Outsourced Semiconductor Assembly And Test Services (OSAT) Market Size, Share, Opportunities, And Trends By Service Type (Packaging, Testing), By Packaging Type (Ball Grid Array (BGA) Packaging, Chip-scale Packaging (CSP), Stacked Die Packaging, Multi-chip Packaging, Quad Flat And Dual-inline Packaging), By Application (Communication, Consumer Electronics, Automotive, Computing And Networking, Industrial, Others), And By Geography - Forecasts From 2024 To 2029

  • Published : Feb 2024
  • Report Code : KSI061615732
  • Pages : 145

The outsourced semiconductor assembly and test services (OSAT) market is projected to rise at a compound annual growth rate (CAGR) of 15.93% to reach a market valuation of US$73,174.562 million by 2029, from US$25,999.486 million in 2022.

Outsourced semiconductor assembly and test services is the industry term for the provision of specialist manufacturing and testing services to semiconductor businesses. To assemble, package, and test integrated circuits (ICs) and other semiconductor devices, semiconductor manufacturers employ OSAT companies. The rising demand for cutting-edge electronic gadgets across a range of sectors is driving the OSAT market. OSAT suppliers conduct assembly and testing for semiconductor businesses to save money and expedite delivery. Furthermore, the need for specialized OSAT services is driven by complex semiconductor components such as SoC designs and improved packaging methods.

Growing demand for miniaturization propels the market.

Ongoing research and development has led to the creation of new products, manufacturing processes, and semiconductor designs, all of which have accelerated the industry's growth. In September 2023, for instance, the US National Science Foundation declared that it will provide $45.6 million in support for 24 research and teaching programs, including funds from the "CHIPS and Science Act of 2022." These programs aim to accelerate advancements in semiconductor technology, production, and workforce development. Furthermore, end-use semiconductor sales in 2021 experienced a significant rise as a result of the industry's persistent efforts to accommodate the rising demand for semiconductors. As more employment moved to remote work and home learning, sales of end-use categories like PCs saw notable growth. Other areas, including the automotive sector, had sharp rises all year long and eventually acquired market share in 2021, making it the third-largest semiconductor end-use market. This growth in the end-use of semiconductors significantly boosts the Outsourced semiconductor assembly and test services (OSAT) market expansion.

The market is projected to grow in the Asia Pacific region.

OSAT development is further aided by the globalization of the semiconductor sector, particularly in the Asia-Pacific region. China, Taiwan, and South Korea are becoming important centres for the assembly and production of semiconductors. OSAT suppliers shorten product time-to-market by providing experience in the assembly, packaging, and testing procedures. Furthermore, the Semiconductor Industry Association reports that China's semiconductor industries are spending a lot of money on capital expenditures (CAPEX), which are monies used by businesses to purchase, renovate, or maintain their assets. Chinese CAPEX firms invested US$ 12.3 billion in 2021 and US$ 15.3 billion in 2022. The semiconductor manufacturing is expected to be driven by the rising need for production facilities as well as the growing requirement for semiconductors in the automotive and consumer electronics industries which in turn upsurges the demand for OSAT globally.

Key Market Developments:

  • December 2023, a reputable Outsourced Semiconductor Assembly and Test (OSAT) company placed an order with Camtek Ltd. for 25 systems for a range of advanced packaging applications.

Key Players:

  • ASE Group is a leading provider of semiconductor testing services globally. The company is involved in various stages of the semiconductor manufacturing process, such as wafer probing, IC package design, front-end engineering test, and substrate design, among others. It offers advanced semiconductor supply chain services in collaboration with sister company, USI.
  • Amkor Technology Inc. is one of the world's largest providers of outsourced semiconductor packaging, design, and test services. It offers an extensive array of test capabilities in device testing and is regarded as a top OSAT supplier for automotive and artificial intelligence processor testing as well.
  • Powertech Technology Inc. is a major company delivering key OSAT solutions such as final testing, IC packaging, and module assembly among others. The company is building new strategic partnerships to deliver unique technological insights and solutions.

