Semiconductor Dry Strip Equipment Market Size, Share, Opportunities, And Trends By Type (Element Semiconductor, Compound Semiconductor), By Application (Consumer Electronics, Automotive, Industrial, Others), And By Geography - Forecasts From 2023 To 2028

  • Published : Jun 2023
  • Report Code : KSI061617045
  • Pages : 130

The semiconductor dry strip equipment market is estimated to grow at a CAGR of 4.87% during the forecast period.

The industry encompasses a range of specialized machinery specifically designed for the dry stripping process in semiconductor manufacturing. This equipment plays a critical role in removing photoresists and other materials from semiconductor wafers during the fabrication process. It caters to the need for precise and efficient removal of photoresist and other films from the wafer surface, ensuring the overall quality and performance of the final semiconductor products. The primary end-users of semiconductor dry strip equipment are semiconductor manufacturers and foundries. These industry players rely on this equipment throughout various stages of semiconductor wafer fabrication.

The semiconductor dry strip equipment market is expected to witness significant growth in terms of market size. The increasing demand for advanced semiconductor devices and integrated circuits is a key driver for semiconductor dry strip equipment market expansion. This equipment plays a crucial role in removing unwanted materials and residues from semiconductor surfaces during the manufacturing process. With the growing complexity of semiconductor designs and the need for precise and efficient cleaning, the market for semiconductor dry strip equipment is poised for substantial growth. Promising market forecasts emphasize the optimistic perspective and plentiful growth prospects available to industry participants in this sector.

Drivers:

  • Increasing semiconductor production

The demand for semiconductor-based applications is on the rise. This increased demand leads to a higher volume of semiconductor production. Dry strip equipment plays a crucial role in removing unwanted materials from semiconductor wafers, ensuring the integrity and functionality of the final devices. The growing adoption of IoT devices, the expansion of mobile networks, the integration of advanced electronics in automobiles, and the demand for high-performance computing all contribute to the increased production of semiconductors. Consequently, the demand for dry strip equipment grows in parallel to support the expanding semiconductor production and meet market needs.

  • Rising demand for advanced semiconductor devices

The growing demand for advanced semiconductor devices is a significant driver for the semiconductor dry strip equipment market. The consumer electronics industry, including smartphones, tablets, wearable devices, and IoT applications, continues to evolve rapidly, driving the need for smaller, faster, and more efficient semiconductor components. These devices often require complex and miniaturized designs, demanding precise and efficient removal of materials during the fabrication process. As a result, semiconductor manufacturers rely on advanced dry strip equipment to achieve the necessary level of precision and ensure the quality of the final semiconductor products.

However, the semiconductor dry strip equipment market restraints include factors such as high initial costs, regulatory requirements, industry cyclicality, and technological challenges in developing equipment for new materials and architectures.

Growth in the compound semiconductor segment.

The compound semiconductor segment of the semiconductor dry strip equipment market holds a significant market share. There is a growing demand for gallium nitride (GaN) semiconductor dry strip equipment, driven by the increasing adoption of GaN technology in high-power applications such as power electronics, RF devices, and LEDs. As GaN technology expands across industries, there is a corresponding need for specialized dry strip equipment designed specifically for GaN semiconductor processing. This segment of the market is expected to witness substantial growth in response to the increasing GaN semiconductor market.

Additionally, the market potential for silicon carbide (SiC) semiconductor dry strip equipment is strong. SiC semiconductors offer superior properties for high-temperature, high-voltage, and high-frequency applications. With the demand for SiC devices rising in industries such as automotive, renewable energy, and power electronics, there is a growing need for specialized dry strip equipment tailored to SiC processing requirements. The SiC dry strip equipment market is expected to experience significant growth alongside the expanding SiC semiconductor market.

Geographical Insights:

Based on geography, the semiconductor dry strip equipment market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. North America, particularly the United States, is a prominent region in the semiconductor dry strip equipment market. Several key semiconductor manufacturers, including Intel, AMD, and Qualcomm, are based in North America. North America is at the forefront of technological advancements, such as the development of advanced memory technologies, 5G wireless communication, and artificial intelligence. These advancements create a need for specialized dry strip equipment capable of handling complex device structures and meeting stringent performance requirements.

Asia Pacific has a decent market share.

The market size in Asia Pacific can be attributed to factors such as favourable government policies, increasing investments in research and development, and a skilled workforce. The region's robust electronics manufacturing ecosystem, driven by the demand for consumer electronics, automotive electronics, and mobile devices, fuels the need for semiconductor dry strip equipment. In South Korea, the government's "Semiconductor Industry Promotion Plan" provides financial support and incentives to enhance the country's semiconductor sector. Japan's "Rebirth of Japan's Electronics Industry" initiative supports the semiconductor industry through research investment and innovation promotion. These policies aim to strengthen the semiconductor industry in South Korea, Taiwan, and Japan.

