Underfill Material Market Size, Share, And Trends By Type (No Flow, Capillary, And Molded), By Industry Vertical (Consumer Electronics, Automotive, Aerospace And Defense, And Others), By Application (Chip Scale Packaging, Flip Chips, And Ball Grid Array), And Geography - Forecasts From 2019 To 2024

Published:  Mar 2020 Report Code: KSI061612692 Pages: 115

Global underfill material market is expected to grow at a compound annual growth rate of XX% over the period 2019 to 2024 to reach a market size of US$XX billion by 2024 from US$XX billion in 2018. Simultaneously, the estimated volume of Underfill material is expected to increase from XX metric tonnes in 2018 to XX metric tonnes in 2024. Underfill material refers to the material used for the encapsulation process to protect and package chip scales, ball grid arrays, flip chip packages, etc. Underfill materials are employed to increase resistance, strength and reliability in the semiconductor industry by being exploited as a filler. The rising demand for consumer electronics such as smartphones, laptops, etc. is projected to drive the demand Underfill material during the forecast period. Furthermore, the growing application of electronics in various industries such as military, automotive, etc. is further expected to drive the demand for Underfill materials in the coming years. The emerging use IoT as well as artificial intelligence globally is further estimated to drive the demand for Underfill material market. Additionally, the Asia-Pacific region is anticipated to significantly augment during the forecast period owing to the increasing use of these materials in the region. The North American region is envisaged to hold a noteworthy share of the market due to the early adoption of using these materials in the region.

DRIVERS

Rising demand for electronics across various industries

Growing demand for highly efficient, low cost, small sized devices

RESTRAINTS

Availability of substitutes

RECENT DEVELOPMENTS

In February 2018, Panasonic Corporation announced that its subsidiary Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. (PIDMSH) will start manufacturing high volumes of molded underfill materials for advanced semiconductor packages in March 2018

The major players profiled in the Underfill material market include Won Chemical .co.Ltd, Henkel AG & Co. KGaA, AIM Metals & Alloys LP, Master Bond Inc., Zymet., Yincae Advanced Materials, LLC, Epoxy Technology, Inc., H.B. Fuller Company., Nordson Corporation, NAMICS Corporation, Hitachi Chemical Co., Shin-Etsu Chemical Co., Ltd., Panacol-Elosol GmbH, LORD Corporation., Bondline Electronic Adhesives, Inc., Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.

Segmentation

The Underfill material market has been analyzed through the following segments:

By Type

No Flow Underfill Material

Capillary Underfill Material

Molded Underfill Material

By Industry Vertical

Consumer Electronics

Automotive

Aerospace and Defense

Others

By Application

Chip Scale Packaging

Flip Chips

Ball Grid Array

By Geography

North America

USA

Canada

Mexico

South America

Brazil

Argentina

Others

Europe

Germany

France

United Kingdom

Spain

Others

Middle East and Africa

Saudi Arabia

Israel

Others

Asia Pacific

China

Japan

South Korea

India

Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Currency

1.5. Assumptions

1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Secondary Sources

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. Market Segmentation

4.2. Market Drivers

4.3. Market Restraints

4.4. Market Opportunities

4.5. Porter’s Five Force Analysis

4.5.1. Bargaining Power of Suppliers

4.5.2. Bargaining Power of Buyers

4.5.3. Threat of New Entrants

4.5.4. Threat of Substitutes

4.5.5. Competitive Rivalry in the Industry

4.6. Life Cycle Analysis - Regional Snapshot

4.7. Market Attractiveness

5. UNDERFILL MATERIAL MARKET BY TYPE

5.1. No Flow Underfill Material

5.2. Capillary Underfill Material

5.3. Molded Underfill Material

6. UNDERFILL MATERIAL MARKET BY INDUSTRY VERTICAL

6.1. Consumer Electronics

6.2. Automotive

6.3. Aerospace and Defense

6.4. Others

7. UNDERFILL MATERIAL BY APPLICATION

7.1. Chip Scale Packaging

7.2. Flip Chips

7.3. Ball Grid Array

8. UNDERFILL MATERIAL MARKET BY GEOGRAPHY

8.1. North America

8.1.1. USA

8.1.2. Canada

8.1.3. Mexico

8.2. South America

8.2.1. Brazil

8.2.2. Argentina

8.2.3. Others

8.3. Europe

8.3.1. Germany

8.3.2. France

8.3.3. United Kingdom

8.3.4. Spain

8.3.5. Others

8.4. Middle East and Africa

8.4.1. Saudi Arabia

8.4.2. Israel

8.4.3. Others

8.5. Asia Pacific

8.5.1. China

8.5.2. Japan

8.5.3. South Korea

8.5.4. India

8.5.5. Others

9. COMPETITIVE INTELLIGENCE

9.1. Company Benchmarking and Analysis

9.2. Recent Investment and Deals

9.3. Strategies of Key Players

10. COMPANY PROFILES

10.1. Essel Won Chemical .co.Ltd

10.2. Henkel AG & Co. KGaA

10.3. AIM Metals & Alloys LP

10.4. Master Bond Inc.

10.5. Zymet.

10.6. Yincae Advanced Materials, LLC

10.7. Epoxy Technology, Inc.

10.8. H.B. Fuller Company.

10.9. Nordson Corporation

10.10. NAMICS Corporation

10.11. Hitachi Chemical Co.,

10.12. Shin-Etsu Chemical Co., Ltd.

10.13. Panacol-Elosol GmbH

10.14. LORD Corporation.

10.15. Bondline Electronic Adhesives, Inc.

10.16. Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.

LIST OF FIGURES

LIST OF TABLES

Won Chemical .co.Ltd

Henkel AG & Co. KGaA

AIM Metals & Alloys LP

Master Bond Inc.

Zymet

Yincae Advanced Materials, LLC

Epoxy Technology, Inc.

H.B. Fuller Company.

Nordson Corporation

NAMICS Corporation

Hitachi Chemical Co.,

Shin-Etsu Chemical Co., Ltd.

Panacol-Elosol GmbH

LORD Corporation.

Bondline Electronic Adhesives, Inc.

Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.

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