Semiconductor Back-End Equipment Market Size, Share, Opportunities, And Trends By Procedure (Wafer Testing, Bonding, Dicing, Metrology, Assembly Packaging), And By Geography - Forecasts From 2025 To 2030

Semiconductor Back-End Equipment Market Size:

The semiconductor back-end equipment market is expected to grow at a CAGR of 6.89%, reaching a market size of USD 15.769 billion in 2030 from USD 11.301 billion in 2025.

Semiconductor Back-End Equipment Market Highlights:

• Semiconductor demand is driving growth: Rising chip needs are boosting back-end equipment market expansion.
• Technological advancements are fueling innovation: Complex IC designs are increasing equipment demand globally.
• Asia Pacific is leading expansion: Strategic investments are propelling regional market growth rapidly.
• Bonding equipment is gaining traction: Efficient chip assembly is enhancing back-end equipment adoption.

Semiconductor Back-end Equipment Market Introduction:

The market is expected to grow due to the increasing demand for small devices and functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since integrated circuit (IC) designs are becoming highly complex and more semiconductor products must be introduced to manufacture ICs, the demand for semiconductor back-end equipment is increasing steadily. Semiconductors are used in IC development because they lower costs, speed up mass production, and increase the operational value of the finished product.

Two processes are involved in producing semiconductors: the front-end and the back-end. Back-end processing is the step in semiconductor production that comes after the circuit definition on the wafer. Several stages are included in the processes to guarantee the functionality, dependability, performance, and durability of the semiconductor chips. Each process needs a particular set of tools to analyze and function at incredibly minute levels. Therefore, businesses provide the goods and services that semiconductor foundries and manufacturing facilities need to meet the demand for such equipment. The rising worldwide demand for semiconductors across the industrial sector has boosted their production scale, driving the semiconductor back-end equipment market. 

Semiconductor Back-end Equipment Market Overview:

The semiconductor back-end equipment is used in semiconductor manufacturing, focusing on the packaging and testing of semiconductors. Hence, such equipment offers an efficient and accurate manufacturing process, thereby improving the overall speed and precision during the designing and processing operations.

The bolstering growth of electronics manufacturing is propelling the demand for high-end semiconductors used in such devices, thereby boosting the semiconductor back-end equipment market during the forecasted timeline. The National Institute of Standards and Technology, in its report, stated that in 2023, the manufacturing sector contributed about US$2.3 trillion to the GDP of the USA. In the total manufacturing sector, computer & electronic products accounted for US$299 billion, whereas machinery and electrical equipment accounted for US$152 billion and US$51 billion, respectively.

Some of the major companies include Mindteck, Kanematsu Corporation, and Canon U.S.A., Inc.

• Canon U.S.A., Inc. is a global technological service that offers products for multiple industries, like healthcare, legal, government, and education.
• Mindteck is a global information technology leader. It offers multiple technologies, like IoT, embedded systems & applications, enterprise applications & product lifecycle management, big data/analytics, and IT security, among others.
• Kanematsu Corporation is a Japanese technological leader that offers a wide range of products and solutions, like electronics & devices, ICT solutions, foods, meat & grains, and motor vehicles & aerospace, among others.

Semiconductor Back-end Equipment Market Drivers:

• High demand for semiconductors

The global demand for semiconductors is increasing owing to growing end-user applications. Younger, emerging companies rely on Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) service providers to satisfy the demands for product development and manufacturing. Governments worldwide are focusing on domestic semiconductor production to reduce their reliance on foreign vendors. They welcome direct investment programs from well-known manufacturers and provide favorable regulations.

For instance, the Semiconductor Industry Association (SIA) announced that global semiconductor sales reached US$627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of US$526.8 billion. The association further stated that the Americas region witnessed a growth of 46.3%, whereas China and Asia Pacific/all other regions witnessed a growth of 22.9% and 18.4%, respectively. Such growth in the global sale of semiconductors will positively impact the demand & usage of new wafer processing, packaging, and bonding technologies.

