Semiconductor Bonding Material Market Size, Share, Opportunities, And Trends By Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), By Bonding Type (Die-to-Die Bonding, Wafer-to-Wafer Bonding, Die-to-Wafer Bonding) By Application (RF Devices, 3D NAND, CMOS Image Sensors, LED, MEMS & Sensors), And By Geography - Forecasts From 2023 To 2028
- Published : Jun 2023
- Report Code : KSI061615492
- Pages : 145
The semiconductor bonding material market is projected to grow at a high rate during the forecast period
The semiconductor is a material having essential electric properties that makes it useful for the manufacturing of computers and electronic equipment. Additionally, it is a chemically solid substance that, under certain circumstances, conducts electricity. Defense equipment, communication systems, transportation, computing, healthcare, and renewable energy are just a few of the lucrative applications for semiconductors. Atoms are bonded together in semiconductor arrangements to create a huge number of integrated circuits and production tools. The semiconductor bonding model's uniform and constant semiconductor material structure.
Rising demand for microelectronics
The semiconductor bonding material market growth will be accelerated by rising interest in electric vehicles and micro-electromechanical systems. The number of linked devices that use stacked die systems will expand the size of the worldwide semiconductor bonding industry. The launch of the 5G network and an increase in research into creating the 6G network will aid in the semiconductor bonding market's rapid global expansion. The use of smartphones and wearable technology will increase, boosting worldwide market trends. In addition, the market for semiconductor bonding is anticipated to grow in the next years due to the numerous uses for semiconductors in linked logistics, architecture & home automation, smart transportation, and smart transport.
Growing use of stacked die technology in IoT devices
The semiconductor bonding market is expanding as a result of the growing use of stacked dies technology in loT devices. It is possible to use the same placement area on a substrate for numerous functionalities by stacking one bare die on top of another inside of a single semiconductor package. Die stacking improves electrical device performance because it speeds up signal creation through shorter routing of links between circuits. Original equipment producers (OEMs) in the semiconductor sector are concentrating on using the loT's advantages outside of connection which has significantly fueled the growth of the semiconductor bonding material market.
Expanding IC industry
One of the main factors driving the expansion of the semiconductor wafer bonding market is the semiconductor industry's rising demand for thin wafers. Many outdated fabrication techniques have been overcome by developments in thin wafers. Thin wafer manufacturing has advantages including ultra-low power consumption and ultra-high electrical performance, which is drawing interest from Chinese IC makers wanting to capitalize on this technology. Many Chinese IC suppliers are currently driven primarily by the requirement for thin chips with great performance at low operating voltage and low cost. As a result, wafer bonding and other thin wafer technologies are becoming more and more common among Chinese IC producers like Hisilicon Technologies, Co., Ltd., Spreadtrum Communications, and RDA Microelectronics.
High ownership cost
In order to complete die-attach procedures, semiconductor bonding equipment needs a lot of input power. These devices need anywhere from a few hundred to a few thousand watts of power. Due to the use of intricate, expensive components, semiconductor bonding equipment has a very high manufacturing cost. It is also expensive to assemble several large and small pieces, such as the screen, bonding hand, hoover, sensors, and heat source. As a result, die bonder equipment's overall manufacturing and ownership expenses for semiconductor bonding equipment are quite expensive. The market's expansion is further hampered by the excessive cost of semiconductor wafers, which raises the operating expense of semiconductor bonding.
Mechanical unbalance and susceptibility to pressure damage
In order to pick and position the die for the bonding process, die bonder equipment uses mechanical motions. The machinery has a lot of moving pieces that need to be moved carefully in order to precisely connect the die to the substrate. However, occasionally, the joints' irregular motion and other problems, such as instability, might cause the moving parts to vibrate. Die misalignment or die cracking can be caused by the vibration in die bonders. The vibration of mechanical components has grown to be a significant obstacle that makers of semiconductor bonding equipment must overcome.
Asia Pacific is projected to have the highest share of the semiconductor bonding material market
During the projected period, the Asia-Pacific region is anticipated to hold the semiconductor bonding materials market share. Due to strategic investments made by important domestic suppliers and the region's well-established semiconductor industry, which is a big player in the market. The area is home to some of the biggest semiconductor companies, and increasing investments are being made to support the infrastructure of the sector in countries like China, India, and Vietnam. Additionally, reputable domestic vendors and governmental organizations are investing heavily in technology to provide future semiconductor bonding solutions, like hybrid bonding, which is anticipated to boost market demand.
