5G PCB Market Size, Share, Opportunities, And Trends By Type (Single-sided, Double-sided, Multi-layered, High-density Interconnect (HDI), Others), By Substrate (Rigid, Flexible, Rigid-Flexible), By End Use Industry (Automotive, Telecommunication, Consumer Electronics, Industrial, Others), And By Geography - Forecasts From 2025 To 2030

  • Published : Jul 2025
  • Report Code : KSI061615566
  • Pages : 141
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5G PCB Market Size

The 5G PCB market will grow from USD 9.572 billion in 2025 to USD 14.162 billion in 2030 at a CAGR of 8.15%.

5G PCB Market Highlights:

  • Expanding 5G network demand is driving PCB adoption in telecommunication and electronics.
  • Growing consumer electronics production is boosting 5G PCB market in major economies.
  • Investing in smart factories is enhancing 5G PCB manufacturing for industrial applications.
  • Innovating PCB designs is improving performance for 5G transceivers and connectivity.

5G PCB Market Growth Drivers:

  • Growing applicability in consumer and industrial electronics is expected to drive the market demand for 5G PCBs.

Printed circuit boards (PCBs) through conductive pathways provide mechanical support to electronics equipment, owing to which they form an integral part of the equipment. The growing transition from 4G to 5G has established a new framework associated with the design and material usage in PCBs to improve overall performance. In comparison to its predecessor, the 5G network features a quick response rate and wider network coverage, which is driving its applicability in major sectors such as telecommunication, consumer electronics, automotive, and industrial, among others.

Major economies, namely China, the United States, and Japan, are experiencing a significant boom in consumer electronics demand and consumption, which has bolstered the overall manufacturing output of these nations. For instance,  according to the National Bureau of Statistics, in November 2023, the production output of China’s communication equipment, computers, and other electronics experienced a 10.6% growth over the previous year.

  • Favorable investment in smart factories has propelled market growth.

Technological advancement has paved the way to solve industrial complexities, and with the constant boom in 5G product demand, investments are being made in smart manufacturing. Hence, governments as well as various private companies are initiating strategies to bolster industrial automation, which has propelled the scope of 5G smart factories in major economies.

For instance, in May 2024, Ericsson announced additional funding of US$50 that would be used in the expansion of its 5G smart factory situated in Texas. The expansion would enable the company to address the growing demand for 5G infrastructure in the USA.

Likewise, in October 2023, VVDN Technologies, in collaboration with Telit Cinterion and the Union Minister of Railways, Communication, Electronics, Information & Technology, established a dedicated SMT line for manufacturing 5G connectivity modules. The new establishment will cater to the growing 5G demand for high-tech products. 

5G PCB Market Emerging Opportunities:

  • Telecommunication and Consumer Electronics

Based on end-users, the 5G PCBs market is divided into automotive, telecommunication, consumer electronics, industrial, and others. Telecommunication and consumer electronics are anticipated to hold a significant market share, fueled by the favorable investment in the commercialization of private 5Gs. Moreover, the boom in modern technological options usage is further driving the demand for wireless communication networks, thereby positively impacting the PCB's demand for 5G applications in such sectors.

Hence, companies are investing in new facility establishments, MOUs, strategic partnerships, and mergers to improve their product offerings, which is acting as an additional driving factor. For instance,

  • In February 2023, TTM Technologies Inc. introduced 0603 narrow and broadband balun transformers and couplers, which have expanded the company’s “RF&S” (Radio Frequency Specialty Components) business. The extensive portfolio would enable the company to meet the demand for hybrid couplers and balun transformers for 5G transceivers.
  • In May 2022, Qualcomm Technologies Inc. formed a collaboration with Viettel Group for the development of next-generation 5G DUs (Distributed Units) and RUs (Radio Units) having massive MIMO capabilities. The collaboration would involve integrating Qualcomm’s “X100 5G RAN Accelerator Card” and “MIMO Qualcomm® QRU100” 5G RAN with Viettel’s advanced software & hardware systems and would roll out a 5G network in Vietnam.  

5G PCB Market Geographical Outlook:

5G PCB market, based on geography, consists of major countries, namely the United States, China, Japan, South Korea, and Germany, among others. The mentioned countries are experiencing significant growth in their 5G transition, backed by favorable government investments and policies. Moreover, product launches and the ongoing “Industry 4.0,” which aims to bolster industrial automation, are acting as additional factors for regional market growth.

  • In April 2022, KLA Corporation launched “Frontline Cloud Services” that would enhance time-to-market (TTM) and DFM (Design-For-Manufacturing) analysis for printed circuit boards, which would be used in 5G and mini LED applications. The software solution would remove the complexity in the design process and any other bottlenecks that would increase the overall analysis timings.