• Rising need in the manufacturing industry

Semiconductor wafers, IC chips, memory chips, circuits, and other components are made with semiconductor manufacturing equipment. Silicon wafer manufacturing equipment is used early in the manufacturing process. Photolithography tools, etching machines, chemical vapor deposition machines, measurement machines, and process/quality control apparatus are examples of wafer processing equipment. The semiconductor back-end equipment market is anticipated to be driven by the growing need for discrete devices, power semiconductors, and high-power modules for diverse end users. Moreover, the trend of combining semiconductors onto a single chip is growing as customers' preferences for small-sized products grow. In this case, the main application of this equipment is the assembly of semiconductor parts into a single chip.

• Increasing demand for bonding equipment

The growing need for semiconductor chips with greater efficiency, processing power, and smaller footprints is driving demand for semiconductor bonding equipment, propelling the market expansion during the forecast period.

The substantial advancements in front-end processes have also increased the need for semiconductor bonding equipment. Investments in other applications and state-of-the-art packaging technologies also fuel the need for bonding equipment solutions. In addition, producers are focusing on enhancing the semiconductors required to produce back-end machinery and semiconductor manufacturing equipment (SME).

Semiconductor Back-end Equipment Market Segment Analysis:

• The assembly packaging segment is predicted to grow robustly

The semiconductor back-end equipment market is segmented by procedure into wafer testing, bonding, dicing, metrology, and assembly and packaging. Technological innovations and the transition of advanced & microelectronics have bolstered the demand for sophisticated packaging processes such as system-in-package, fan-out wafer-level packaging, and wafer-level packaging to improve IC performance.

Moreover, this segment’s growth is triggered by massive industrial applications of semiconductor ICs, with major sectors such as electronics, automotive, and robotics emphasizing with adoption of new technological innovations.

Further, the rapid movement towards advanced packaging technologies, as well as the ever-increasing adaptations for semiconductor packaging machinery, has developed out of a necessity for smaller, faster, and more efficient semiconductors.

Additionally, one of the main factors propelling the semiconductor packaging and assembly equipment industry’s growth is the notable increase in the use and manufacturing of semiconductor chips. Additionally, the Semiconductor Industry Association (SIA) reported that sales of semiconductors worldwide reached $46.6 billion in October 2023, up 3.9% from $44.9 billion in September 2023. Packaging equipment vendors will be able to take advantage of market opportunities due to these favorable industry trends.

Semiconductor Back-end Equipment Market Geographical Outlook:

• Asia Pacific is witnessing exponential growth during the forecast period.

During the forecast period, the Asia-Pacific semiconductor back-end equipment market is anticipated to grow rapidly. Country-wise, the APAC semiconductor back-end equipment market has been segmented into China, Japan, South Korea, Taiwan, and others. Strategic investments from major domestic suppliers and the growth of the established semiconductor industry are expected to propel the market. As chip consumption rises, the Asia-Pacific semiconductor market is anticipated to more than triple in size from that of the Americas over the next four years.

Additionally, introducing 5G technology has increased demand for semiconductor chips in the region by boosting the market for equipment used in semiconductor manufacturing. It is predicted that 5G technology will significantly improve the digital infrastructure globally.

With the backing of $150 billion in funding, China is pursuing an ambitious semiconductor agenda. The nation wants to produce more chips and develop its own IC industry. Many Chinese businesses have invested in semiconductor foundries, which has heightened tensions in this vital industry where the most cutting-edge process technology is concentrated. China has made several announcements to bolster its semiconductor industry.

Moreover, the demand for back-end equipment is driven by the region's expanding semiconductor industry and growing capacity for chip production. China's tech sector wants to move up the global technology value chain by leveraging its dominant positions in electric vehicles, renewable energy, and telecommunications.

Additionally, the booming 5G infrastructure establishment, which requires high-end and precise semiconductor usage, has also paved the way for future market expansion. For instance, by the end of August 2024, China had more than 4.04 million 5G base stations, according to data from the Ministry of Industry and Information Technology. This number represented 32.1 percent of all mobile base stations in the country. In China, there are now 966 million 5G mobile users.

