Fan-Out Packaging Market Size, Share, Opportunities, And Trends By Type (Core Fan-Out, High-Density Fan-Out, Ultra-High-Density Fan-Out), By Carrier Size (300mm, 600mm, Others), By End-User (Foundries, Integrated Device Manufacturers (IDM), Outsourced Semiconductor Assembly And Test (OSAT)), And By Geography - Forecasts From 2023 To 2028

Any package that has connections fanning out from the chip surface to accommodate more external I/Os is referred to as fan-out packaging. With conventional fan-out packaging, the dies are completely submerged in an epoxy mould compound rather than being placed on a substrate or interposer. They are rapidly taking the place of the older, more established package-on-package (PoP), memory-on-logic systems. Also, the market's installation of high-performance computing has expanded due to the growing use of artificial intelligence and machine learning in several industries.

The packaging trend will be influenced by cloud infrastructure, 5G, autonomous driving, and the artificial intelligence revolution over the forecast period, which will support the Fan-out Packaging Market. With potential in the foundry, outsourced semiconductor assembly and testing (OSAT), and integrated device manufacturer (IDM) businesses, the fan-out packaging industry has a bright future.

Also, the market's installation of high-performance computing has expanded due to the growing use of artificial intelligence and machine learning in several industries. Using Deca's M-Series fan-out technology, Nepes Laweh company stated in December 2021 that it had produced the first 600 mm × 600 mm big Panel Level Packaging (PLP) in the history of the globe. According to the company, the Fan-out-Panel Level Packaging (FOPLP) line started full-scale mass production in the third quarter after passing client certification and establishing a stable yield.

A substantial part will be held by high-density fan-out which will upsurge the market.

Mega pillar plating and redistribution layer (RDL) metal are important building components for this technique. Applications with a greater pin count, including application processors, are the focus of this technology (AP). The business intends to include inFO-Antenna-in-Package (AiP) and inFO-on-Substrate technology in its FO-WLP sector. Cars, servers, and cell phones all utilise these packages. Moreover, improvements are made to the fabrication process for High-Density Fan-Out Wafer Level Packaging (FOWLP). In addition to increasing reliability, energy efficiency, device speed, and multi-function integration, solutions are being explored to minimise chip size and height and cut production costs. For example, SPTS Technologies provides leading semiconductor packaging firms with a variety of plasma-to-etch and deposition process technologies for cutting-edge packaging schemes including high-density fan-out wafer-level packing.

Moreover, high-density fan-out (HDFO) packages, which can fabricate at the wafer level and can build three-dimensional (3D) structures employing through-mould interconnects such as tall copper (Cu) pillars and through package vias (TPVs), can fulfil these demands of shrinking.

The market will be stimulated by the inclusion of ECP (Encapsulated Chip Package) technology in the Fan-Out Packaging Solution.

Throughout the anticipated period, the market for Fan-Out Packaging Solutions is expected to be driven by the introduction of ECP (Encapsulated Chip Package) technology. Since the introduction of the Internet and multimedia, electronics downsizing in the form of integrated circuits has become a necessary component of our life. To ensure its long-term functioning and dependability, chip packaging improvements are also necessary to support the fast development of integrated circuits. ECP technology is a cutting-edge chip-first and face-down packaging method, in contrast to traditional packaging procedures that employ wafer reconstitution moulding materials. The laminating moulding film used in the ECP technique replaces the customary liquid or powder moulding compound. Additionally, it efficiently reduces chip offset and achieves small-size, high fan-out ratio packing as compared to liquid or powder compounds for wafer moulding.

Asia Pacific is projected to be the prominent market shareholder in the global fan-out packaging market and is anticipated to continue throughout the forecast period.

Asia Pacific’s largest semiconductor production firms are based in Taiwan, which is boosting demand for sophisticated semiconductor packaging, particularly in PLPs. The Semiconductor Industry Association (SIA) estimates that Asia-Pacific accounts for more than 50% of worldwide semiconductor sales, giving Taiwanese manufacturers the chance to offer FOWLP for growing semiconductor applications. The majority of businesses in the nation are increasing their ability to produce Fan-out packaging, which is anticipated to boost exports and foster local market growth.

In addition, ASE, a pure semiconductor post-processing (OAST), began investing in cutting-edge packaging facilities in June 2021 in response to the scarcity of semiconductors caused by supply and demand. It is quickening the expansion by getting a lot of WLP and PLP semiconductor production equipment from HANMI Semiconductor. Also, the expanding markets for high-performance computing and fifth-generation (5G) wireless communication have made it possible for manufacturers to create innovative technologies. For instance, TSMC, the sole leader in the High-Density Fan-out market, intends to grow its FO-WLP sector by including technologies like inFO-Antenna-in-Package (AiP) and inFO-on-Substrate (oS).

 Market Key Developments

• In March 2023, The most cutting-edge Fan-Out-Package-on-Package (FOPoP) solution has been unveiled by Advanced Semiconductor Engineering, Inc. (ASE).
• In May 2022, Adeia, a recently launched brand for Xperi Holding Corporation, and SkyWater Technologies, a reputable partner in technology realisation, announced that SkyWater has signed a technology licence agreement with Xperi Corporation.
• In November 2021, According to Amkor Technologies, Inc., a provider of semiconductor packing and test services, an intelligent factory would be built in Bac Ninh, Vietnam. The first focus of the proposed facility will be on providing Advanced System in Package (SiP) assembly and testing services to the top semiconductor and electronics manufacturing companies in the world.

Segmentation:

• By Type
• Core Fan-out
• High-density Fan-out
• Ultra-high-density Fan-out
• By Carrier Size
• 300mm
• 600mm
• Others
• By End-User
• Foundries
• Integrated Device Manufacturers (IDM)
• Outsourced Semiconductor Assembly and Test (OSAT)
• By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• UK
• Germany
• France
• Italy
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Indonesia
• Others