Semiconductor dry strip equipment market offerings:

  • Kao CLEANTHROUGH A-06: A fast-acting dry film stripper that removes dry film quickly, increasing productivity and reducing the need for new equipment investment.
  • Kao CLEANTHROUGH A-19: An amine-free dry film stripper that improves stripping performance without adding to the environmental load. It does not contain amines or toxic substances, reducing the impact on wastewater.
  • Lam’s GAMMA® Dry Strip System: This system provides efficient and precise photoresist and residue removal for various semiconductor processes. It ensures minimal impact on feature shapes and device materials, offering residue-free results with high throughput. The system is designed to address the challenges of advanced technology nodes while delivering excellent performance and cost-effectiveness.

Key developments.

  • In 2022, SK, one of the world's leading semiconductor photoresist cleaning equipment providers, released a localized dry bevel etcher called "Bevel Etcher". PSK successfully developed the technology by leveraging its expertise in dry strip equipment and aims to enhance semiconductor productivity through precise control of the wafer edge etching process. The introduction of the bevel etcher reflected PSK's strategic expansion into the semiconductor etching field, complementing their existing product portfolio.
  • In December 2021, ULVAC Technologies expanded the processing capability of its Optima line of dry strip tools by incorporating microwave frequency plasma source technology. This addition enhanced the Optima platform, which was originally designed for high throughput and reliability using an inductively coupled plasma (ICP) source. The microwave source option expands the range of process chemistries, enabling low-temperature polymer removal and reduced oxidation of material substrates. The Optima tool, available with either microwave or ICP source options, supports high-volume production and can replace multiple legacy systems.

Semiconductor Dry Strip Equipment Market Scope:

 

Report Metric Details
Growth Rate CAGR of 4.87% from 2021 to 2028
Base Year 2021
Forecast Period 2023 – 2028
Forecast Unit (Value) USD Billion
Segments Covered Type, Application, and Geography
Regions Covered North America, South America, Europe, Middle East and Africa, Asia Pacific
Companies Covered Applied Materials Inc., Axcelis Technologies Inc., PSK Inc, Lam Research Corp.
Customization Scope Free report customization with purchase

 

Market Segments 

  • BY TYPE
    • Element Semiconductor
    • Compound Semiconductor
  • BY APPLICATION
    • Consumer Electronics
    • Automotive
    • Industrial
    • Others
  • BY GEOGRAPHY
    • North America
      • USA
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
      • Others
    • Europe
      • Germany
      • France
      • United Kingdom
      • Spain
      • Others
    • Middle East And Africa
      • Saudi Arabia
      • UAE
      • Israel
      • Others
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Indonesia
      • Taiwan
      • Others

Frequently Asked Questions (FAQs)

2021 has been taken as the base year in the semiconductor dry strip equipment market.
Prominent key market players in the semiconductor dry strip equipment market include Applied Materials Inc., Axcelis Technologies Inc., PSK Inc, and Lam Research Corp., among others.
The semiconductor dry strip equipment market has been segmented by type, application, and geography.
The increasing demand for advanced semiconductor devices and integrated circuits is a key driver for the semiconductor dry strip equipment market growth.
North America is anticipated to hold a significant share of the semiconductor dry strip equipment market.

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Force Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET, BY TYPE

5.1. Introduction

5.2. Element Semiconductor

5.3. Compound Semiconductor

6. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET, BY APPLICATION

6.1. Introduction

6.2. Consumer Electronics

6.3. Automotive

6.4. Industrial

6.5. Others

7. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET, BY GEOGRAPHY

7.1. Introduction 

7.2. North America

7.2.1. USA

7.2.2. Canada

7.2.3. Mexico

7.3. South America

7.3.1. Brazil

7.3.2. Argentina

7.3.3. Others

7.4. Europe

7.4.1. Germany

7.4.2. France

7.4.3. United Kingdom

7.4.4. Spain

7.4.5. Others

7.5. Middle East And Africa

7.5.1. Saudi Arabia

7.5.2. UAE

7.5.3. Israel

7.5.4. Others

7.6. Asia Pacific

7.6.1. China

7.6.2. Japan

7.6.3. India

7.6.4. South Korea

7.6.5. Indonesia

7.6.6. Taiwan

7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

8.1. Major Players and Strategy Analysis

8.2. Emerging Players and Market Lucrativeness

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Vendor Competitiveness Matrix

9. COMPANY PROFILES

9.1. Applied Materials Inc.

9.2. Axcelis Technologies Inc.

9.3. PSK Inc

9.4. Lam Research Corp.


Applied Materials Inc.

Axcelis Technologies Inc.

PSK Inc

Lam Research Corp.