Further, the industry is currently concentrating on advanced semiconductors in addition to these sectors. The main forces for this shift are the memory market’s growth, active participation in the silicon carbide (SiC) race, improvements in advanced node manufacturing, and calculated investments in cutting-edge packaging and manufacturing machinery. The expanding foundry industry and investments in factories across China will also stimulate this market.

The back-end semiconductor industry has gained attention as a result of the increase in chip demand in the region's various markets. In the coming years, businesses that specialize in back-end processes will continue to make significant investments and technological advancements.

Semiconductor Back-end Equipment Market Key Launches:

• In October 2024, Rapidus Corporation, which is engaged in the research, development, design, production, and sales of next-generation logic semiconductors, announced that it would establish a clean room in Seiko Epson Corporation's Chitose, Hokkaido facility and open a semiconductor post-processing research-and-development (R&D) center named Rapidus Chiplet Solutions (RCS).
• In July 2024, Lam Research Corporation introduced ‘Lam Cryo 3.0,” which extended its 3D NAND Flash memory etching line-up. The new addition can build high-capacity 3D NAND flash memory for generative AI solutions.
• In 2024, Applied Materials announced plans to expand its global EPIC innovation platform by launching a new collaboration model with it. It is specifically designed to accelerate advanced chip packaging technologies.

Semiconductor Back-End Equipment Market Scope:

Report Metric	Details
Semiconductor Back-End Equipment Market Size in 2025	USD 11.301 billion
Semiconductor Back-End Equipment Market Size in 2030	USD 15.769 billion
Growth Rate	CAGR of 6.89%
Study Period	2020 to 2030
Historical Data	2020 to 2023
Base Year	2024
Forecast Period	2025 – 2030
Forecast Unit (Value)	USD Billion
Segmentation	Procedure Geography
Geographical Segmentation	Americas, Europe, Middle East, and Africa, Asia Pacific
List of Major Companies in the Semiconductor Back-End Equipment Market	ASML Holding N.V. Applied Materials Lam Research Tokyo Electron Limited Rapidus Corporation
Customization Scope	Free report customization with purchase

 

Semiconductor Back-End Equipment Market Segmentation:

• By Procedure
  • Wafer Testing
  • Bonding
  • Dicing
  • Metrology
  • Assembly Packaging
• By Geography
  • Americas
    • US
  • Europe, the Middle East, and Africa
    • Germany
    • Netherland
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

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1. Introduction

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base and Forecast Years Timeline