Market Key Developments
- In November 2022, SÜSS MicroTec SE introduced Impulse Current Bonding, a novel low-temperature field-assisted bonding technique. A significant scientific discovery served as the foundation for the Sy&Se technology developed by the Swiss university spin-off. This new technology will be compatible with both manual and automatic wafer bonder systems, opening the door for a stronger bonding procedure that combines the anodic bonding method's robustness with other, more sophisticated bonding techniques' material diversity.
- In October 2022, BE Semiconductor Industries NV made plans to develop a new semiconductor manufacturing and testing facility in Penang public in October 2022. The new facility, which consists of two buildings (Plants 4 and 5), will be located in the Bayan Lepas Free Industrial Zone and have a total floor space of 982,000 square feet. When the project is finished, which is anticipated to be in 2025, 2,700 new jobs will be available in the neighbourhood.
- In July 2022, the newest improvement in the MRSI-H/HVM-series product line, the MRSI-H-HPLD+, was introduced by MRSI Systems (Mycronic Group). With parallel processing, this new MRSI-H-HPLD variant greatly increases throughput while preserving high precision and flexibility in high-power laser die attachment applications.
- In May 2022, LAPIS Technology Co., Ltd., a division of the ROHM Group, and Adeia, licensing business of Xperi Holding Corporation, announced an agreement that includes the technological transferring Adeia's DBI Ultra die-to-wafer mixed bonding know-how to support the research and development and deployment of the technology into LAPIS's product line. A license to Adeia's underlying hybrid bonding patent portfolio is also included in the arrangement.
Semiconductor Bonding Material Market Scope:
|Growth Rate||CAGR during the forecast period|
|Forecast Period||2023 – 2028|
|Forecast Unit (Value)||USD Billion|
|Segments Covered||Type, Bonding Type, Application, and Geography|
|Regions Covered||North America, South America, Europe, Middle East and Africa, Asia Pacific|
|Companies Covered||Kulicke & Soffa, Tata Elxsi Ltd, Shibaura Mechatronics, Yamaha Motor Robotics Corporation Co., Fuji Corporation, Panasonic Corporation, SUSS MicroTech SE, ASM Pacific Technology Ltd., Fasford Technology|
|Customization Scope||Free report customization with purchase|
- By Type
- Die Bonder
- Wafer Bonder
- Flip Chip Bonder
- By Bonding Type
- Die-to-Die Bonding,
- Wafer-to-Wafer Bonding
- Die-to-Wafer Bonding
- By Application
- RF Devices
- 3D NAND
- CMOS Image Sensors
- MEMS & Sensors
- By Geography
- North America
- United States
- South America
- United Kingdom
- Middle East and Africa
- Saudi Arabia
- Asia Pacific
- South Korea
- North America
Frequently Asked Questions (FAQs)
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.7. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Data
3. EXECUTIVE SUMMARY
3.1. Research Highlights
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Porter’s Five Force Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
5. GLOBAL SEMICONDUCTOR BONDING MATERIAL MARKET, BY TYPE
5.2. Die Bonder
5.3. Wafer Bonder
5.4. Flip Chip Bonder
6. GLOBAL SEMICONDUCTOR BONDING MATERIAL MARKET, BY BONDING TYPE
6.2. Die-to-Die Bonding,
6.3. Wafer-to-Wafer Bonding
6.4. Die-to-Wafer Bonding
7. GLOBAL SEMICONDUCTOR BONDING MATERIAL MARKET, BY APPLICATION
7.2. RF Devices
7.3. 3D NAND
7.4. CMOS Image Sensors
7.6. MEMS & Sensors
8. GLOBAL SEMICONDUCTOR BONDING MATERIAL MARKET, BY GEOGRAPHY
8.2. North America
8.3. South America
8.4.3. United Kingdom
8.5. Middle East And Africa
8.5.1. Saudi Arabia
8.6. Asia Pacific
8.6.4. South Korea
9. COMPETITIVE ENVIRONMENT AND ANALYSIS
9.1. Major Players and Strategy Analysis
9.2. Emerging Players and Market Lucrativeness
9.3. Mergers, Acquisitions, Agreements, and Collaborations
9.4. Vendor Competitiveness Matrix
10. COMPANY PROFILES
10.1. Kulicke & Soffa
10.2. Tata Elxsi Ltd
10.3. Shibaura Mechatronics
10.4. Yamaha Motor Robotics Corporation Co.
10.5. Fuji Corporation
10.6. Panasonic Corporation
10.7. SUSS MicroTech SE
10.8. ASM Pacific Technology Ltd.
10.9. Fasford Technology
Kulicke & Soffa
Tata Elxsi Ltd
Yamaha Motor Robotics Corporation Co.
SUSS MicroTech SE
ASM Pacific Technology Ltd.
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