Semiconductor Dry Etch Systems Market Size, Share, Opportunities, And Trends By Type (Dielectric Etching, Conductor Etching), By Equipment Type (Single-Wafer Etch Systems, Batch Etch Systems), By Application (Logic & Foundry, MEMS, Sensors, Power Devices, Memory (DRAM, NAND), Others), And By Geography – Forecasts From 2025 To 2030

The semiconductor dry etch systems market is projected to grow at a CAGR of 5.23% over the forecast period, from US$18.453 billion in 2025 to US$23.814 billion by 2030.

Semiconductor dry etch systems are pivotal machines in the manufacture of integrated circuits (ICs) or microchips. They employ a precise method to remove material from a silicon wafer, creating intricate designs that represent the electrical components and pathways within a chip. These frameworks are fundamental devices for making advanced, as well as effective, microchips.

Market Trends:

Increasing Demand for Optoelectronics and Sensors:

According to the 2022 International Roadmap for Devices and Systems (IRDS), global sales of optoelectronics and sensors are rising significantly, with sensor sales growing from $16.5 billion in 2020 to $24.3 billion by 2022, and optoelectronics sales projected to increase from $44 billion to $54.2 billion by 2022. This surge, alongside advancements in transistor dimension targets, is driving the need for more precise and advanced dry etching techniques, fueling market expansion. Supportive government policies and investments in the semiconductor sector are also expected to bolster future growth.

Significant U.S. Market Contribution:

The United States is poised to play a major role in market growth due to rising demand for consumer electronics and data storage devices, supported by its advanced technological ecosystem. High-resolution patterning and precise etching capabilities are expected to drive demand across various industries. The presence of key players like Lam Research and Applied Materials further strengthens growth prospects. For example, Lam Research highlights that semiconductor etching demand will grow, propelled by advancements in 5G, AI, and IoT, as well as the increasing complexity of semiconductor manufacturing processes.

Some of the major players covered in this report include Applied Materials, Inc., Hitachi High-Tech Corporation, Lam Research Corporation, Tokyo Electron Limited, Plasma-Therm LLC, SPTS Technologies Ltd., Panasonic Industry Co., Ltd., among others.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

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Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Semiconductor Dry Etch Systems Market Segmentation:

By Type

• Dielectric Etching
• Conductor Etching

By Equipment Type

• Single-Wafer Etch Systems
• Batch Etch Systems

By Application

• Logic & Foundry
• MEMS
• Sensors
• Power Devices
• Memory (DRAM, NAND)
• Others

By End-Use Industry

• Consumer Electronics
• Telecommunications
• Automotive
• Others

By Geography

• Americas
  • US
• Europe, the Middle East, and Africa
  • Germany
  • Netherlands
  • Others
• Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

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1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK 

5. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY TYPE

5.1. Introduction

5.2. Dielectric Etching

5.3. Conductor Etching

6. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY EQUIPMENT TYPE

6.1. Introduction

6.2. Single-Wafer Etch Systems

6.3. Batch Etch Systems

7. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY APPLICATION

7.1. Introduction

7.2. Logic & Foundry

7.3. MEMS

7.4. Sensors

7.5. Power Devices

7.6. Memory (DRAM, NAND)

7.7. Others

8. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY END USE INDUSTRY

8.1. Introduction

8.2. Consumer Electronics

8.3. Telecommunications

8.4. Automotive

8.5. Others

9. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY GEOGRAPHY

9.1. Introduction

9.2. Americas

9.2.1. USA

9.3. Europe, Middle East, and Africa

9.3.1. Germany

9.3.2. Netherlands

9.3.3. Others

9.4. Asia Pacific

9.4.1. China

9.4.2. Japan

9.4.3. Taiwan

9.4.4. South Korea

9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

10.1. Major Players and Strategy Analysis

10.2. Market Share Analysis

10.3. Mergers, Acquisitions, Agreements, and Collaborations

10.4. Competitive Dashboard

11. COMPANY PROFILES

11.1. Applied Materials, Inc. 

11.2. Hitachi High-Tech Corporation

11.3. Lam Research Corporation

11.4. Tokyo Electron Limited

11.5. Plasma-Therm LLC

11.6. SPTS Technologies Ltd.  

11.7. Panasonic Industry Co., Ltd. 

11.8. ULVAC, Inc. 

11.9. SÜSS MicroTec SE  

11.10. Oxford Instruments plc 

12. APPENDIX

12.1. Currency 

12.2. Assumptions

12.3. Base and Forecast Years Timeline

12.4. Key benefits for the stakeholders

12.5. Research Methodology 

12.6. Abbreviations

Applied Materials, Inc. 

Hitachi High-Tech Corporation

Lam Research Corporation

Tokyo Electron Limited

Plasma-Therm LLC

SPTS Technologies Ltd.  

Panasonic Industry Co., Ltd. 

ULVAC, Inc. 

SÜSS MicroTec SE  

Oxford Instruments plc