1.8. Key Benefits for the Stakeholders

2. Research Methodology  

2.1. Research Design

2.2. Research Process

2.3. Data Validation

3. Executive Summary

3.1. Key Findings

3.2. Analyst View

4. Market Dynamics

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Supplier

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

5. Semiconductor Back-end Equipment Market By Procedure

5.1. Introduction

5.2. Wafer Testing

5.3. Bonding

5.4. Dicing

5.5. Metrology

5.6. Assembly Packaging

6. Semiconductor Back-end Equipment Market By Geography 

6.1. Introduction

6.2. Americas

6.2.1. Procedure

6.2.2. By Country

6.2.2.1. United States

6.3. Europe Middle East and Africa

6.3.1. Procedure

6.3.2. By Country

6.3.2.1. United Kingdom

6.3.2.2. Germany 

6.3.2.3. Others

6.4. Asia Pacific

6.4.1. Procedure

6.4.2. By Country

6.4.2.1. China

6.4.2.2. Japan

6.4.2.3. Taiwan

6.4.2.4. South Korea

6.4.2.5. Others

7. Competitive Environment and Analysis

7.1. Major Players and Strategy Analysis

7.2. Emerging Players and Market Lucrativeness

7.3. Mergers, Acquisitions, Agreements, and Collaborations

7.4. Competitive Dashboard

8. Company Profiles

8.1. Applied Materials

8.2. Toshiba Corporation

8.3. Taiwan Semiconductor Manufacturing Company Limited

8.4. Kokusai Electric Corporation

8.5. Semiconductor Equipment Corp

8.6. Canon U.S.A., Inc.

8.7. Kanematsu Corporation

8.8. ASML Holding

8.9. Lam Research

8.10. S firm Applied Materials Inc (Tokyo Electron Limited)

8.11. KLA Corporation

8.12. Onto Innovation Inc

8.13. Teradyne Inc.

List of Tables

Table 1: Major Market Participants

Table 2: Recent Government Investments in Semiconductor Fabrication Facilities

Table 3: Advancements in Back-End Equipment Driven by Adoption of Advanced Packaging Technologies

Table 4: Recent Investments in Back-End Semiconductor Equipment for Advanced Packaging

Table 5: AI-driven Test and Inspection Technologies, Use Cases

Table 6:  Semiconductor Back-end Equipment Market, By Procedure, USD Billion, 2022 to 2030

Table 7: Semiconductor Back-end Equipment Market, By Geography, USD Billion, 2022 to 2030

Table 8: Americas Semiconductor Back-end Equipment Market, By Procedure, USD Billion, 2022 to 2030

Table 9: Americas Semiconductor Back-end Equipment Market, By Country, USD Billion, 2022 to 2030

Table 10: CHIPS and Science Act Manufacturing Incentives

Table 11: Investment by the US Company in Back-End Equipment

Table 12:  Europe, Middle East, and Africa Semiconductor Back-end Equipment Market, By Procedure, USD Billion, 2022 to 2030

Table 13:  Europe, Middle East, and Africa Semiconductor Back-end Equipment Market, By Country, USD Billion, 2022 to 2030

Table 14: Initiatives/ Policies/Investment by the German Government for the Semiconductor Industry

Table 15: European Commission State Aid Approval under the European Chips Act Communication

Table 16:  Asia Pacific Semiconductor Back-end Equipment Market, By Procedure, USD Billion, 2022 to 2030

Table 17:  Asia Pacific Semiconductor Back-end Equipment Market, By Country, USD Billion, 2022 to 2030

Table 18: Korea Government Investments

Table 19: Semiconductor Back-End Equipment Market, Strategy Analysis of Key Players

Table 20: Semiconductor Back-End Equipment Market, Mergers, Acquisitions, Agreements, and Collaborations

Table 21: Applied Materials Inc., Products and Services

Table 22: Lam Research, Products and Services

Table 23: Tokyo Electron Limited, Products and Services

Table 24: KLA Corporation, Products and Services

Table 25: Onto Innovation Inc., Products and Services

Table 26: Canon U.S.A., Inc., Products and Services

Table 27: Cohu Inc., Products and Services

Table 28: Yamaha Motor, Products and Services

Table 29: EV Group (EVG), Products and Services

Table 30: SUSS MicroTec SE, Products and Services

Table 31: ASML, Products and Services

Table 32: Kulicke & Soffa, Products and Services

Table 33: ASMT, Products and Services

Table 34: BE Semiconductor Industries N.V., Products and Services

Table 35: Disco Corporation, Products and Services

Table 36: Research Assumptions

List of Figures

Figure 1: Semiconductor Back-End Equipment Market, by Regions, 2024

Figure 2: Semiconductor Back-End Equipment Market Size, USD Billion, 2022 to 2030

Figure 3: Manufacturing Sector by Category, USA, US$ Billion, 2023

Figure 4: Semiconductor Back-End Equipment Market Segmentation

Figure 5: Growing Demand for Semiconductors - Driver Impact

Figure 6: Growth of Semiconductor Sales (2023-24) and Regional Growth Trends 2024

Figure 7: Year-End Back-End Equipment Forecast, US$ Billion, 2023 to 2026

Figure 8: Expansion of Semiconductor Manufacturing Facilities - Driver Impact

Figure 9: Adoption of Advanced Packaging Technologies - Driver Impact

Figure 10: Projected 5G Share of Global Mobile Data Traffic, 2024 and 2030

Figure 11: Higher Initial Investment and Operational Cost - Restraint Impact

Figure 12: Rising Opportunity in Advanced Packaging Equipment Demand - Market Opportunities

