Underfill Material Market Size:
The Underfill Material Market is expected to grow from US$0.958 billion in 2025 to US$1.318 billion in 2030, at a CAGR of 6.58%.
Highlights:
- 1Won Chemical .co.Ltd
- 2Henkel AG & Co. KGaA
- 3AIM Metals & Alloys LP
- 4Master Bond Inc.
Underfill material refers to the material used for the encapsulation process to protect and package chip scales, ball grid arrays, flip chip packages, etc. Underfill materials are employed to increase resistance, strength and reliability in the semiconductor industry by being exploited as a filler.
The rising demand for consumer electronics such as smartphones, laptops, etc. is projected to drive the demand Underfill material during the forecast period. Furthermore, the growing application of electronics in various industries such as military, automotive, etc. is further expected to drive the demand for Underfill materials in the coming years. The emerging use IoT as well as artificial intelligence globally is further estimated to drive the demand for Underfill material market. Additionally, the Asia-Pacific region is anticipated to significantly augment during the forecast period owing to the increasing use of these materials in the region. The North American region is envisaged to hold a noteworthy share of the market due to the early adoption of using these materials in the region.
Underfill Material Market Drivers:
- Rising demand for electronics across various industries
- Growing demand for highly efficient, low cost, small sized devices
Underfill Material Market Restraints:
- Availability of substitutes
The major players profiled in the Underfill material market include Won Chemical .co.Ltd, Henkel AG & Co. KGaA, AIM Metals & Alloys LP, Master Bond Inc., Zymet., Yincae Advanced Materials, LLC, Epoxy Technology, Inc., H.B. Fuller Company., Nordson Corporation, NAMICS Corporation, Hitachi Chemical Co., Shin-Etsu Chemical Co., Ltd., Panacol-Elosol GmbH, LORD Corporation., Bondline Electronic Adhesives, Inc., Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
Underfill Material Market Scope:
| Report Metric | Details |
|---|---|
| Study Period | 2021 to 2031 |
| Historical Data | 2021 to 2024 |
| Base Year | 2025 |
| Forecast Period | 2026 – 2031 |
| Customization Scope | 15% Free Customization included with purchase — Request Custom Breakdown → |
| Sample & Data Access | PDF Sample, Excel Databook & Analyst Briefing — Download Free Sample → |
| Report Metric | Details |
| Underfill Material Market Size in 2025 | US$0.958 billion |
| Underfill Material Market Size in 2030 | US$1.318 billion |
| Growth Rate | CAGR of 6.58% |
| Study Period | 2020 to 2030 |
| Historical Data | 2020 to 2023 |
| Base Year | 2024 |
| Forecast Period | 2025 – 2030 |
| Forecast Unit (Value) | USD Billion |
| Segmentation |
|
| Geographical Segmentation | North America, South America, Europe, Middle East and Africa, Asia Pacific |
| List of Major Companies in Underfill Material Market | |
| Customization Scope | Free report customization with purchase |
The Underfill material market is analyzed into the following segments:
By Type
No Flow Underfill Material
Capillary Underfill Material
Molded Underfill Material
By Industry Vertical
Consumer Electronics
Automotive
Aerospace and Defense
Others
By Application
Chip Scale Packaging
Flip Chips
Ball Grid Array
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
Table of Contents
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. UNDERFILL MATERIAL MARKET BY TYPE
5.1. No Flow Underfill Material
5.2. Capillary Underfill Material
5.3. Molded Underfill Material
6. UNDERFILL MATERIAL MARKET BY INDUSTRY VERTICAL
6.1. Consumer Electronics
6.2. Automotive
6.3. Aerospace and Defense
6.4. Others
7. UNDERFILL MATERIAL BY APPLICATION
7.1. Chip Scale Packaging
7.2. Flip Chips
7.3. Ball Grid Array
8. UNDERFILL MATERIAL MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Saudi Arabia
8.4.2. Israel
8.4.3. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Company Benchmarking and Analysis
9.2. Recent Investment and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Essel Won Chemical .co.Ltd
10.2. Henkel AG & Co. KGaA
10.3. AIM Metals & Alloys LP
10.4. Master Bond Inc.
10.5. Zymet.
10.6. Yincae Advanced Materials, LLC
10.7. Epoxy Technology, Inc.
10.8. H.B. Fuller Company.
10.9. Nordson Corporation
10.10. NAMICS Corporation
10.11. Hitachi Chemical Co.,
10.12. Shin-Etsu Chemical Co., Ltd.
10.13. Panacol-Elosol GmbH
10.14. LORD Corporation.
10.15. Bondline Electronic Adhesives, Inc.
10.16. Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
LIST OF FIGURES
LIST OF TABLES
Frequently asked questions
What will be the Underfill Material Market size by 2030?
The Underfill Material Market is expected to reach a total market size of US$1.318 billion by 2030.
What is the size of the Underfill Material Market?
Underfill Material Market is valued at US$0.958 billion in 2025.
What are the growth prospects for the Underfill Material Market?
The Underfill Material Market is expected to grow at a CAGR of 6.58% during the forecast period.
Which region holds the largest share of the Underfill Material Market?
The North American region is anticipated to hold a significant share of the Underfill Material Market.
Who are the major players in the Underfill Material Market?
Prominent key market players in the Underfill Material Market include NAMICS Corporation, Hitachi Chemical Co., Shin-Etsu Chemical Co., Ltd., Panacol-Elosol GmbH, LORD Corporation., Bondline Electronic Adhesives, Inc., among others.
Cite this report
Knowledge Sourcing Intelligence. (May 2025). Underfill Material Market Size, Share, And Trends By Type (No Flow, Capillary, and Molded), By Industry Vertical (Consumer Electronics, Automotive, Aerospace and Defense, and Others), By Application (Chip Scale Packaging, Flip Chips, and Ball Grid Array), And Geography - Forecasts From 2025 to 2030. https://www.knowledge-sourcing.com/report/underfill-material-market