Segmentation:

  • By Service Type:
    • Packaging
    • Testing
  • By Packaging Type:
    • Ball Grid Array (BGA) Packaging
    • Chip-scale Packaging (CSP)
    • Stacked Die Packaging
    • Multi-Chip Packaging
    • Quad Flat and Dual-inline Packaging
  • By Application:
    • Communication
    • Consumer Electronics
    • Automotive
    • Computing and Networking
    • Industrial
    • Others
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • United Kingdom
      • Germany
      • France
      • Italy
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Others
    • Asia Pacific
      • Japan
      • China
      • India
      • South Korea
      • Taiwan
      • Thailand
      • Indonesia
      • Others

Frequently Asked Questions (FAQs)

Outsourced Semiconductor Assembly And Test Services (OSAT) Market was valued at US$25,999.486 million in 2022.
The global outsourced semiconductor assembly and test services (OSAT) market is projected to grow at a CAGR of 15.93% during the forecast period.
The outsourced semiconductor assembly and test services (OSAT) market is projected to reach a market size of US$73,174.562 million by 2029.
The Asia Pacific region is expected to hold a significant share of the OSAT market.
The OSAT market has been witnessing significant growth due to the increasing complexity and miniaturization of semiconductor devices, driving the demand for specialized expertise and advanced packaging solutions.

