integrated chips across various industries is driving this market’s growth. The ever-changing market, which demands multiple functions that can be performed by semiconductor-integrated chips, is growing. In addition, the rising number of mergers and acquisitions in the market, the increasing adoption of these chips in automobiles, and technological developments within the semiconductor industry are current market trends that are driving global demand for semiconductor packaging and assembly equipment.

What are the Global Semiconductor Packaging and Assembly Equipment Market Drivers?

• Rising demand for die-bonding equipment is increasing the market expansion

The die bonding equipment is projected to increase significantly during the forecast period due to the growing demand for semiconductor-integrated chips. The rise in sales of both mobile and consumer electronic devices fuels the semiconductor market growth. Additionally, emerging technologies such as the Internet of Things, machine-to-machine communication, ultra-high-definition televisions, hybrid laptops, and vehicle automation further propel the demand for semiconductor-integrated chips. This, in turn, will increase the need for packaging and assembly equipment, fueling market growth. One of the latest trends gaining traction in the die-bonding segment is the automation of automobiles. The utilization of different types of semiconductor integrated chips for various functions such as airbag control, automatic braking system, a global positioning system (GPS), power doors and windows, car navigation and display, and automated driving will propel the need for innovative power-saving, and reliable semiconductor devices, which will in turn, create the need for advanced packaging techniques such as die bonders.

• Technological advancement is also increasing the market growth

Ongoing improvements in semiconductor technology, including the manufacture of smaller and more powerful chips, are fueling the demand for increasingly sophisticated assembly process equipment.

With the increasing demand for smartphones, laptops, tablets, and other consumer electronic devices, the demand for semiconductor assembly equipment also rises to meet the production requirements for these products. Moreover, the demand for assembly process equipment is driven by the growing need for semiconductors, which is triggered by the widespread adoption of AI and IoT technologies in various industries.

Furthermore, the demand for equipment used in assembly processes is being driven by the increasing requirement for specialized semiconductors in telecommunications infrastructure and devices, such as 5G networks, worldwide.

• Miniaturization trends are predicted to boost the global semiconductor packaging and assembly equipment market.

The trend toward the miniaturization of electronics is driving the demand for more compact and effective packaging solutions. The application of 3D packaging technologies, which enable the packing of more functionality into a limited space, is gaining traction due to this demand. The need is creating new avenues for more efficient and long-lasting packaging solutions by introducing new materials, such as organic substrates and complex encapsulation resins. Amkor Technology, for instance, launched new, state-of-the-art substrate materials in 2023 that enhance reliability and thermal performance.

Global Semiconductor Packaging and Assembly Equipment Market Restraints:

• The high initial cost may hinder the overall market growth.

The initial high capital cost of acquiring and installing equipment for semiconductor manufacturing hinders small and medium-scale semiconductor manufacturers from expanding and penetrating new markets.

The integration of new assembly process machinery with existing production equipment requires time and labor. Incompatibility between software platforms and pieces of equipment can slow down the adoption of new technology.

Global Semiconductor Packaging and Assembly Equipment Market Geographical Outlook:

• Asia Pacific is witnessing exponential growth during the forecast period.

Asia Pacific is projected to dominate the global semiconductor packaging and assembly equipment market due to the presence of major players in the region. The IoT is expected to play a significant role in fuelling the semiconductor assembly and equipment market. Asia Pacific has access to abundant, locally cost-effective hardware and software and fewer legacy technologies to shed. By successfully mirroring IoT projects piloted in Europe and capitalizing on the availability of affordable technology, the Asia Pacific has the potential to become the most industrialized region with IoT use cases, thereby boosting its semiconductor packaging and assembly equipment market.

Global Semiconductor Packaging and Assembly Equipment Market Key Launches:

• In November 2024, Yole Group introduced the Semiconductor Back-End Market Monitor, its first semiconductor product that focuses on middle-end packaging processes. This Market Monitor provides quarterly insights into back-end equipment markets, which are essential for driving digital transformation and advancing chip technology.

Semiconductor Packaging and Assembly Equipment Market Scope:

Report Metric	Details
Semiconductor Packaging and Assembly Equipment Market Size in 2025	US$5,217.123 million
Semiconductor Packaging and Assembly Equipment Market Size in 2030	US$6,532.643 million
Growth Rate	CAGR of 4.60%
Study Period	2020 to 2030
Historical Data	2020 to 2023
Base Year	2024
Forecast Period	2025 – 2030
Forecast Unit (Value)	USD Million
Segmentation	Type Application Geography
Geographical Segmentation	Americas, Europe, Middle East and Africa, Asia Pacific
List of Major Companies in the Semiconductor Packaging and Assembly Equipment Market	Amkor Technology Inc. Toshiba Corporation Qualcomm Technologies, Inc. Disco Corporation Rudolph Technologies, Inc.
Customization Scope	Free report customization with purchase

Global Semiconductor Packaging and Assembly Equipment Market Segmentation:

• By Type
  • Plating Equipment
  • Inspection and Dicing Equipment
  • Wire Bonding Equipment
  • Die Bonding Equipment
• By Application
  • Consumer Electronics
  • Healthcare Devices
  • Automotive Application
  • Enterprise Storage
  • Industrial Application
• By Geography
  • Americas
    • US
  • Europe, Middle East, and Africa
    • Germany
    • Netherlands
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

 

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1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base and Forecast Years Timeline

1.8. Key Benefits to the Stakeholder

2. RESEARCH METHODOLOGY  

2.1. Research Design

2.2. Research Processes

3. EXECUTIVE SUMMARY

3.1. Key Findings

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. GLOBAL SEMICONDUCTOR PACKAGING AND ASSEMBLY EQUIPMENT MARKET BY PRODUCT

5.1. Introduction

5.2. Plating Equipment

5.3. Inspection and Dicing Equipment

5.4. Wire Bonding Equipment

5.5. Die Bonding Equipment

6. GLOBAL SEMICONDUCTOR PACKAGING AND ASSEMBLY EQUIPMENT MARKET BY APPLICATION

6.1. Introduction

6.2. Consumer Electronics

6.3. Healthcare Devices

6.4. Automotive Application

6.5. Enterprise Storage

6.6. Industrial Application

7. GLOBAL SEMICONDUCTOR PACKAGING AND ASSEMBLY EQUIPMENT MARKET BY GEOGRAPHY

7.1. Americas

7.1.1. US

7.2. Europe, Middle East, and Africa

7.2.1. Germany

7.2.2. Netherlands

7.2.3. Others

7.3. Asia Pacific

7.3.1. China

7.3.2. Japan

7.3.3. Taiwan

7.3.4. South Korea

7.3.5. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

8.1. Major Players and Strategy Analysis

8.2. Market Share Analysis

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Competitive Dashboard

9. COMPANY PROFILES

9.1. Amkor Technology Inc.

9.2. Toshiba Corporation

9.3. Qualcomm Technologies, Inc.

9.4. Disco Corporation

9.5. Rudolph Technologies, Inc.

9.6. ChipMOS Technologies Inc.

9.7. Powertech Technologies, Inc. 

9.8. Renesas Electronics Corporation

Amkor Technology Inc.

Toshiba Corporation

Qualcomm Technologies, Inc.

Disco Corporation

Rudolph Technologies, Inc.

ChipMOS Technologies Inc.

Powertech Technologies, Inc. 

Renesas Electronics Corporation