Figure 13: Expanding in AI-Driven Test and Inspection Solutions - Market Opportunities

Figure 14: Porter’s Five Forces Analysis: Bargaining Power of Suppliers

Figure 15: Porter’s Five Forces Analysis: Bargaining Power of Buyers

Figure16: Porter’s Five Forces Analysis: Threat of New Entrants 

Figure 17: Porter’s Five Forces Analysis: Threat of Substitutes

Figure 18: Porter’s Five Forces Analysis: Competitive Rivalry in the Industry

Figure 19: Porter’s Five Forces Analysis: Value Chain Analysis

Figure 20: Semiconductor Back-End Equipment Market Share (%), By Procedure, 2024 and 2030

Figure 21: Semiconductor Back-End Equipment Market Attractiveness, by Procedure, 2030

Figure 22: Semiconductor Back-end Equipment Market, By Procedure, Wafer Testing, USD Billion, 2022 to 2030

Figure 23: Global Semiconductor Sales, in USD Billions, in February 2025 and March 2025

Figure 24: Semiconductor Back-end Equipment Market, By Procedure, Bonding, USD Billion, 2022 to 2030

Figure 25: Global Electric Car Sales, in Million, in 2023 and 2024

Figure 26: Semiconductor Back-end Equipment Market, By Procedure, Dicing, USD Billion, 2022 to 2030

Figure 27: Domestic Production in Electronic Sector in India, in USD billion, in 2020-21 to 2023-24

Figure 28: Semiconductor Back-end Equipment Market, By Procedure, Metrology, USD Billion, 2022 to 2030

Figure 29: Semiconductor Back-end Equipment Market, By Procedure, Assembly Packaging, USD Billion, 2022 to 2030

Figure 30: Global Mobile Subscription by 5G Technology, in billion, in 2025, 2028 and 2030

Figure 31: Semiconductor Back-end Equipment Market, By Procedure, Others, USD Billion, 2022 to 2030

Figure 32: Semiconductor Back-End Equipment Market Share (%), By Geography, 2024

Figure 33: Semiconductor Back-End Equipment Market Attractiveness, By Geography, 2030

Figure 34: Americas Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 35: Americas Semiconductor Back-end Equipment Market Attractiveness, 2030

Figure 36: USA Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 37:  North American Growth in Semiconductor Equipment, US Billion, 2023 and 2024

Figure 38: Europe, Middle East and Africa Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 39: Europe, Middle East and Africa Semiconductor Back-End Equipment Market Share (%), By Country, 2022 and 2030

Figure 40: Europe, Middle East and Africa Semiconductor Back-End Equipment Market Attractiveness, 2030

Figure 41: German Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 42: Netherlands Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 43: New Electric Passenger Cars Registration in Netherlands, in units, in 2023 and 2024

Figure 44: EMEA (Others) Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 45: 5G Penetration Rate in Percent, in Italy, in  2024 and 2030

Figure 46: Asia Pacific Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 47: Asia Pacific Semiconductor back-end equipment Market Share (%), By Country, 2022 and 2030

Figure 48: Asia Pacific Semiconductor Back-End Equipment Market Attractiveness, 2030

Figure 49: China Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 50: New Energy vehicles (NEV) Sales in China, in Millions Units, in 2022, 2023, and 2024

Figure 51: Semiconductor Market, in USD Billions, China, 2023 and 2024

Figure 52: Japan Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 53: Semiconductor Sales, in USD Billions, Japan, 2020 and 2030

Figure 54: Taiwan Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 55: Semiconductor Industry NT$, in Taiwan,2023 and 2024

Figure 56: South Korea Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 57: Asia Pacific (Others) Semiconductor Back-end Equipment Market, USD Billion, 2022 to 2030

Figure 58: Semiconductor Back-End Equipment Market Share (2024)

Figure 59: Applied Materials Inc., Financials, Net Sales, Operating Income and Net Income 2021-2023

