The Underfill Material Market is expected to grow from US$0.958 billion in 2025 to US$1.318 billion in 2030, at a CAGR of 6.58%.
Underfill material refers to the material used for the encapsulation process to protect and package chip scales, ball grid arrays, flip chip packages, etc. Underfill materials are employed to increase resistance, strength and reliability in the semiconductor industry by being exploited as a filler.
The rising demand for consumer electronics such as smartphones, laptops, etc. is projected to drive the demand Underfill material during the forecast period. Furthermore, the growing application of electronics in various industries such as military, automotive, etc. is further expected to drive the demand for Underfill materials in the coming years. The emerging use IoT as well as artificial intelligence globally is further estimated to drive the demand for Underfill material market. Additionally, the Asia-Pacific region is anticipated to significantly augment during the forecast period owing to the increasing use of these materials in the region. The North American region is envisaged to hold a noteworthy share of the market due to the early adoption of using these materials in the region.
The major players profiled in the Underfill material market include Won Chemical .co.Ltd, Henkel AG & Co. KGaA, AIM Metals & Alloys LP, Master Bond Inc., Zymet., Yincae Advanced Materials, LLC, Epoxy Technology, Inc., H.B. Fuller Company., Nordson Corporation, NAMICS Corporation, Hitachi Chemical Co., Shin-Etsu Chemical Co., Ltd., Panacol-Elosol GmbH, LORD Corporation., Bondline Electronic Adhesives, Inc., Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
| Report Metric | Details |
|---|---|
| Study Period | 2021 to 2031 |
| Historical Data | 2021 to 2024 |
| Base Year | 2025 |
| Forecast Period | 2026 – 2031 |
| Report Metric | Details |
| Underfill Material Market Size in 2025 | US$0.958 billion |
| Underfill Material Market Size in 2030 | US$1.318 billion |
| Growth Rate | CAGR of 6.58% |
| Study Period | 2020 to 2030 |
| Historical Data | 2020 to 2023 |
| Base Year | 2024 |
| Forecast Period | 2025 – 2030 |
| Forecast Unit (Value) | USD Billion |
| Segmentation |
|
| Geographical Segmentation | North America, South America, Europe, Middle East and Africa, Asia Pacific |
| List of Major Companies in Underfill Material Market | |
| Customization Scope | Free report customization with purchase |
The Underfill material market is analyzed into the following segments:
By Type
No Flow Underfill Material
Capillary Underfill Material
Molded Underfill Material
By Industry Vertical
Consumer Electronics
Automotive
Aerospace and Defense
Others
By Application
Chip Scale Packaging
Flip Chips
Ball Grid Array
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others