Semiconductor Packaging Cleaning Chemicals Market Size, Share, Opportunities, And Trends By Chemical Type (Acidic Cleaners, Alkaline Cleaners, Solvent Cleaners, Others), By Application (Wafer Cleaning, Package Cleaning, Interconnect Cleaning), By End-User (Foundries, OSATs, Equipment Manufacturers), And By Geography - Forecasts From 2025 To 2030

Semiconductor Packaging Cleaning Chemicals Market Size:

The semiconductor packaging cleaning chemicals market is projected to grow at a CAGR of 7.39% to increase from US$2.323 billion in 2025 to US$4.109 billion by 2030.

Semiconductor Packaging Cleaning Chemicals Market Trends:

The semiconductor packaging cleaning market is experiencing growth due to the expansion of the semiconductor market, driving the back-end packaging process, where these cleaning chemicals are critical for ensuring high yield and electrical performance of chips. The semiconductor industry’s growth and advancements in advanced packaging technologies, combined with stringent regulatory pressure and increasing demand for high-quality cleaning chemicals, are driving the market to ensure high chip yield and optimal electrical performance.

Factors driving growth in the semiconductor packaging cleaning chemicals market include advancements in the manufacturing of semiconductors, growing demand for high-purity materials, increasing sustainability, advancement of packaging technologies, and increased automation in the semiconductor manufacturing process.

Semiconductor Packaging Cleaning Chemicals Market Overview:

The semiconductor packaging cleaning chemicals market refers to the global industry involved in the production and supply of high-purity chemicals that are specifically used for cleaning semiconductor packages during the back-end of semiconductor manufacturing.

During the packaging process, including die attach, wire bonding, encapsulation, and final assembly, after the completion of the front-end process, these cleaning chemicals are used to remove contaminants, such as flux residues, particles, oxides, and organic materials. As semiconductor chip manufacturing is a highly precise process, any contaminants can directly affect yield, package reliability, and electrical performance. Thus, these cleaning chemicals are critical to ensuring high yield, reliable packaging, and optimal electrical functionality.

The global surge in demand for semiconductors driven by AI, 5G, IoT, electric vehicles, and advanced consumer electronics is increasing the need for reliable chip packaging, which in turn is driving demand for high-purity cleaning chemicals. The Semiconductor Industry Association, in its report, stated that global semiconductor sales accounted for $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. It has experienced the highest sales ever in 2024 and is projected to experience double-digit growth in 2025. Regionally, positive growth was observed across key markets, with semiconductor sales increasing in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%).

Its 2025 report states that global semiconductor sales were $57.0 billion during April 2025, an increase of 2.5% compared to the March 2025 total of $55.6 billion and 22.7% more than the April 2024 total of $46.4 billion. This unprecedented growth in sales volume and regional uptake is directly fueling the demand for semiconductor back-end processes, particularly assembly and packaging, which in turn is driving the need for advanced cleaning chemicals essential to ensure yield, reliability, and electrical performance.

Additionally, the semiconductor market is experiencing a shift towards advanced packaging such as 3D ICs, fan-out packaging, and system-in-package, as the demand for miniaturized chips is growing. For instance, in July 2024, ASMPT and IBM collaborated to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools. In April 2024, Omron Automation Americas launched VT-X850, a 3D CT X-Ray inspection system specifically designed to meet the needs of electric vehicle (EV) applications and other similar products. It has a high-powered 160 kV X-Ray tube enabling penetration of thick substrates and metal-encased packages.  Thus, the growth of advanced packaging is propelling the requirement for more rigorous and precise cleaning processes to avoid performance defects.

As fabs are pushing the demand for higher yield and performance, driving the market for advanced cleaning chemicals essential for defect-free packaging and electrical integrity.

Thus, the growth in the semiconductor industry, development in advanced packaging, and the demand for higher yield and electrical performance are driving the semiconductor packaging cleaning chemicals market. In addition, the regulations for the adoption of eco-friendly solutions are shifting the market towards new-generation, low-VOC, and non-toxic cleaning chemicals. For instance, the World Semiconductor Council, supported by the Semiconductor PFAS Consortium, officially phased out all intentional uses of PFOA and PFOS and their related compounds in semiconductor fabs by 2023. This is led by the Stockholm Convention’s inclusion of these substances under EU REACH Annexe XVII and UN POPs regulations.  These moves and regulations are phasing out the use of PFAS like PFOA and PFOS in packaging cleaning applications, leading the industry to move to low-VOC, PFAS-free alternatives.