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY SERVICE TYPE

5.1. Introduction

5.2. Packaging

5.2.1. Market Trends and Opportunities

5.2.2. Growth Prospects

5.2.3. Geographic Lucrativeness

5.3. Testing

5.3.1. Market Trends and Opportunities

5.3.2. Growth Prospects

5.3.3. Geographic Lucrativeness

6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY PACKAGING TYPE

6.1. Introduction

6.2. Ball Grid Array (BGA) Packaging

6.2.1. Market Trends and Opportunities

6.2.2. Growth Prospects

6.2.3. Geographic Lucrativeness

6.3. Chip-scale Packaging (CSP)

6.3.1. Market Trends and Opportunities

6.3.2. Growth Prospects

6.3.3. Geographic Lucrativeness

6.4. Stacked Die Packaging

6.4.1. Market Trends and Opportunities

6.4.2. Growth Prospects

6.4.3. Geographic Lucrativeness

6.5. Multi-Chip Packaging

6.5.1. Market Trends and Opportunities

6.5.2. Growth Prospects

6.5.3. Geographic Lucrativeness

6.6. Quad Flat and Dual-inline Packaging

6.6.1. Market Trends and Opportunities

6.6.2. Growth Prospects

6.6.3. Geographic Lucrativeness

7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY APPLICATION

7.1. Introduction

7.2. Communication

7.2.1. Market Trends and Opportunities

7.2.2. Growth Prospects

7.2.3. Geographic Lucrativeness

7.3. Consumer Electronics

7.3.1. Market Trends and Opportunities

7.3.2. Growth Prospects

7.3.3. Geographic Lucrativeness

7.4. Automotive

7.4.1. Market Trends and Opportunities

7.4.2. Growth Prospects

7.4.3. Geographic Lucrativeness

7.5. Computing and Networking

7.5.1. Market Trends and Opportunities

7.5.2. Growth Prospects

7.5.3. Geographic Lucrativeness

7.6. Industrial

7.6.1. Market Trends and Opportunities

7.6.2. Growth Prospects

7.6.3. Geographic Lucrativeness

7.7. Others

7.7.1. Market Trends and Opportunities

7.7.2. Growth Prospects

7.7.3. Geographic Lucrativeness

8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. By Service Type

8.2.2. By Packaging Type

8.2.3. By Application

8.2.4. By Country

8.2.4.1. United States

8.2.4.1.1. Market Trends and Opportunities

8.2.4.1.2. Growth Prospects

8.2.4.2. Canada

8.2.4.2.1. Market Trends and Opportunities

8.2.4.2.2. Growth Prospects

8.2.4.3. Mexico

8.2.4.3.1. Market Trends and Opportunities

8.2.4.3.2. Growth Prospects

8.3. South America

8.3.1. By Service Type

8.3.2. By Packaging Type

8.3.3. By Application

8.3.4. By Country

8.3.4.1. Brazil

8.3.4.1.1. Market Trends and Opportunities

8.3.4.1.2. Growth Prospects

8.3.4.2. Argentina

8.3.4.2.1. Market Trends and Opportunities

8.3.4.2.2. Growth Prospects

8.3.4.3. Others

8.3.4.3.1. Market Trends and Opportunities

8.3.4.3.2. Growth Prospects

8.4. Europe

8.4.1. By Service Type

8.4.2. By Packaging Type

8.4.3. By Application

8.4.4. By Country

8.4.4.1. United Kingdom

8.4.4.1.1. Market Trends and Opportunities

8.4.4.1.2. Growth Prospects

8.4.4.2. Germany

8.4.4.2.1. Market Trends and Opportunities

8.4.4.2.2. Growth Prospects

8.4.4.3. France

8.4.4.3.1. Market Trends and Opportunities

8.4.4.3.2. Growth Prospects

8.4.4.4. Italy

8.4.4.4.1. Market Trends and Opportunities

8.4.4.4.2. Growth Prospects

8.4.4.5. Spain

8.4.4.5.1. Market Trends and Opportunities

8.4.4.5.2. Growth Prospects

8.4.4.6. Others

8.4.4.6.1. Market Trends and Opportunities

8.4.4.6.2. Growth Prospects

8.5. Middle East and Africa

8.5.1. By Service Type

8.5.2. By Packaging Type

8.5.3. By Application

8.5.4. By Country

8.5.4.1. Saudi Arabia

8.5.4.1.1. Market Trends and Opportunities

8.5.4.1.2. Growth Prospects

8.5.4.2. UAE

8.5.4.2.1. Market Trends and Opportunities

8.5.4.2.2. Growth Prospects

8.5.4.3. Others

8.5.4.3.1. Market Trends and Opportunities

8.5.4.3.2. Growth Prospects

8.6. Asia Pacific

8.6.1. By Service Type

8.6.2. By Packaging Type

8.6.3. By Application

8.6.4. By Country

8.6.4.1. Japan

8.6.4.1.1. Market Trends and Opportunities

8.6.4.1.2. Growth Prospects

8.6.4.2. China

8.6.4.2.1. Market Trends and Opportunities

8.6.4.2.2. Growth Prospects

8.6.4.3. India

8.6.4.3.1. Market Trends and Opportunities

8.6.4.3.2. Growth Prospects

8.6.4.4. South Korea

8.6.4.4.1. Market Trends and Opportunities

8.6.4.4.2. Growth Prospects

8.6.4.5. Taiwan

8.6.4.5.1. Market Trends and Opportunities

8.6.4.5.2. Growth Prospects

8.6.4.6. Thailand

8.6.4.6.1. Market Trends and Opportunities

8.6.4.6.2. Growth Prospects

8.6.4.7. Indonesia

8.6.4.7.1. Market Trends and Opportunities

8.6.4.7.2. Growth Prospects

8.6.4.8. Others

8.6.4.8.1. Market Trends and Opportunities

8.6.4.8.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisition, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. ASE Group (ASE Technology Holdings)

10.2. Amkor Technology Inc.

10.3. Powertech Technology Inc.

10.4. ChipMOS Technologies Inc.

10.5. King Yuan Electronics Co. Ltd

10.6. Jiangsu Changjiang Electronics Technology Co. Ltd

10.7. UTAC Holdings Ltd

10.8. Lingsen Precision Industries Ltd

10.9. Tongfu Microelectronics Co.


ASE Group (ASE Technology Holdings)

Amkor Technology Inc.

Powertech Technology Inc.

ChipMOS Technologies Inc.

King Yuan Electronics Co. Ltd

Jiangsu Changjiang Electronics Technology Co. Ltd

UTAC Holdings Ltd

Lingsen Precision Industries Ltd

Tongfu Microelectronics Co.