Figure 60: Applied Materials Inc., Financials, Sales by Segment, 2021-2023

Figure 61: Applied Materials Inc, Financials, Sales by Geography, 2021-2023

Figure 62: Applied Materials Inc., Key Developments

Figure 63: Lam Research., Financials, Net Sales, Gross Margin and Net Income 2022-2024

Figure 64: Lam Research, Financials, Sales by Segment, 2022-24

Figure 65: Lam Research., Key Developments

Figure 66: Tokyo Electron Limited, Financials, Net Sales, Operating Income and Net Income 2022-2024

Figure 67: Tokyo Electron Limited, Financials, Sales by Segment, 2021-23

Figure 68: Tokyo Electron Limited, Key Developments

Figure 69: KLA Corporation, Financials, Net Sales, Operating Income and Net Income 2022-2024

Figure 70: KLA Corporation, Financials, Sales by Segment, 2022-24

Figure 71: KLA Corporation, Financials, Sales by Geography, 2022-2024

Figure 72: KLA Corporation, Key Developments

Figure 73: Onto Innovation Inc., Financials, Revenue, Gross Profit Total and Net Income 2023-2024

Figure 74: Onto Innovation Inc., Financials, Sales by Segment, 2022-24

Figure 75: Onto Innovation Inc, Key Developments

Figure 76: Canon U.S.A., Financials, Net Sales, Operating Income and Net Income 2022-2024

Figure 77: Canon U.S.A, Financials, Sales by Segment, 2023-24

Figure 78: Canon U.S.A, Financials, Sales by Geography, 2023-2024

Figure 79: Canon U.S.A., Inc, Key Developments

Figure 80: Cohu Inc., Financials, Net Sales, Cost of Sales and Net Income 2022-2024

Figure 81: Cohu Inc, Financials, Sales by Geography, 2022-2024

Figure 82: Cohu, Key Developments

Figure 83: Yamaha Motor, Financials, Net Sales, Operating Income and Net Income 2023-2024

Figure 84: Yamaha Motor, Key Developments

Figure 85: EV Group (EVG), Key Developments

Figure 86: SUSS MicroTec SE, Financials, Net Sales, Operating Income and Net Income 2023 - 2024

Figure 87: SUSS MicroTec SE, Financials, Sales by Geography, 2023-2024

Figure 88: SUSS MicroTec SE, Key Developments

Figure 89: ASML, Financials, Net Sales, Gross Profit and Net Income 2023-2024

Figure 90: ASML, Financials, Sales by Segment, 2022-24

Figure 91: ASML, Financials, Sales by Geography, 2022-2024

Figure 92: ASML, Key Developments

Figure 93: Kulicke & Soffa, Financials, Net Sales, Operating Income and Net Income 2022-2024

Figure 94: Kulicke & Soffa, Financials, Sales by Segment, 2022-24

Figure 95: Kulicke & Soffa, Key Developments

Figure 96: ASMT, Financials, Net Sales, Operating Income and Net Income 2022-2024

Figure 97: ASMT, Financials, Sales by Segment, 2022-24

Figure 98: ASMT, Financials, Sales by Geography, 2022-2024

Figure 99: BE Semiconductor Industries N.V., Financials, 2022-2024

Figure 100: BE Semiconductor Industries N.V., Segment Sales, 2023-2024

Figure 101: BE Semiconductor Industries N.V., Geography, Financials, 2023-2024

Figure 102: BE Semiconductor Industries N.V., Key Developments

Figure 103: Disco Corporation, Financials, 2022-24

Figure 104: Disco Corporation, Key Developments

Applied Materials

Toshiba Corporation

Taiwan Semiconductor Manufacturing Company Limited

Kokusai Electric Corporation

Semiconductor Equipment Corp

Canon U.S.A., Inc.

Kanematsu Corporation

ASML Holding

Lam Research

S firm Applied Materials Inc (Tokyo Electron Limited)

KLA Corporation

Onto Innovation Inc

Teradyne Inc.