The Semiconductor Packaging Cleaning Chemicals Market is moderately consolidated, with key players including DuPont de Nemours, Inc., BASF SE, Entegris, Inc., Shenzhen Capchem Technology Co., Ltd., Tokyo Ohka Kogyo Co., Ltd., Avantor, Inc., Mitsubishi Gas Chemical Company, Inc., and Kanto Chemical Co., Inc. dominating due to their extensive product portfolios, alongside the presence of smaller, niche players such as Enviro Tech International, Inc., Unibright Technology Co., Ltd., Consolidated Metal Technologies, Inc., LCY Chemical Corp., Sekisui Chemical Co., Ltd., Eastman Chemical Company, Kao Corporation, and Air Liquide S.A., who offer specialty chemicals or cater to specific market segments.

Semiconductor Packaging Cleaning Chemicals Market Growth Drivers:

• Advancements in Semiconductor Manufacturing

The relentless pursuit of miniaturization and enhanced performance in semiconductor devices requires increasingly stringent cleaning processes. As devices grow in complexity and smaller, more intricate components are included, the removal of even minute particles and contaminants is critical to achieve optimal device performance and yield.

By August 2024, companies in the semiconductor ecosystem announced more than 90 new manufacturing projects in the U.S. since CHIPS was first introduced in Congress, totaling nearly $450 billion in announced investments across 28 states.

• Advancements in Packaging Technologies 

Advanced packaging technologies, including 3D integration and fan-out packaging, have introduced new challenges and opportunities for cleaning chemicals. Cleaning solutions that can effectively remove contaminants from complex packaging structures while preserving the integrity of delicate interconnects are needed. The market for cleaning chemicals for semiconductor packaging is expanding rapidly due to the ongoing improvements in semiconductor packaging technologies. Cleaning requirements have increased significantly as the industry shifts from conventional packaging techniques to more intricate and compact packaging solutions, such as Fan-Out Wafer-Level Packaging (FOWLP), 3D Integrated Circuits (3D ICs), System-in-Package (SiP), Flip-Chip Packaging, and Through-Silicon Via (TSV) technology.

To meet the rapidly changing needs of modern electronics, such as smartphones, wearables, electric vehicles, 5G infrastructure, and high-performance computing, these next-generation packaging technologies are essential for enabling higher device performance, reduced form factors, lower power consumption, and increased interconnect density. However, there are several technical difficulties with the sophisticated semiconductor packing process, particularly for preserving the purity and cleanliness of the materials and surfaces used.

The tolerance for contamination is very low with smaller geometries, finer line widths, and thinner layers; even tiny particles, organic residues, or metallic impurities can cause major flaws, decreased device performance, or total product failure. The need for highly specialized, ultra-pure cleaning chemicals that can effectively remove post-etch residues, photoresist, and metal contaminants without harming delicate materials like copper interconnects, low-k dielectrics, and advanced polymer layers is because the cleaning step is now an essential part of the packaging process. Furthermore, the creation of specialized cleaning formulations that guarantee chemical compatibility and process safety while providing outstanding cleaning performance is necessary for incorporating novel materials and multi-layer configurations in modern packaging.

Since more intricate and precise manufacturing processes necessitate sophisticated cleaning solutions, the development of semiconductor packaging technologies directly contributes to the rise in sales of semiconductor packaging cleaning chemicals. China accounted for 29% of global sales in 2023, followed by the Americas (26%), Asia Pacific/ All Other countries (apart from China and Japan) (26%), Europe (11%), and Japan (9%). Estimates from the World Semiconductor Trade Statistics (WSTS) project that worldwide semiconductor industry sales will increase to $611 billion in 2024, a 16% increase compared to 2023.

Semiconductor Packaging Cleaning Chemicals Market Segmentation Analysis:

• By chemical type, acidic cleaners are anticipated to grow during the forecast period.

