Underfill Material Market Size, Share, And Trends By Type (No Flow, Capillary, And Molded), By Industry Vertical (Consumer Electronics, Automotive, Aerospace And Defense, And Others), By Application (Chip Scale Packaging, Flip Chips, And Ball Grid Array), And Geography - Forecasts From 2019 To 2024
- Published : Mar 2020
- Report Code : KSI061612692
- Pages : 115
Global underfill material market is expected to grow at a compound annual growth rate of XX% over the period 2019 to 2024 to reach a market size of US$XX billion by 2024 from US$XX billion in 2018. Simultaneously, the estimated volume of Underfill material is expected to increase from XX metric tonnes in 2018 to XX metric tonnes in 2024. Underfill material refers to the material used for the encapsulation process to protect and package chip scales, ball grid arrays, flip chip packages, etc. Underfill materials are employed to increase resistance, strength and reliability in the semiconductor industry by being exploited as a filler. The rising demand for consumer electronics such as smartphones, laptops, etc. is projected to drive the demand Underfill material during the forecast period. Furthermore, the growing application of electronics in various industries such as military, automotive, etc. is further expected to drive the demand for Underfill materials in the coming years. The emerging use IoT as well as artificial intelligence globally is further estimated to drive the demand for Underfill material market. Additionally, the Asia-Pacific region is anticipated to significantly augment during the forecast period owing to the increasing use of these materials in the region. The North American region is envisaged to hold a noteworthy share of the market due to the early adoption of using these materials in the region.
DRIVERS
Rising demand for electronics across various industries
Growing demand for highly efficient, low cost, small sized devices
RESTRAINTS
Availability of substitutes
RECENT DEVELOPMENTS
In February 2018, Panasonic Corporation announced that its subsidiary Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. (PIDMSH) will start manufacturing high volumes of molded underfill materials for advanced semiconductor packages in March 2018
The major players profiled in the Underfill material market include Won Chemical .co.Ltd, Henkel AG & Co. KGaA, AIM Metals & Alloys LP, Master Bond Inc., Zymet., Yincae Advanced Materials, LLC, Epoxy Technology, Inc., H.B. Fuller Company., Nordson Corporation, NAMICS Corporation, Hitachi Chemical Co., Shin-Etsu Chemical Co., Ltd., Panacol-Elosol GmbH, LORD Corporation., Bondline Electronic Adhesives, Inc., Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
Segmentation
The Underfill material market has been analyzed through the following segments:
No Flow Underfill Material
Capillary Underfill Material
Molded Underfill Material
By Industry Vertical
Consumer Electronics
Automotive
Aerospace and Defense
Others
By Application
Chip Scale Packaging
Flip Chips
Ball Grid Array
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5. UNDERFILL MATERIAL MARKET BY TYPE
5.1. No Flow Underfill Material
5.2. Capillary Underfill Material
5.3. Molded Underfill Material
6. UNDERFILL MATERIAL MARKET BY INDUSTRY VERTICAL
6.1. Consumer Electronics
6.2. Automotive
6.3. Aerospace and Defense
6.4. Others
7. UNDERFILL MATERIAL BY APPLICATION
7.1. Chip Scale Packaging
7.2. Flip Chips
7.3. Ball Grid Array
8. UNDERFILL MATERIAL MARKET BY GEOGRAPHY
8.1. North America
8.1.1. USA
8.1.2. Canada
8.1.3. Mexico
8.2. South America
8.2.1. Brazil
8.2.2. Argentina
8.2.3. Others
8.3. Europe
8.3.1. Germany
8.3.2. France
8.3.3. United Kingdom
8.3.4. Spain
8.3.5. Others
8.4. Middle East and Africa
8.4.1. Saudi Arabia
8.4.2. Israel
8.4.3. Others
8.5. Asia Pacific
8.5.1. China
8.5.2. Japan
8.5.3. South Korea
8.5.4. India
8.5.5. Others
9. COMPETITIVE INTELLIGENCE
9.1. Company Benchmarking and Analysis
9.2. Recent Investment and Deals
9.3. Strategies of Key Players
10. COMPANY PROFILES
10.1. Essel Won Chemical .co.Ltd
10.2. Henkel AG & Co. KGaA
10.3. AIM Metals & Alloys LP
10.4. Master Bond Inc.
10.5. Zymet.
10.6. Yincae Advanced Materials, LLC
10.7. Epoxy Technology, Inc.
10.8. H.B. Fuller Company.
10.9. Nordson Corporation
10.10. NAMICS Corporation
10.11. Hitachi Chemical Co.,
10.12. Shin-Etsu Chemical Co., Ltd.
10.13. Panacol-Elosol GmbH
10.14. LORD Corporation.
10.15. Bondline Electronic Adhesives, Inc.
10.16. Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
LIST OF FIGURES
LIST OF TABLES
Won Chemical .co.Ltd
Henkel AG & Co. KGaA
AIM Metals & Alloys LP
Master Bond Inc.
Zymet
Yincae Advanced Materials, LLC
Epoxy Technology, Inc.
H.B. Fuller Company.
Nordson Corporation
NAMICS Corporation
Hitachi Chemical Co.,
Shin-Etsu Chemical Co., Ltd.
Panacol-Elosol GmbH
LORD Corporation.
Bondline Electronic Adhesives, Inc.
Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
Related Reports
Report Name | Published Month | Get Sample PDF |
---|---|---|
Smart Packaging Market Size: Industry Report, 2023 - 2028 | May 2023 | |
Protective Packaging Market Size: Industry Report, 2022-2027 | Nov 2022 | |
E-commerce Packaging Market Size: Industry Report, 2023-2028 | Dec 2023 | |
Foam Protective Packaging Market Growth, Share & Trends: 2019-2024 | May 2020 | |
Electrostatic Discharge (ESD) Packaging Market Size, Share, 2019 - 2024 | Mar 2020 |