Silicon carbide semiconductors better known as SiC Wafers have a wide bandgap of silicon carbide which makes it perfectly compatible with high-power applications. SiC wafers are widely used in several industries due to their hardness, stability under heat and high voltage current, and wide bandgap....
Source: Wolfspeed Inc. Annual Reports
Market Dynamics and Drivers
Several factors drive the SiC wafers market, including a rise in applications of SiC in renewable energy in recent times coupled with the rise in demand for EVs in the automotive industry has contributed significantly to boosting the overall SiC wafers market. So, with this rapid growth in electric vehicle technology and popularity, the need for SiC wafers is rising proportionally. SiC wafers are used to provide powerful electronic components capable of effective and efficient functioning at high temperatures. Therefore, with a rise in demand for these products in the market, the market is also predicted to grow.
The development and innovation in semiconductor technology across several industries is one of the growth factors in the SiC wafers market. The traditional silicon-based power semiconductors are outdated now and new SiC power semiconductors outperform them and are compatible with current industry standards. They help power modules become smaller and more energy-efficient. Most power semiconductor devices have 6-inch diameter but innovations are being made for 8-inch diameter power semiconductors. So, with these constant innovations and developments in SiC wafer technology, the market is anticipated to grow in the forecast period.
Challenges and Constraints
Despite the huge advantages and use cases of SiC wafers the companies that manufacture them require a lot of materials to build SiC wafers. This includes micropipes which are micro-sized holes found in crystals. Also, while manufacturing these semiconductors workers need to be very precise and highly concentrated because one mistake can ruin a whole set of manufacturing. They are prone to various defects such as stacking faults or dislocation. These factors are predicted to contribute to and affect the market negatively.
The expansion of applications of SiC is wide but with these continuous developments and innovations, the complexity and process to manufacture these SiC wafers are also getting high proportionally. The major challenge these manufacturers face is keeping the cost low while achieving better efficiency with a less complex structure. Also, the different applications of SiC wafers require different design complexity, therefore, hindering the market.
Emerging Opportunities and Innovations
The SiC wafers market presents numerous opportunities for innovation and growth. Also, the presence of major key players offering silicon carbide devices such as Toshiba Corporation from Japan, TanKeBlue Co. Ltd. From China, and Renesas Electronics Corporation from Japan which are making significant innovations in SiC wafers technology are anticipated to increase its demand in the market globally. Furthermore, the growing innovations in the automotive industry and the electric vehicle's popularity among people create various new opportunities for innovation in SiC wafer technology.
Key Developments
- In February 2024, Onsemi announced the availability of its 1200V SPM31 Intelligent Power Modules. It provides a smaller footprint, higher efficiency, and higher power density resulting in lower total system cost than other leading solutions on the market. Also, it has the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology.
- In January 2024, Onsemi announced nine new EliteSiC Power Integrated Modules which will be used to enable bidirectional charging capabilities as they can charge electric vehicle batteries up to 80% in as little as 15 minutes for fast energy storage systems and electric vehicle chargers.
- In January 2024, Wolfspeed Inc. one of the global leaders in silicon carbide technology announced the expansion of an existing long-term silicon carbide wafer supply agreement with a leading global semiconductor company.
- In July 2023, Axcelis Technologies Inc. announced a shipment of a Purion H200™ SiC ion implant system to Wolfspeed. This was used to support the production of power devices for electric vehicle (EV) applications.
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