List of Top 5G PCB Companies:

Some of the leading players in the market include PCBMay, Epec, and Jagrat RF Solutions, among others. The product offerings of the major corporation include the following:

 

COMPANY NAME

 

PRODUCT NAME

 

DESCRIPTION

PCBMay

20-layer PCB

PCBMay’s “20 Layer PCB” is available in six modules inclusive of “20 Lay Rigid PCB”, “20 Layer Rigid-Flex PCB”, “High Power 20 Layer PCB”, and “High Current 20 Layer PCB” among others which holds a wider scope of industrial applicability such as in automotive, electronics and telecommunication components.

Millenium Circuits Limited

High-Density PCBs

Millennium’s “High-Density Interconnect PCBs” find high applicability in the electronics sector and are specifically designed to meet the growing demand for lightweight miniaturized equipment. Their smaller aspect ratio enables them to provide reliable performance.

 

5G PCB Market Scope:

Report Metric Details
5G PCB Market Size in 2025 US$9.572 billion
5G PCB Market Size in 2030 US$14.162 billion
Growth Rate CAGR of 8.15%
Study Period 2020 to 2030
Historical Data 2020 to 2023
Base Year 2024
Forecast Period 2025 – 2030
Forecast Unit (Value) USD Billion
Segmentation
  • Type
  • Substrate
  • End-User Industry
  • Geography
Geographical Segmentation North America, South America, Europe, Middle East and Africa, Asia Pacific
List of Major Companies in the 5G PCB Market
  • Millennium Circuits Limited
  • Rayming Technology
  • Jagat RF Solutions (India) Pvt. Ltd.
  • PCBMay
  • VSE
Customization Scope Free report customization with purchase

 

The 5G PCB Market is analyzed into the following segments:

  • By Type
    • Single-Sided
    • Double-Sided
    • Multi-Layered
    • High-Density Interconnect (HDI)
    • Others
  • By Substrate
    • Rigid
    • Flexible
    • Rigid-Flexible
  • By End-User Industry
    • Automotive
    • Telecommunication
    • Consumer Electronics
    • Industrial
    • Others
  • By Geography
    • Americas
      • United States
      • Others
    • Europe, Middle East, and Africa
      • Germany
      • UK
      • Others
    • Asia Pacific
      • China
      • Japan
      • South Korea
      • Others

Frequently Asked Questions (FAQs)

The 5G PCB market is expected to reach a total market size of US$14.162 billion by 2030.

5G PCB Market is valued at US$9.572 billion in 2025.

The 5G PCB market is expected to grow at a CAGR of 8.15% during the forecast period.

Key drivers of 5G PCB market growth include rising 5G deployment, demand for high-frequency PCBs, IoT expansion, and AI advancements.

The Asia-Pacific region is anticipated to hold a significant share of the 5G PCB market.

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Market Segmentation

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Bandwidth Availability

4.4. Number of Users

5. GOVERNMENT REGULATIONS/POLICIES

6. 5G PCB MARKET, BY TYPE

6.1. Introduction

6.2. Single-sided

6.3. Double-sided

6.4. Multi-layered

6.5. High-density Interconnect (HDI)

6.6. Others

7. 5G PCB MARKET, BY SUBSTRATE

7.1. Introduction

7.2. Rigid

7.3. Flexible

7.4. Rigid-Flexible

8. 5G PCB MARKET, BY END-USE INDUSTRY

8.1. Introduction

8.2. Automotive

8.3. Telecommunication

8.4. Consumer Electronics

8.5. Industrial

8.6. Others

9. 5G PCB MARKET BY GEOGRAPHY

9.1. Introduction

9.2. Americas

9.2.1. United States

9.2.2. Others

9.3. Europe, Middle East and Africa

9.3.1. Germany

9.3.2. UK

9.3.3. Others

9.4. Asia Pacific

9.4.1. China

9.4.2. Japan

9.4.3. South Korea

9.4.4. Others

10. RECENT DEVELOPMENT AND INVESTMENTS

11. COMPETITIVE ENVIRONMENT AND ANALYSIS

11.1. Major Players and Strategy Analysis

11.2. Vendor Competitiveness Matrix

12. COMPANY PROFILES

12.1. Millennium Circuits Limited

12.2. Rayming Technology

12.3. Jagat RF Solutions (India) Pvt. Ltd.

12.4. PCBMay

12.5. VSE

12.6. Epec, LLC

12.7. PCB Trace Technologies Inc

12.8. ABL Circuits

Millennium Circuits Limited

Rayming Technology

Jagat RF Solutions (India) Pvt. Ltd.

PCBMay

VSE

Epec, LLC

PCB Trace Technologies Inc

ABL Circuits