Semiconductor Back-End Equipment Market size worth US$148.756 billion by 2029

semiconductor back-end equipment market

The semiconductor back-end equipment market is expected to grow at a CAGR of 8.11% with a market valuation of US$86.193 billion in 2022 and is expected to reach a market value of US$148.756 billion by 2029.

Several factors are driving the semiconductor back-end equipment market including the growing demand and the rise in applications for it across several industries and these industries include various consumer electronic devices including wearables, and smart home devices like smart TVs, or PCs. The semiconductor back-end equipment is an important part of the production process for semiconductors which is expected to fuel its market growth over the forecast period.

As per the report, the semiconductor back-end equipment market is expected to grow significantly.

Semiconductor back-end equipment is used in the final stages of the semiconductor manufacturing process for assembling and packaging the integrated circuits to finish the final product production. The tools used for this process are called semiconductor back-end equipment. The technology that is required for developing the back-end process of semiconductor manufacturing consists of high throughput and extreme precision and accuracy. In several back-end semiconductor manufacturing processes the servo drives are used because of their repeatability and performance.

The market growth is driven by a rapid increase in the application of semiconductors in several consumer electronics, automobile industry, and AI chipsets in recent times coupled with the rise in demand for efficient and high-speed back-end equipment to match the growing amount of global demand for semiconductors has contributed significantly to boosting the overall market. Also, with the rapid growth in popularity of EVs or electric vehicles and AI technology in recent years the need for semiconductors is rising proportionally. The back-end equipment is used for packaging and assembling the integrated circuits in semiconductors therefore, the market is anticipated to grow for semiconductor back-end equipment over the forecast period.

The semiconductor back-end equipment market encompasses various procedures, including wafer testing, bonding, dicing, metrology, and assembly packaging. These various procedures are present in the market to improve the production growth of the semiconductors in the final stages using the back-end equipment. For instance, in the assembly packaging process, the back-end equipment is used for packaging and assembling integrated circuits to finish the final product. Therefore, the wide variety of procedures available for the use of semiconductor back-end equipment is anticipated to boost the market growth over the forecast period.

The semiconductor back-end equipment market is poised for growth in the Asia Pacific region due to rising demand for consumer electronics and the production growth of semiconductors by establishing necessary industries in several countries is predicted to grow the market in the region. Moreover, significant business investments in the semiconductor industry across several countries coupled with the introduction of 5G technology and AI popularity in recent years has grown the demand for semiconductors significantly, and that in turn is anticipated to fuel the market growth for semiconductor back-end equipment in the Asia Pacific region over the forecast period.

ASML Holding, Applied Materials, Lam Research, S firm Applied Materials Inc (Tokyo Electron Limited), KLA Corporation, Onto Innovation Inc, SCREEN Holdings Co Ltd, Teradyne Inc, and Japan Industrial Partners (Toshiba Corporation)— these are some of the key companies involved in the semiconductor back-end equipment production and each company brings its different or diverse expertise and products to the market which can further cater to the diverse needs of organizations and enterprises. They provide innovative solutions for the backend manufacturing process and these companies play a vital role in improving the efficiency and accuracy of the process while optimizing the performance of the overall production process.

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This analytics report segments the semiconductor back-end equipment market on the following basis:

  • By Procedure
    • Wafer Testing
    • Bonding
    • Dicing
    • Metrology
    • Assembly Packaging
  • By Geography
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • UK
      • France
      • Spain
      • Others
    • Middle East and Africa
      • Saudi Arabia
      • UAE
      • Others
    • Asia Pacific
      • China
      • Japan
      • South Korea
      • India
      • Australia
      • Others
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