Acidic cleaners are highly versatile in removing a broad range of contaminants, including organic residues, metal oxides, and inorganic particles. This versatility makes them indispensable at various stages of the semiconductor manufacturing process. Moreover, advanced packaging technologies, such as 3D integration and fan-out packaging, require the careful removal of even the smallest contaminants. Acidic cleaners are important for the effective cleaning of these complex structures without damaging the fragile interconnects.

In addition to this, research and development in the semiconductor manufacturing sector are constantly bringing new and improved acidic cleaning solutions to the market. These improvements have resulted in better performance, better safety profiles, and less environmental impact, further solidifying the growth prospects of this segment.

• By chemical type, solvent cleaners are also gaining popularity

As vital tools for eliminating organic pollutants, photoresist residues, adhesives, flux, and other process-related impurities from semiconductor surfaces during packaging and assembly procedures, solvent cleaners are an essential component of the market for semiconductor packaging cleaning chemicals. The accuracy, efficacy, and compatibility of solvent cleaners have increased significantly as semiconductor packaging technologies progress toward finer geometries, higher connection densities, and the usage of delicate materials like copper and low-k dielectrics. In front-end and back-end packing processes, such as post-etch cleaning, photoresist stripping, flux removal, stencil cleaning, and degreasing, solvent cleaners are frequently utilized.

The quality and functionality of semiconductor devices depend on these cleaning procedures, particularly when using sophisticated packaging methods, such as Fan-Out Wafer-Level packaging (FOWLP), 3D Integrated Circuits (3D ICs), System-in-Package (SiP), and Flip-Chip Packaging. The need for high-performance solvent cleaners that minimize substrate damage and material compatibility problems while providing exceptional cleaning efficiency has increased due to the increasing complexity of chip designs. Furthermore, manufacturers are swiftly shifting toward low-toxicity, low-VOC, and environmentally friendly solvent formulations in response to growing regulatory pressure to minimize the use of dangerous chemicals like perfluorinated substances (PFAS), volatile organic compounds (VOCs), and chlorinated solvents.

PFC gases, such as C2F6 and CF4, are employed by semiconductor manufacturers as fluorine-generating sources for CVD chamber cleans because they are less poisonous, less corrosive, and nonflammable than many other alternatives. Fluorinated greenhouse gases (GHGs) have long atmospheric lifetimes and a high global warming potential (GWP) (for instance, C2F6 has a GWP100 of 12,400 and an atmospheric lifetime of 10,000 years; CF4 has a GWP100 of 7,380 and an atmospheric lifetime of 50,000 years). These factors have raised concerns.

This change is spurring innovation in the creation of sustainable cleaning solutions that satisfy performance and regulatory requirements, as well as bio-based solvents and aqueous-solvent blends. Furthermore, as the ability to manufacture semiconductors grows worldwide, new fabs and packaging facilities need to use enormous amounts of high-purity cleaning chemicals to keep their production environments free of defects, which directly raises the demand for solvent cleaners. Specialized solvent cleaners that can handle delicate substrates without leaving residues are further needed as yield improvement, process control, and advanced material compatibility become increasingly important.

• By application, wafer cleaning is anticipated to increase substantially during the projected period.

Cleaning wafers is a very important step in the semiconductor manufacturing process. Careful removal of contaminants from the wafer surface is crucial to achieve optimal device performance, yield, and reliability. Residual particles or impurities can significantly affect the functionality of the devices and cause defects.

Semiconductor devices become more complex, with components of smaller sizes, and their wafer-cleaning process demands more rigorous requirements. Such demands necessitate the use of highly effective cleaning chemicals to remove minute contaminants. Increased demand for high-performance devices across applications like smartphones, computers, and automotive electronics drives the requirement for more advanced semiconductor manufacturing processes, such as meticulous wafer cleaning.

Semiconductor Packaging Cleaning Chemicals Market Geographical Outlook:

• North America is forecasted to hold a major market share.

Several factors drive the North American semiconductor packaging cleaning chemicals market. The region has significant representation from major semiconductor manufacturing and research entities. This has resulted in a high demand for good-quality cleaning chemicals for this flourishing semiconductor industry in the region.

In line with this, BLS indicated that, as of the first quarter of 2020, there were 1,876 establishments in the semiconductor and related device manufacturing industry. That number increased to 2,545 establishments as of the first quarter of 2024.

