Thermal Management Solutions Market Size, Share, Opportunities, And Trends By Material Type (Adhesive Material (Tapes, Films, Adhesive Liquids), Non-Adhesive Material (Thermal Pads, Gap Fillers, Phase Change Materials, Grease)), By Device (Conduction Cooling Devices, Convention Cooling Devices, Advanced Cooling Devices, Hybrid Cooling Devices), By Service (Installation & Collaboration, Optimization & Post-sales Support), By End-User Industry (Consumer Electronics, Service & Data Centers, Automotive, Aerospace & Defense, Healthcare, Others), And By Geography - Forecasts From 2023 To 2028

  • Published : Dec 2023
  • Report Code : KSI061616305
  • Pages : 140

The Thermal Management Solutions Market is projected to grow considerably during the forecast period.

Electronic packaging has resulted in improved performance and smaller product sizes. Due to the large rise in power consumption, thermal management is now necessary to maintain system reliability and performance by reducing the high heat flux produced by electronic devices. One of the main drivers of market growth is the electronics industry's notable global growth. As consumer electronics manufacturing technologies advance, there is a growing need for smaller devices with higher power densities. As a result, there is a greater need for thermal management technologies to reduce the high heat flux that these devices produce.

Increasing need for advanced heat dissipation solutions

A development opportunity was predicted for the Thermal Management Solutions market in the upcoming years as thermal interface materials are to transfer heat while displaying a compression force characteristic that can accommodate both the heat-generating component and the heat-dissipating chassis or heat sink. When electronic components work, heat is produced. The functionality and dependability of these products are determined by how well they control their heat-generating and cooling systems. A means of wicking heat away from the components to a heat-dissipating mechanism, like a chassis, liquid cooling plate, or conventional heat sink, is required when temperatures rise too high.

Increasing Demand for Consumer Electronics

The electronics industry's advancements have led to a rise in the introduction of more intelligent and compact products. Because of these developments in the field, there is now a greater demand for novel thermal management technologies, which reduce heat generation from devices and enhance system performance and reliability. Over the last ten years, there has been a significant increase in the market for tablet and smartphone materials. In addition, the number of connected devices has been growing quickly in recent years due to the growing adoption of the Internet of Things (IoT), a technology that uses IP-enabled protocols and the Internet to allow communication between things or between things and people. For example, 29.3 billion devices will be connected to networks by 2023, according to Cisco.

Strict emission regulations and regulations

Due to environmental concerns and the fact that thermal management systems lower vehicle emissions, demand for them is rising. Ineffective cabin climate control can result in significantly higher fuel consumption and emissions, as well as potential safety risks from fogging and windshield damage. Furthermore, the California Air Resources Board (CARB) plans to tighten rules by 2024 to enhance NOx emission technologies that heat an after-treatment system quickly and maintain its temperature without degrading fuel efficiency. Vehicle fuel efficiency is improved by this system's assistance in regulating the internal combustion engine's temperature. Therefore, it is anticipated that growing attention to thermal management to reduce vehicle emissions will spur market expansion.

Increasing use of the conduction cooling devices

The physical transfer of thermal or heat energy is known as conduction. The purpose of connecting the two objects is to allow the object with a lower temperature to absorb thermal energy from the object with a higher temperature. Due to its low surface area requirement for energy transfer, conduction is regarded as one of the most successful methods of thermal management. Heat sinks, heat spreaders, and other similar items are typical instances of conduction-based thermal management products which is anticipated to create new opportunities for the Thermal Management Solutions market to grow.

By end-user industry, the servers and data centers are expected to grow considerably

Regardless of complexity or size, thermal management is essential to ensuring the best possible operation and performance of all electronic applications. Thousands of data processing devices, including servers, switches, and routers, make up data centres, and these devices emit a lot of heat and energy. These data centres produce heat, which needs to be adequately dissipated to keep the temperature from rising and deteriorating the centres' performance and dependability, which would require more maintenance. For data center operations like data placement, data migration, data replication, data access task distribution, scheduling, and disk speed control to run smoothly, thermal management is required.

Hybrid Thermal Management and Electromagnetic Interference (EMI) Shielding to Promote Market Development

Several sectors are transitioning to higher-frequency navigation applications. Automotive radar for higher resolution detection and 5G telecommunications for faster data rates are two major examples of this. Electromagnetic interference (EMI) shielding using conventional techniques gets more challenging at higher frequencies. It becomes appealing to combine EMI shielding with efficient thermal management in one material. The rollout of 5G is well advanced, but the highest frequency wave (>24 GHz) infrastructure is still in its early stages of development.

North America is projected to have the highest share of the Thermal Management Solutions market

Due in large part to rising investments in technological innovation and the widespread adoption of thermal management technologies across various industries, the North American region is anticipated to hold the largest market share. One of the main drivers of the market's growth is the region's booming consumer electronics industry. As per a recent prediction by CTA, the retail sales revenue of the consumer technology industry in the United States is expected to surpass USD 505 billion for the first time. From the remarkable growth of 9.6% in 2021 over 2020, the projection shows a 2.8% increase in revenue in 2021. Strong demand for smartphones, car technology, health devices, and streaming services, according to the organization, will contribute significantly to the predicted revenue.