The region is also at the forefront of developing and adopting advanced packaging technologies such as 3D integration and fan-out packaging. These complex packaging structures present unique challenges, requiring specialized cleaning solutions to ensure optimal performance and reliability. This increasing demand for advanced packaging solutions directly fuels the market for specialized cleaning chemicals.

Semiconductor Packaging Cleaning Chemicals Market Competitive Landscape:

• LCY
• Eastman
• Sekisui Chemical Co., Ltd.
• Mitsubishi Gas Chemical Company, Inc.

These companies are anticipated to dominate the market as they have a broad product portfolio, extensive research and development capabilities, and strong distribution networks.

Semiconductor Packaging Cleaning Chemicals Market Latest Developments:

• In November 2024, SCREEN Semiconductor Solutions Co., Ltd. completed the development of the SS-3200 for 200mm, a new model for 200mm wafers in its lineup of single wafer cleaning systems that use the scrubber method (spin scrubbers). With these systems, SCREEN SPE boasts the top global market share in the spin scrubber category.
• In August 2024, Veeco Instruments Inc. announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.

Semiconductor Packaging Cleaning Chemicals Market Scope:

Semiconductor packaging cleaning chemicals Market is analyzed into the following segments:

• By Chemical Type
  • Acidic Cleaners
  • Alkaline Cleaners
  • Solvent Cleaners
  • Others
• By Application
  • Wafer Cleaning
  • Package Cleaning
  • Interconnect Cleaning
• By End-User
  • Foundries
  • OSATs
  • Equipment Manufacturers
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • United Kingdom
    • Germany
    • France
    • Spain
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • UAE
    • Israel
    • Others
  • Asia Pacific
    • Japan
    • China
    • India
    • South Korea
    • Indonesia
    • Thailand
    • Others

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Page last updated on: September 4, 2025

1. Executive Summary

2. Market Snapshot

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. Business Landscape

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. Technological Outlook

5. Semiconductor Packaging Cleaning Chemicals Market By Chemical Type (2022-2030)

5.1. Introduction

5.2. Acidic Cleaners

5.3. Alkaline Cleaners

5.4. Solvent Cleaners

5.5. Others

6. Semiconductor Packaging Cleaning Chemicals Market By Application (2022-2030)

6.1. Introduction

6.2. Wafer Cleaning

6.3. Package Cleaning

6.4. Interconnect Cleaning

7. Semiconductor Packaging Cleaning Chemicals Market By End-User (2022-2030)

7.1. Introduction

7.2. Foundries

7.3. OSATs

7.4. Equipment Manufacturers

8. Semiconductor Packaging Cleaning Chemicals Market By Geography (2022-2030)

8.1. Introduction

8.2. Americas

8.2.1. USA

8.3. Europe, the Middle East and Africa

8.3.1. Germany

8.3.2. Netherlands

8.3.3. Others

8.4. Asia Pacific

8.4.1. China

8.4.2. Japan

8.4.3. Taiwan

8.4.4. South Korea 

8.4.5. Others

9. Competitive Environment and Analysis

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Competitive Dashboard

10. Company Profiles

10.1. Enviro Tech International, Inc. 

10.2. DuPont de Nemours, Inc.

10.3. Shenzhen Capchem Technology Co., Ltd. 

10.4. Unibright Technology Co., Ltd.

10.5. Consolidated Metal Technologies, Inc.

10.6. Tokyo Ohka Kogyo Co., Ltd.

10.7. Entegris, Inc.

10.8. LCY Chemical Corp.

10.9. Mitsubishi Gas Chemical Company, Inc.

10.10. Eastman Chemical Company

10.11. Kao Corporation

10.12. BASF SE

11. Appendix

11.1. Currency 

11.2. Assumptions

11.3. Base and Forecast Years Timeline

11.4. Key benefits for the stakeholders

11.5. Research Methodology 

11.6. Abbreviations 

Enviro Tech International, Inc. 

DuPont de Nemours, Inc.

Shenzhen Capchem Technology Co., Ltd. 

Unibright Technology Co., Ltd.

Consolidated Metal Technologies, Inc.

Tokyo Ohka Kogyo Co., Ltd.

Entegris, Inc.

LCY Chemical Corp.

Mitsubishi Gas Chemical Company, Inc.

Eastman Chemical Company

Kao Corporation

BASF SE

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