Market Key Developments

  • In July 2023, ProLogium, a Taiwanese manufacturer of solid-state battery cells, and Mahle, a supplier to the automotive sector, teamed together to develop and evaluate thermal management strategies for the upcoming generation of solid-state batteries. Through the signing of a letter of intent, the companies have committed to collaborate on this project. The primary goal of this alliance is to develop battery systems with improved efficiency, longevity, energy density, and fast charging capabilities.
  • In July 2023, Marelli's new iTMM (integrated Thermal Management Module) was launched. It allows for the efficient integration of the vehicle's numerous thermal circuits into a single part, resulting in a more efficient thermal management system that improves driving range, safety, and flexibility. The module modularizes water-cooled heat exchangers, such as the chiller/water-cooled condenser, by utilizing an ingenious valve design. To provide effective energy management, the Marelli iTMM integrates the three systems, taking advantage of their synergies and exchanging components. Up to six channel combinations can be regulated by this integrated valve.

Segmentation:

  • By Material Type
    • Adhesive Material
      • Tapes
      • Films
      • Adhesive Liquids
    • Non-Adhesive Material
      • Thermal Pads
      • Gap Fillers
      • Phase Change Materials
      • Grease
  • By Device
    • Conduction Cooling Devices
    • Convention Cooling Devices
    • Advanced Cooling Devices
    • Hybrid Cooling Devices
  • By Service
    • Installation & Collaboration
    • Optimization & post-sales Support
  • By End-User Industry
    • Consumer Electronics
    • Service & Data Centers
    • Automotive
    • Aerospace & Defense
    • Healthcare
    • Others
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • United Kingdom
      • Germany
      • France
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Indonesia
      • Thailand
      • Others

1.  INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Force Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

5. THERMAL MANAGEMENT SOLUTIONS MARKET, BY MATERIAL TYPE

5.1. Introduction

5.2. Adhesive Material

5.2.1. Tapes

5.2.2. Films

5.2.3. Adhesive Liquids

5.3. Non-Adhesive Material

5.3.1. Thermal Pads

5.3.2. Gap Fillers

5.3.3. Phase Change Materials

5.3.4. Grease

6. THERMAL MANAGEMENT SOLUTIONS MARKET, BY DEVICE

6.1. Introduction

6.2. Conduction Cooling Devices

6.3. Convention Cooling Devices 

6.4. Advanced Cooling Devices

6.5. Hybrid Cooling Devices

7. THERMAL MANAGEMENT SOLUTIONS MARKET, BY SERVICE

7.1. Introduction

7.2. Installation & Collaboration

7.3. Optimization & post-sales Support

8. THERMAL MANAGEMENT SOLUTIONS MARKET, BY END-USER INDUSTRY

8.1. Introduction

8.2. Consumer Electronics

8.3. Service & Data Centers

8.4. Automotive

8.5. Aerospace & Defense

8.6. Healthcare

8.7. Others

9. THERMAL MANAGEMENT SOLUTIONS MARKET, BY GEOGRAPHY

9.1. Introduction 

9.2. North America

9.2.1. USA

9.2.2. Canada

9.2.3. Mexico

9.3. South America

9.3.1. Brazil

9.3.2. Argentina

9.3.3. Others

9.4. Europe

9.4.1. Germany

9.4.2. France

9.4.3. United Kingdom

9.4.4. Spain

9.4.5. Others

9.5. Middle East And Africa

9.5.1. Saudi Arabia

9.5.2. UAE

9.5.3. Israel

9.5.4. Others

9.6. Asia Pacific

9.6.1. China

9.6.2. Japan

9.6.3. India

9.6.4. South Korea

9.6.5. Indonesia

9.6.6. Taiwan

9.6.7. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

10.1. Major Players and Strategy Analysis

10.2. Emerging Players and Market Lucrativeness

10.3. Mergers, Acquisitions, Agreements, and Collaborations

10.4. Vendor Competitiveness Matrix

11. COMPANY PROFILES

11.1. Advanced Cooling Technologies, Inc.

11.2. Boyd Corporation

11.3. Delta Electronics, Inc.

11.4. Fujikura Ltd.

11.5. Gentherm Incorporated

11.6. Honeywell International Inc.

11.7. Laird Thermal Systems

11.8. Master Bond Inc.

11.9. Paker Hannifin Corporation

11.10. Siemens AG

11.11. STMicroelectronics

11.12. Vertiv Holdings Co

11.13. Wakefield-Vette, Inc.


Advanced Cooling Technologies, Inc.

Boyd Corporation

Delta Electronics, Inc.

Fujikura Ltd.

Gentherm Incorporated

Honeywell International Inc.

Laird Thermal Systems

Master Bond Inc.

Paker Hannifin Corporation

Siemens AG

STMicroelectronics

Vertiv Holdings Co

Wakefield-Vette, Inc.